Patents by Inventor Hsueh-Lung Cheng
Hsueh-Lung Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240071998Abstract: A method of packaging a semiconductor includes: positioning first and second semiconductor dies by one another on a carrier substrate, wherein first and second zones zone are defined with respect to the first die and third and fourth zones are defined with respect to the second die; forming first vias in the first zone, the first vias having a first size; forming second vias in the second zone, the second vias having a second size different from the first; forming third vias in the third zone, the third vias having a third size; forming fourth vias in the fourth zone, the fourth vias having a fourth size different from the third; and electrically connecting the first and second dies with an interconnection die such that electrical signals are exchangeable therebetween.Type: ApplicationFiled: August 23, 2022Publication date: February 29, 2024Inventors: Li-Hsien Huang, Hsueh-Lung Cheng, Yao-Chun Chuang, Yinlung Lu
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Publication number: 20180098460Abstract: A liquid cooling heat dissipation module adapted to be disposed on a heat source of a motherboard is provided. The liquid cooling heat dissipation module includes a heat conducting member, a first tank, a pump and a first agitating member. The heat conducting member is adapted to be thermally coupled to the heat source. The first tank is filled with cooling liquid, and the cooling liquid thermally couples with the heat conducting member. The pump is connected through with the first tank to drive the cooling liquid to flow along a direction. The first agitating member is disposed on a flowing path of the cooling liquid so as to homogenize a temperature of the cooling liquid.Type: ApplicationFiled: November 25, 2016Publication date: April 5, 2018Applicant: MSI Computer (Shenzhen) Co., LtdInventors: Li-Li Ko, Yi-Di Huang, Hung Chang, Min-Lang Chen, Hsueh-Lung Cheng
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Patent number: 9839157Abstract: A liquid cooling apparatus includes a heat exchange module and a cooling module. The heat exchange module includes a liquid outlet and a liquid outlet. The cooling module includes a first body, a second body, a first cooling component and a cooling duct. The first body is connected to the liquid outlet. The second body is connected to the liquid outlet, and the first body is disposed above the second body. The first cooling component is disposed between the first body and the second body. The cooling duct is connected to the first body and the second body, and the cooling duct is in thermal contact with the first cooling component.Type: GrantFiled: March 20, 2015Date of Patent: December 5, 2017Assignee: MSI Computer (Shenzhen) Co., Ltd.Inventors: Hung Chang, Min-Lang Chen, Hsueh-Lung Cheng
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Patent number: 9812416Abstract: A semiconductor arrangement and method of formation are provided. The semiconductor arrangement includes a metal trace under at least a first dielectric layer and a second dielectric layer. The metal trace is connected to a ball connection by a first via in the first dielectric layer and second via in the second dielectric layer. The metal trace is connected to a test pad at a connection point, where the connection point is under the first dielectric layer. The metal trace under at least the first dielectric layer and the second dielectric layer has increased stability and decreased susceptibility to cracking in least one of the ball connection, the connection point, the first via or the second via as compared to a metal trace that is not under at least a first dielectric layer and a second dielectric layer.Type: GrantFiled: May 8, 2017Date of Patent: November 7, 2017Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Jiun Yi Wu, Hsueh-Lung Cheng, Shou-Yi Wang
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Publication number: 20170243842Abstract: A semiconductor arrangement and method of formation are provided. The semiconductor arrangement includes a metal trace under at least a first dielectric layer and a second dielectric layer. The metal trace is connected to a ball connection by a first via in the first dielectric layer and second via in the second dielectric layer. The metal trace is connected to a test pad at a connection point, where the connection point is under the first dielectric layer. The metal trace under at least the first dielectric layer and the second dielectric layer has increased stability and decreased susceptibility to cracking in least one of the ball connection, the connection point, the first via or the second via as compared to a metal trace that is not under at least a first dielectric layer and a second dielectric layer.Type: ApplicationFiled: May 8, 2017Publication date: August 24, 2017Inventors: Jiun Yi WU, Hsueh-Lung CHENG, Shou-Yi WANG
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Patent number: 9646928Abstract: A semiconductor arrangement and method of formation are provided. The semiconductor arrangement includes a metal trace under at least a first dielectric layer and a second dielectric layer. The metal trace is connected to a ball connection by a first via in the first dielectric layer and second via in the second dielectric layer. The metal trace is connected to a test pad at a connection point, where the connection point is under the first dielectric layer. The metal trace under at least the first dielectric layer and the second dielectric layer has increased stability and decreased susceptibility to cracking in least one of the ball connection, the connection point, the first via or the second via as compared to a metal trace that is not under at least a first dielectric layer and a second dielectric layer.Type: GrantFiled: March 13, 2014Date of Patent: May 9, 2017Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Jiun Yi Wu, Hsueh-Lung Cheng, Shou-Yi Wang
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Publication number: 20160205807Abstract: A liquid cooling apparatus includes a heat exchange module and a cooling module. The heat exchange module includes a liquid outlet and a liquid outlet. The cooling module includes a first body, a second body, a first cooling component and a cooling duct. The first body is connected to the liquid outlet. The second body is connected to the liquid outlet, and the first body is disposed above the second body. The first cooling component is disposed between the first body and the second body. The cooling duct is connected to the first body and the second body, and the cooling duct is in thermal contact with the first cooling component.Type: ApplicationFiled: March 20, 2015Publication date: July 14, 2016Inventors: Hung CHANG, Min-Lang CHEN, Hsueh-Lung CHENG
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Publication number: 20150262933Abstract: A semiconductor arrangement and method of formation are provided. The semiconductor arrangement includes a metal trace under at least a first dielectric layer and a second dielectric layer. The metal trace is connected to a ball connection by a first via in the first dielectric layer and second via in the second dielectric layer. The metal trace is connected to a test pad at a connection point, where the connection point is under the first dielectric layer. The metal trace under at least the first dielectric layer and the second dielectric layer has increased stability and decreased susceptibility to cracking in least one of the ball connection, the connection point, the first via or the second via as compared to a metal trace that is not under at least a first dielectric layer and a second dielectric layer.Type: ApplicationFiled: March 13, 2014Publication date: September 17, 2015Applicant: Taiwan Semiconductor Manufacturing Company LimitedInventors: Jiun Yi Wu, Hsueh-Lung Cheng, Shou-Yi Wang
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Patent number: 7944688Abstract: A heat dissipating structure for a heat source includes a position-adjusting unit, a first heat dissipating element, a second heat dissipating element and a first heat conducting element. The position-adjusting unit has an elastic element. The first heat dissipating element is connected with the position-adjusting unit. The second heat dissipating element contacts with the heat source. One end of the first heat conducting element contacts with the first heat dissipating element, and the other end of the first heat conducting element contacts with the second heat dissipating element. The position-adjusting unit adjusts the position of the first heat dissipating element relative to the second heat dissipating element by the elastic element.Type: GrantFiled: December 10, 2008Date of Patent: May 17, 2011Assignee: Ama Precision Inc.Inventors: Hsueh-Lung Cheng, Ming-Feng Tsai
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Patent number: 7755900Abstract: A heat dissipating module including a first heat sink, a second heat sink, a connector, a pivot and a heat pipe is provided. The first heat sink is disposed on a circuit board and contacts a heat source. The second heat sink has a first pivotal hole and a limiting opening. The connector has a first connecting portion and a second connecting portion. The first connecting portion is fixedly connected to the first heat sink. The second connecting portion has a limiting protrusion and a second pivotal hole corresponding to the first pivotal hole. The pivot passes through the first pivotal hole and the second pivotal hole and is pivotally connected to the connector and the second heat sink. The limiting protrusion protrudes into the limiting opening to limit the rotation angle of the second heat sink relative to the connector.Type: GrantFiled: November 18, 2008Date of Patent: July 13, 2010Assignee: AMA Precision Inc.Inventor: Hsueh-Lung Cheng
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Publication number: 20090161313Abstract: A heat dissipating structure for a heat source includes a position-adjusting unit, a first heat dissipating element, a second heat dissipating element and a first heat conducting element. The position-adjusting unit has an elastic element. The first heat dissipating element is connected with the position-adjusting unit. The second heat dissipating element contacts with the heat source. One end of the first heat conducting element contacts with the first heat dissipating element, and the other end of the first heat conducting element contacts with the second heat dissipating element. The position-adjusting unit adjusts the position of the first heat dissipating element relative to the second heat dissipating element by the elastic element.Type: ApplicationFiled: December 10, 2008Publication date: June 25, 2009Inventors: Hsueh-Lung Cheng, Ming-Feng Tsai
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Publication number: 20090141454Abstract: A heat dissipating module including a first heat sink, a second heat sink, a connector, a pivot and a heat pipe is provided. The first heat sink is disposed on a circuit board and contacts a heat source. The second heat sink has a first pivotal hole and a limiting opening. The connector has a first connecting portion and a second connecting portion. The first connecting portion is fixedly connected to the first heat sink. The second connecting portion has a limiting protrusion and a second pivotal hole corresponding to the first pivotal hole. The pivot passes through the first pivotal hole and the second pivotal hole and is pivotally connected to the connector and the second heat sink. The limiting protrusion protrudes into the limiting opening to limit the rotation angle of the second heat sink relative to the connector.Type: ApplicationFiled: November 18, 2008Publication date: June 4, 2009Applicant: AMA PRECISION INC.Inventor: Hsueh-Lung Cheng
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Publication number: 20090011131Abstract: A method for treating the surface of the heat dissipation module is provided. The method includes the following steps. First, a heat dissipation module is provided. Next, a nano-material layer is formed on the surface of the heat dissipation module. Thus, the surface of the heat dissipation module is isolated from air and effectively prevented from being oxidized or polluted.Type: ApplicationFiled: June 26, 2008Publication date: January 8, 2009Applicant: AMA PRECISION INC.Inventors: Yu-Cheng Chou, Te-Li Tsai, Ming-Feng Tsai, Chich-Hua Shen, Hsueh-Lung Cheng