Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.

Abstract: A method for fabricating a flexible electrical device is provided. The method includes providing a first substrate, providing a second substrate opposed to the first substrate, wherein one of the first and second substrates includes a polyimide polymer of Formula (I) wherein B is a polycyclic aliphatic group, A is an aromatic group containing at least one ether bond, A? is an aromatic or aliphatic group, and 1?n/m?4, directly fabricating a thin film transistor (TFT) on one of the first and second substrates which includes the polyimide polymer of Formula (I), and disposing a medium layer between the first substrate and the second substrate.

Abstract: Disclosed is a polyimide polymerized by x molar parts of a first diamine, y molar parts of a second diamine, and 100 molar parts of a first dianhydride, wherein the first diamine has a formula of the second diamine has a formula of the first dianhydride has a formula of a+b=100, 50?x?80, and 20?y?50.

Abstract: A polyimide polymer solution, a polyimide polymer, a transparent film, a display device and a solar cell are provided. The polyimide polymer has at least one of a repeating unit of formula (D) and a repeating unit of formula (J) and at least one of a repeating unit of formula (Q) and a repeating unit of formula (T). One of B and B? is cyclo-aliphatic compound, and the other is aromatic compound, a molar mass ratio of the cyclo-aliphatic compound to the aromatic compound is 1˜4, A and A? are identical or different aromatic diamines, and at least one of A and A? is aromatic diamine with ether groups, and A could be the same as or different from A?.

Abstract: A method for fabricating a flexible electrical device is provided. The method includes providing a first substrate, providing a second substrate opposed to the first substrate, wherein one of the first and second substrates includes a polyimide polymer of Formula (I) wherein B is a polycyclic aliphatic group, A is an aromatic group containing at least one ether bond, A? is an aromatic or aliphatic group, and 1?n/m?4, directly fabricating a thin film transistor (TFT) on one of the first and second substrates which includes the polyimide polymer of Formula (I), and disposing a medium layer between the first substrate and the second substrate.

Abstract: A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a release layer overlying the carrier with a first area and a flexible substrate overlying the release layer and the carrier with a second area, wherein the second area is larger than the first area and the flexible substrate has a greater adhesion force than that of the release layer to the carrier. The disclosure also provides a method for fabricating the substrate structure.

Abstract: A release layer material of cyclic olefin copolymers (COC) applied in flexible electrical devices represented by Formula (I) or (II) is provided. The invention also provides a substrate structure including the release layer. The substrate structure includes a carrier, a release layer overlying the carrier with one or more blocks with a first area, wherein the release layer includes cyclic olefin copolymers (COC) represented by the disclosed Formula (I) or (II), and a flexible substrate overlying the release layer and the carrier with a second area, wherein the second area is larger than the first area and the flexible substrate has a greater adhesion force than that of the release layer to the carrier. The invention further provides a method for fabricating the substrate structure. In Formula (I) or (II), X is 30-70, X+Y is 100 and R is —H, —CH3 or —C2H5.

Abstract: A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a release layer overlying the carrier with a first area and a flexible substrate overlying the release layer and the carrier with a second area, wherein the second area is larger than the first area and the flexible substrate has a greater adhesion force than that of the release layer to the carrier. The disclosure also provides a method for fabricating the substrate structure.

Abstract: A polyimide polymer solution, a polyimide polymer, a transparent film, a display device and a solar cell are provided. The polyimide polymer has at least one of a repeating unit of formula (D) and a repeating unit of formula (J) and at least one of a repeating unit of formula (Q) and a repeating unit of formula (T). One of B and B? is cyclo-aliphatic compound, and the other is aromatic compound, a molar mass ratio of the cyclo-aliphatic compound to the aromatic compound is 1˜4, A and A? are identical or different aromatic diamines, and at least one of A and A? is aromatic diamine with ether groups, and A could be the same as or different from A?.

Abstract: A polyimide polymer of Formula (I) for flexible electrical device substrate material is provided. In Formula (I), B is a polycyclic aliphatic group, A is an aromatic group containing at least one ether bond, A? is an aromatic or aliphatic group, and 1?n/m?4. The invention also provides a flexible electrical device including the polyimide polymer.

Abstract: A release layer material of cyclic olefin copolymers (COC) applied in flexible electrical devices represented by Formula (I) or (II) is provided. The invention also provides a substrate structure including the release layer. The substrate structure includes a carrier, a release layer overlying the carrier with one or more blocks with a first area, wherein the release layer includes cyclic olefin copolymers (COC) represented by the disclosed Formula (I) or (II), and a flexible substrate overlying the release layer and the carrier with a second area, wherein the second area is larger than the first area and the flexible substrate has a greater adhesion force than that of the release layer to the carrier. The invention further provides a method for fabricating the substrate structure. In Formula (I) or (II), X is 30-70, X+Y is 100 and R is —H, —CH3 or —C2H5.