Patents by Inventor HSUEH-CHENG HSIEH

HSUEH-CHENG HSIEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Probe apparatus
    Patent number: 11579170
    Abstract: The present invention provides a probe apparatus, which comprises a signal transmission device, a probe, and a bottom fixing device. The signal transmission device includes a first transmission part and a second transmission part. An end of the probe is connected electrically below the second transmission part. The bottom fixing device is disposed below the signal transmission device. An end of the bottom fixing device includes a first penetrating hole and a first recess is disposed below the end. The probe passes through the first penetrating hole of the bottom fixing device. The probe is located in the first recess. The bottom fixing device reinforces the mechanical strength of the signal transmission device so that the width of the signal transmission device can be reduced. Thereby, the benefit of high-density arrangement of the probe apparatus can be achieved.
    Type: Grant
    Filed: August 4, 2021
    Date of Patent: February 14, 2023
    Assignee: Chroma Ate Inc.
    Inventors: Chin-Yuan Chang, Chun-Hao Hu, Hsueh-Cheng Hsieh, Ming-Hui Chen
  • PROBE APPARATUS
    Publication number: 20220178967
    Abstract: The present invention provides a probe apparatus, which comprises a signal transmission device, a probe, and a bottom fixing device. The signal transmission device includes a first transmission part and a second transmission part. An end of the probe is connected electrically below the second transmission part. The bottom fixing device is disposed below the signal transmission device. An end of the bottom fixing device includes a first penetrating hole and a first recess is disposed below the end. The probe passes through the first penetrating hole of the bottom fixing device. The probe is located in the first recess. The bottom fixing device reinforces the mechanical strength of the signal transmission device so that the width of the signal transmission device can be reduced. Thereby, the benefit of high-density arrangement of the probe apparatus can be achieved.
    Type: Application
    Filed: August 4, 2021
    Publication date: June 9, 2022
    Inventors: CHIN-YUAN CHANG, CHUN-HAO HU, HSUEH-CHENG HSIEH, MING-HUI CHEN