Patents by Inventor Hsueh Chen Hung

Hsueh Chen Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device housings with patterned electrolytic plating layers
    Patent number: 11910538
    Abstract: In one example, an electronic device housing may include a substrate, an insulating adhesive layer formed on a surface of the substrate, a patterned electroless plating layer formed on the insulating adhesive layer, and a patterned electrolytic plating layer formed on the patterned electroless plating layer.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: February 20, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Yi-Chen Chen, Kun Cheng Tsai, Kuan-Ting Wu, Ying-Hung Ku, Hsueh Chen Hung
  • ELECTRONIC DEVICE HOUSINGS WITH PATTERNED ELECTROLYTIC PLATING LAYERS
    Publication number: 20220167505
    Abstract: In one example, an electronic device housing may include a substrate, an insulating adhesive layer formed on a surface of the substrate, a patterned electroless plating layer formed on the insulating adhesive layer, and a patterned electrolytic plating layer formed on the patterned electroless plating layer.
    Type: Application
    Filed: August 8, 2019
    Publication date: May 26, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Yi-Chen Chen, Kun Cheng Tsai, Kuan-Ting Wu, Ying-Hung Ku, Hsueh Chen Hung
  • BODY PANELS WITH CONNECTORS
    Publication number: 20220163998
    Abstract: Examples of body panels with connectors are described herein. In an example, a body panel of a portable electronic device may include a connector affixed thereto, in an assembled state of the body panel on the portable electronic device, the connector may be positioned between a battery and a motherboard of the portable electronic device. The connector may electrically couple the battery with the motherboard, in the assembled state.
    Type: Application
    Filed: August 12, 2019
    Publication date: May 26, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Cheng Kai Chen, Chia Wei Ting, Yi Chen Chen, Kun Cheng Tsai, Ying Hung Ku, Hsueh Chen Hung