Patents by Inventor Hsuch-Chung Chen

Hsuch-Chung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipation structure and method thereof
    Publication number: 20060125090
    Abstract: A semiconductor structure and method for dissipating heat away from a semiconductor device having a plurality of power lines is provided. The semiconductor structure includes a semiconductor substrate and a plurality of interconnect structures disposed on the substrate and in contact therewith and extending through the semiconductor device, the interconnect structures for dissipating heat to the substrate. Each of the plurality of interconnect structures comprises at least one via stack.
    Type: Application
    Filed: January 24, 2006
    Publication date: June 15, 2006
    Inventors: Hsuch-Chung Chen, Yi-Lung Cheng, Hsien-Wei Chen, Shin-Puu Jeng
  • Heat dissipation structure and method thereof
    Publication number: 20050236716
    Abstract: A semiconductor structure and method for dissipating heat away from a semiconductor device having a plurality of power lines is provided. The semiconductor structure includes a semiconductor substrate and a plurality of interconnect structures disposed on the substrate and in contact therewith and extending through the semiconductor device, the interconnect structures for dissipating heat to the substrate. Each of the plurality of interconnect structures comprises at least one via stack.
    Type: Application
    Filed: April 22, 2004
    Publication date: October 27, 2005
    Inventors: Hsuch-Chung Chen, Yi-Lung Cheng, Hsien-Wei Chen, Shin-Puu Jeng