Patents by Inventor Hsueh-Lei WANG

Hsueh-Lei WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEMS AND METHODS FOR DIE CONTAINER WAREHOUSING
    Publication number: 20220262656
    Abstract: In an embodiment, a system includes: a warehousing apparatus configured to interface with a semiconductor die processing tool configured to process a semiconductor die singulated from a wafer, wherein the semiconductor die processing tool comprise an in-port and an out-port, wherein the warehousing apparatus is configured to: move a first die vessel that contains the semiconductor die to the in-port from a first die vessel container, wherein the first die vessel container is configured to house the first die vessel; move the first die vessel from the in-port to a buffer region; and move a second die vessel from the buffer region to the out-port.
    Type: Application
    Filed: May 5, 2022
    Publication date: August 18, 2022
    Inventors: Tsung-Sheng KUO, Chih-Hung HUANG, Hsueh-Lei WANG, Yang-Ann CHU, Hsuan LEE, Jiun-Rong PAI
  • Systems and methods for die container warehousing
    Patent number: 11348816
    Abstract: In an embodiment, a system includes: a warehousing apparatus configured to interface with a semiconductor die processing tool configured to process a semiconductor die singulated from a wafer, wherein the semiconductor die processing tool comprise an in-port and an out-port, wherein the warehousing apparatus is configured to: move a first die vessel that contains the semiconductor die to the in-port from a first die vessel container, wherein the first die vessel container is configured to house the first die vessel; move the first die vessel from the in-port to a buffer region; and move a second die vessel from the buffer region to the out-port.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: May 31, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Sheng Kuo, Chih-Hung Huang, Hsueh-Lei Wang, Yang-Ann Chu, Hsuan Lee, Jiun-Rong Pai
  • SYSTEMS AND METHODS FOR DIE CONTAINER WAREHOUSING
    Publication number: 20200043758
    Abstract: In an embodiment, a system includes: a warehousing apparatus configured to interface with a semiconductor die processing tool configured to process a semiconductor die singulated from a wafer, wherein the semiconductor die processing tool comprise an in-port and an out-port, wherein the warehousing apparatus is configured to: move a first die vessel that contains the semiconductor die to the in-port from a first die vessel container, wherein the first die vessel container is configured to house the first die vessel; move the first die vessel from the in-port to a buffer region; and move a second die vessel from the buffer region to the out-port.
    Type: Application
    Filed: July 22, 2019
    Publication date: February 6, 2020
    Inventors: Tsung-Sheng KUO, Chih-Hung Huang, Hsueh-Lei Wang, Yang-Ann Chu, Hsuan Lee, Jiun-Rong Pai
  • Method for cleaning load port of wafer processing apparatus
    Patent number: 10161033
    Abstract: A cleaning module adapted for cleaning a load port of a processing apparatus in semiconductor fabrication is provided. The cleaning module includes a housing having at least one opening formed on a bottom wall panel of the housing. The cleaning module further includes a filter unit positioned in the housing. The leaning module also includes a driving assembly. The driving assembly is arranged to correspond to the opening and positioned in the housing. The driving assembly is used to create an air flow from outside of the housing via the opening to the filter unit. The filter unit is used to separate particles or contaminants from the air flow.
    Type: Grant
    Filed: August 21, 2015
    Date of Patent: December 25, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsueh-Lei Wang, Jen-Ti Wang, Ting-Wei Wang, Wen-Chieh Tsou
  • METHOD FOR CLEANING LOAD PORT OF WAFER PROCESSING APPARATUS
    Publication number: 20170049284
    Abstract: A cleaning module adapted for cleaning a load port of a processing apparatus in semiconductor fabrication is provided. The cleaning module includes a housing having at least one opening formed on a bottom wall panel of the housing. The cleaning module further includes a filter unit positioned in the housing. The leaning module also includes a driving assembly. The driving assembly is arranged to correspond to the opening and positioned in the housing. The driving assembly is used to create an air flow from outside of the housing via the opening to the filter unit. The filter unit is used to separate particles or contaminants from the air flow.
    Type: Application
    Filed: August 21, 2015
    Publication date: February 23, 2017
    Inventors: Hsueh-Lei WANG, Jen-Ti WANG, Ting-Wei WANG, Wen-Chieh TSOU