Abstract: An apparatus for semiconductor wafer transfer comprises a first region for placement of a pod, a second region for placement of a cassette, an unloading mechanism, and a transferring mechanism for transferring wafers in the unloaded pod to the cassette horizontally. In an embodiment, the pod is unloaded by lifting the housing of the pod, and preferably the apparatus for movement of semiconductor wafers further comprises a carrying mechanism for moving the cassette toward the pod, so that the cassette can be closer to the pod for smoothing wafer transfer.

Abstract: An apparatus for semiconductor wafer transfer comprises a first region for placement of a pod, a second region for placement of a cassette, an unloading mechanism, and a transferring mechanism for transferring wafers in the unloaded pod to the cassette horizontally. In an embodiment, the pod is unloaded by lifting the housing of the pod, and preferably the apparatus for movement of semiconductor wafers further comprises a carrying mechanism for moving the cassette toward the pod, so that the cassette can be closer to the pod for smoothing wafer transfer.

Abstract: A dynamic-capacity-demand-forecast system in the manufacture of semiconductor integrated circuits includes several steps. N types of products and m types of processing steps are in a processing line. The turn ratio of each products at each stages on a specified working day is calculated and the work-in-process (WIP) of every product at each stages on the same day is determined. According to these two numbers, the WIP on the next working day can be calculated, and then the move on the next working day is determined. Using this formula, the move of each product at each stage in future is obtained. Also, the summation the moves of all products at all stages on a working day are equal to, the capacity demand of the processing line on that day. The quantity of the throughput of the wafers may thus be determined and the supervisor can decide how to vary the parameters of the processing line.

Abstract: A visualizing method for the working condition of the semiconductor's manufacturing machines is disclosed. Firstly, the datas of different stages in a processing line are collected from the key-stage report of the processing line. The datas are “MAIN”, “MRUN”, “AFTER” and “PRE”, meaning the working condition of the stage. Every stage has a group of data. Specified stage-pairs in the processing line are determined. These pairs are photolithography and etching, photolithography and implanting and others. The data of each stage-pair is sequentially put in a bar chart. Then the pairs are sequentially arranged in the order of the processing line. One pair has a supplied stage and a requested stage. From the bar chart, supervisors of the processing line know the condition and the priority of every pair, and the relationship between the supplied stage and requested stage.