Patents by Inventor Hsui-Ping Peng

Hsui-Ping Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8698953
    Abstract: Embodiments of the present disclosure provide techniques and configurations to determine, by a digital image capture device, that lens calibration data is to be downloaded for a lens assembly of the digital image capture device and to download the lens calibration data. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: August 17, 2010
    Date of Patent: April 15, 2014
    Assignee: Marvell International Ltd.
    Inventors: Hsui-Ping Peng, Jigar Mulchandbhai Bhajiwala, Marc Jacobs
  • Patent number: 8605604
    Abstract: Apparatus having corresponding methods and non-transitory computer-readable media comprise: a wireless local-area network (WLAN) module comprising a receiver configured to receive a WLAN signal into the WLAN module; a transmitter; and a loopback controller configured to selectively loop back the WLAN signal to the transmitter, wherein the transmitter is configured to transmit the looped-back WLAN signal from the WLAN module.
    Type: Grant
    Filed: December 17, 2010
    Date of Patent: December 10, 2013
    Assignee: Marvell International Ltd.
    Inventors: Vivek Mohan, Hsui-Ping Peng
  • Patent number: 8114758
    Abstract: Methods directed to avoiding die cracking resulting from die separation are described herein. A method may include providing a substrate including a first die, a second die, and a monitor structure in an area between the first die and the second die, the monitor structure including a first dielectric material, removing the first dielectric material from the monitor structure, and after removing the first dielectric material, cutting the substrate along the area between the first die and the second die to separate the first die from the second die.
    Type: Grant
    Filed: August 2, 2010
    Date of Patent: February 14, 2012
    Assignee: Marvell International Ltd.
    Inventors: Hsui-Ping Peng, Jae-Hong Lee
  • Patent number: 7811853
    Abstract: Methods directed to avoiding die cracking resulting from die separation are described herein. A method may include providing a substrate including a plurality of dies separated from each other by at least a dielectric material, removing the dielectric material substantially down to the substrate to form gaps between the plurality of dies, and singulating the plurality of dies along the gaps between the plurality of dies.
    Type: Grant
    Filed: November 18, 2008
    Date of Patent: October 12, 2010
    Assignee: Marvell International Ltd.
    Inventor: Hsui-Ping Peng
  • Patent number: 7767552
    Abstract: Methods directed to avoiding die cracking resulting from die separation are described herein. A method may include providing a substrate including a first die, a second die, and a monitor structure in an area between the first die and the second die, the monitor structure including a first dielectric material, removing the first dielectric material from the monitor structure, and after removing the first dielectric material, cutting the substrate along the area between the first die and the second die to separate the first die from the second die.
    Type: Grant
    Filed: November 18, 2008
    Date of Patent: August 3, 2010
    Assignee: Marvell International Ltd.
    Inventors: Hsui-Ping Peng, Jae-Hong Lee