Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.

Abstract: Methods and apparatus for finishing an edge of a glass sheet are described. The edge of the glass sheet is finished using a grinding wheel mounted on one end of a spindle, the grinding wheel having a peripheral edge that contacts the edge of the glass sheet during the grinding. The edge of the glass sheet is further finished by polishing the edge of the glass sheet with a polishing wheel mounted on one end of a spindle, the polishing wheel having an end face which contacts the glass edge during polishing.

Abstract: An apparatus for cleaning a glass sheet is provided. The apparatus includes a brushing device including a head and a plurality of bristles, each bristle having a first end attached to the head and a second end opposing the first end. The second ends contact an edge of the glass sheet during cleaning of the glass sheet. Methods for cleaning glass sheets are also provided.

Abstract: An apparatus and method for cleaning a glass substrate is disclosed, the apparatus including a shroud assembly arranged along a conveyance path of a glass substrate such that an opening of shroud portion of the shroud assembly is adjacent the glass substrate. A nozzle assembly contained within a hollow interior space of the shroud assembly rotates while directing a jet of gas at the glass substrate, dislodging particulate. A vacuum is applied to a second interior hollow space defined by a skirt portion extending around the shroud, thereby removing the dislodged particulate. A second vacuum is applied to a back portion of the shroud to remove particulate accumulated in the shroud. The apparatus may further include a gas knife arranged adjacent the shroud assembly and a vacuum channel arranged below the shroud assembly.

Abstract: The present disclosure provides an illumination device. The illumination device includes a cap structure. The cap structure is partially coated with a reflective material operable to reflect light. The illumination device includes one or more lighting-emitting devices disposed within the cap structure. The light-emitting devices may be light-emitting diode (LED) chips. The illumination device also includes a thermal dissipation structure. The thermal dissipation structure is coupled to the cap structure in a first direction. The thermal dissipation structure and the cap structure have a coupling interface. The coupling interface extends in a second direction substantially perpendicular to the first direction. The thermal dissipation structure has a portion that intersects the coupling interface at an angle. The angle is in a range from about 60 degrees to about 90 degrees according to some embodiments.

Abstract: An apparatus for cleaning a glass sheet moving along a conveyed direction is disclosed herein. The apparatus comprises a first plurality of spraying devices coupled to a water supply and positioned away from a first surface of the glass sheet in a first angle measured from the first surface of the glass sheet, and a control unit configured to supply water from the water supply into the first plurality of spraying devices such that the first plurality of spraying devices spray water from the water supply in a first plurality of spraying sections at the first angle over an edge of the glass sheet, thereby forming a first cleaning zone on the first surface of the glass sheet.

Abstract: The present disclosure involves a street light. The street light includes a base, a lamp post coupled to the base, and a lamp head coupled to the lamp post. The lamp head includes a housing and a plurality of LED light modules disposed within the housing. The LED light modules are separate and independent from each other. Each LED light module includes an array of LED that serve as light sources for the lamp. Each LED light module also includes a heat sink that is thermally coupled to the LED. The heat sink is operable to dissipate heat generated by the LED during operation. Each LED light module also includes a thermally conductive cover having a plurality of openings. Each LED is aligned with and disposed within a respective one of the openings.

Abstract: The present disclosure provides an illumination device. The illumination device comprises a light-emitting diode (LED) device on a substrate, a heat sink and a cap. The heat sink is thermally connected to the LED device. The cap is secured over the substrate and covering the LED device. The cap includes a coating material having diffusion and reflection characteristics, and the coating material is free of being in direct contact with the LED device. The coating material is applied on a first portion of an inner surface of the cap, but not on a second portion of the inner surface of the cap.

Abstract: A light emitting diode (LED) carrier assembly includes an LED die mounted on a silicon submount, a middle layer that is thermally conductive and electrically isolating disposed below the silicon submount, and a printed circuit board (PCB) disposed below the middle layer. The middle layer is bonded with the silicon submount and the PCB.

Abstract: The present disclosure provides a lighting instrument. The lighting instrument includes a recessed light fixture, for example a troffer light or a batten light. The light fixture includes a plurality of light-emitting diode (LED) devices located on a board. The light fixture also includes a diffuser cap located on the board and housing the LED devices therein. The diffuser cap includes a plurality of coating regions. Each coating region is coated by a film containing white particles. The white particles can reflect and diffuse light emitted by the LED devices. The film in each coating region has a different white particle concentration level than other coating regions.

Abstract: The present disclosure involves a street light. The street light includes a base, a lamp post coupled to the base, and a lamp head coupled to the lamp post. The lamp head includes a housing and a plurality of LED light modules disposed within the housing. The LED light modules are separate and independent from each other. Each LED light module includes an array of LED that serve as light sources for the lamp. Each LED light module also includes a heat sink that is thermally coupled to the LED. The heat sink is operable to dissipate heat generated by the LED during operation. Each LED light module also includes a thermally conductive cover having a plurality of openings. Each LED is aligned with and disposed within a respective one of the openings.

Abstract: The present disclosure provides an illumination device. The illumination device includes a cap structure. The cap structure is partially coated with a reflective material operable to reflect light. The illumination device includes one or more lighting-emitting devices disposed within the cap structure. The light-emitting devices may be light-emitting diode (LED) chips. The illumination device also includes a thermal dissipation structure. The thermal dissipation structure is coupled to the cap structure in a first direction. The thermal dissipation structure and the cap structure have a coupling interface. The coupling interface extends in a second direction substantially perpendicular to the first direction. The thermal dissipation structure has a portion that intersects the coupling interface at an angle. The angle is in a range from about 60 degrees to about 90 degrees according to some embodiments.

Abstract: The present disclosure involves a street light. The street light includes a base, a lamp post coupled to the base, and a lamp head coupled to the lamp post. The lamp head includes a housing and a plurality of LED light modules disposed within the housing. The LED light modules are separate and independent from each other. Each LED light module includes an array of LED that serve as light sources for the lamp. Each LED light module also includes a heat sink that is thermally coupled to the LED. The heat sink is operable to dissipate heat generated by the LED during operation. Each LED light module also includes a thermally conductive cover having a plurality of openings. Each LED is aligned with and disposed within a respective one of the openings.

Abstract: The present disclosure provides an illumination device. The illumination device includes a cap structure. The cap structure is partially coated with a reflective material operable to reflect light. The illumination device includes one or more lighting-emitting devices disposed within the cap structure. The light-emitting devices may be light-emitting diode (LED) chips. The illumination device also includes a thermal dissipation structure. The thermal dissipation structure is coupled to the cap structure in a first direction. The thermal dissipation structure and the cap structure have a coupling interface. The coupling interface extends in a second direction substantially perpendicular to the first direction. The thermal dissipation structure has a portion that intersects the coupling interface at an angle. The angle is in a range from about 60 degrees to about 90 degrees according to some embodiments.

Abstract: The present disclosure provides a lighting instrument. The lighting instrument includes a recessed light fixture, for example a troffer light or a batten light. The light fixture includes a plurality of light-emitting diode (LED) devices located on a board. The light fixture also includes a diffuser cap located on the board and housing the LED devices therein. The diffuser cap includes a plurality of coating regions. Each coating region is coated by a film containing white particles. The white particles can reflect and diffuse light emitted by the LED devices. The film in each coating region has a different white particle concentration level than other coating regions.

Abstract: The present disclosure relates to light emitting diode (LED) devices and methods for fabricating the same. An LED device includes a housing adapted to combine a heat sink with a vapor chamber to form an enclosed space interposed therebetween. The LED device includes light emitting diode modules attached to the housing adjacent to the vapor chamber. The vapor chamber is adapted to uniformly disperse heat generated from the LED modules within the enclosed space to form a uniform temperature field on the heat sink to thereby provide effective heat dissipation.

Abstract: The present disclosure involves a street light. The street light includes a base, a lamp post coupled to the base, and a lamp head coupled to the lamp post. The lamp head includes a housing and a plurality of LED light modules disposed within the housing. The LED light modules are separate and independent from each other. Each LED light module includes an array of LED that serve as light sources for the lamp. Each LED light module also includes a heat sink that is thermally coupled to the LED. The heat sink is operable to dissipate heat generated by the LED during operation. Each LED light module also includes a thermally conductive cover having a plurality of openings. Each LED is aligned with and disposed within a respective one of the openings.

Abstract: The present disclosure provides an illumination device. The illumination device includes a cap structure. The cap structure is partially coated with a reflective material operable to reflect light. The illumination device includes one or more lighting-emitting devices disposed within the cap structure. The light-emitting devices may be light-emitting diode (LED) chips. The illumination device also includes a thermal dissipation structure. The thermal dissipation structure is coupled to the cap structure in a first direction. The thermal dissipation structure and the cap structure have a coupling interface. The coupling interface extends in a second direction substantially perpendicular to the first direction. The thermal dissipation structure has a portion that intersects the coupling interface at an angle. The angle is in a range from about 60 degrees to about 90 degrees according to some embodiments.

Abstract: The present disclosure provides an illumination device. The illumination device includes a light emitting device (LED) on a substrate. A heat sink is thermally connected to the LED device. A cap is secured over the substrate and covers the LED device. The cap includes a coating material that comprises both diffusion and reflection characteristics.

Abstract: A light emitting diode (LED) carrier assembly includes an LED die mounted on a silicon submount, a middle layer that is thermally conductive and electrically isolating disposed below the silicon submount, and a printed circuit board (PCB) disposed below the middle layer. The middle layer is bonded with the silicon submount and the PCB.