Patents by Inventor Hsun-Chen Chu

Hsun-Chen Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11734946
    Abstract: A fingerprint sensing module includes a first substrate, an active device, a photosensitive element layer, a collimation structure layer, a second substrate, a plurality of micro lenses, and a spacer pattern. The active device is disposed on the first substrate. The photosensitive element layer is disposed on the first substrate and is electrically connected to the active device. The collimation structure layer is disposed on the photosensitive element layer. The second substrate is disposed on the collimation structure layer. The micro lenses are disposed on a surface of the collimation structure layer facing away from the photosensitive element layer, and overlap the photosensitive element layer. The micro lenses are divided into a plurality of microlens groups, and the microlens groups are respectively located in a plurality of sensing pixel areas of the fingerprint sensing module. The spacer pattern extends between the microlens groups.
    Type: Grant
    Filed: June 4, 2021
    Date of Patent: August 22, 2023
    Assignee: Au Optronics Corporation
    Inventors: Chao-Chien Chiu, Shuo-Hong Wang, Shih-Hua Lu, Hsun-Chen Chu, Yan-Liang Chen
  • Patent number: 11694466
    Abstract: A biometric verification device includes a backlight module, a photodetector, a switching element, and at least one collimation structure. The photodetector is disposed on the backlight module. The switching element is disposed on the backlight module and electrically connected with the photodetector. The at least one collimation structure is disposed on the backlight module and has a first pinhole and a second pinhole. The horizontal projections of the first pinhole and the second pinhole on the backlight module do not overlap with the horizontal projection of the photodetector on the backlight module.
    Type: Grant
    Filed: March 9, 2022
    Date of Patent: July 4, 2023
    Assignee: Au Optronics Corporation
    Inventor: Hsun-Chen Chu
  • Publication number: 20220375248
    Abstract: A biometric verification device includes a backlight module, a photodetector, a switching element, and at least one collimation structure. The photodetector is disposed on the backlight module. The switching element is disposed on the backlight module and electrically connected with the photodetector. The at least one collimation structure is disposed on the backlight module and has a first pinhole and a second pinhole, The horizontal projections of the first pinhole and the second pinhole on the backlight module do not overlap with the horizontal projection of the photodetector on the backlight module.
    Type: Application
    Filed: March 9, 2022
    Publication date: November 24, 2022
    Applicant: Au Optronics Corporation
    Inventor: Hsun-Chen Chu
  • Patent number: 11495048
    Abstract: A fingerprint sensing module, including a photosensitive element layer and a color filter layer, is provided. The photosensitive element layer has multiple photosensitive regions, and includes a substrate and multiple photosensitive pixels. The photosensitive pixels have multiple photosensitive patterns overlapping the photosensitive regions. The photosensitive pixels include multiple first photosensitive pixels overlapping multiple first photosensitive regions and multiple second photosensitive pixels overlapping multiple second photosensitive regions. A percentage value of a number of the second photosensitive pixels to a number of the photosensitive pixels is less than 30%. An orthographic projection area of each of the first photosensitive regions is different from an orthographic projection area of each of the second photosensitive regions.
    Type: Grant
    Filed: July 1, 2021
    Date of Patent: November 8, 2022
    Assignee: Au Optronics Corporation
    Inventor: Hsun-Chen Chu
  • Publication number: 20220182508
    Abstract: A display device includes a first substrate, a red sub-pixel, a green sub-pixel, a blue sub-pixel, a plurality of photosensitive devices, and a second substrate. The red sub-pixel, the green sub-pixel, and the blue sub-pixel are located on a first side of the first substrate. The photosensitive devices are located on the first side of the first substrate. Each of the photosensitive devices overlaps at least one of the red sub-pixel, the green sub-pixel, and the blue sub-pixel. Each of the photosensitive devices includes an active element and a photosensitive element. The active element is located on the first substrate. The photosensitive element is electrically connected to the active element. The second substrate overlaps the first substrate.
    Type: Application
    Filed: November 2, 2021
    Publication date: June 9, 2022
    Applicant: Au Optronics Corporation
    Inventors: Hsun-Chen Chu, Tsu-Chien Tung, Yu-Han Huang, Chia-Bin Hsiao, Chao-Chien Chiu
  • Publication number: 20220050990
    Abstract: A fingerprint sensing module, including a photosensitive element layer and a color filter layer, is provided. The photosensitive element layer has multiple photosensitive regions, and includes a substrate and multiple photosensitive pixels. The photosensitive pixels have multiple photosensitive patterns overlapping the photosensitive regions. The photosensitive pixels include multiple first photosensitive pixels overlapping multiple first photosensitive regions and multiple second photosensitive pixels overlapping multiple second photosensitive regions. A percentage value of a number of the second photosensitive pixels to a number of the photosensitive pixels is less than 30%. An orthographic projection area of each of the first photosensitive regions is different from an orthographic projection area of each of the second photosensitive regions.
    Type: Application
    Filed: July 1, 2021
    Publication date: February 17, 2022
    Applicant: Au Optronics Corporation
    Inventor: Hsun-Chen Chu
  • Publication number: 20220050987
    Abstract: A fingerprint sensing module includes a first substrate, an active device, a photosensitive element layer, a collimation structure layer, a second substrate, a plurality of micro lenses, and a spacer pattern. The active device is disposed on the first substrate. The photosensitive element layer is disposed on the first substrate and is electrically connected to the active device. The collimation structure layer is disposed on the photosensitive element layer. The second substrate is disposed on the collimation structure layer. The micro lenses are disposed on a surface of the collimation structure layer facing away from the photosensitive element layer, and overlap the photosensitive element layer. The micro lenses are divided into a plurality of microlens groups, and the microlens groups are respectively located in a plurality of sensing pixel areas of the fingerprint sensing module. The spacer pattern extends between the microlens groups.
    Type: Application
    Filed: June 4, 2021
    Publication date: February 17, 2022
    Applicant: Au Optronics Corporation
    Inventors: Chao-Chien Chiu, Shuo-Hong Wang, Shih-Hua Lu, Hsun-Chen Chu, Yan-Liang Chen
  • Patent number: 11181787
    Abstract: A touch apparatus includes a substrate, a plurality of pixel structures, a first touch electrode, a second touch electrode, a third touch electrode and a first conductive pattern. The first touch electrode and the second touch electrode are located at a first side of a transparent window. The third touch electrode is located at a second side of the transparent window. The first touch electrode, the second touch electrode and the third touch electrode are sequentially arranged in a first direction. A main portion of the first conductive pattern is electrically connected to the first touch electrode. The main portion of the first conductive pattern overlaps with the second touch electrode and is electrically isolated from the second touch electrode. A dummy portion of the first conductive pattern is electrically connected to the third touch electrode and structurally separated from the main portion of the first conductive pattern.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: November 23, 2021
    Assignee: Au Optronics Corporation
    Inventors: Hsun-Chen Chu, Pei-Ming Chen
  • Publication number: 20200393711
    Abstract: A touch apparatus includes a substrate, a plurality of pixel structures, a first touch electrode, a second touch electrode, a third touch electrode and a first conductive pattern. The first touch electrode and the second touch electrode are located at a first side of a transparent window. The third touch electrode is located at a second side of the transparent window. The first touch electrode, the second touch electrode and the third touch electrode are sequentially arranged in a first direction. A main portion of the first conductive pattern is electrically connected to the first touch electrode. The main portion of the first conductive pattern overlaps with the second touch electrode and is electrically isolated from the second touch electrode. A dummy portion of the first conductive pattern is electrically connected to the third touch electrode and structurally separated from the main portion of the first conductive pattern.
    Type: Application
    Filed: September 17, 2019
    Publication date: December 17, 2020
    Applicant: Au Optronics Corporation
    Inventors: Hsun-Chen Chu, Pei-Ming Chen
  • Patent number: D551855
    Type: Grant
    Filed: November 3, 2006
    Date of Patent: October 2, 2007
    Assignee: Sutech Trading Limited
    Inventors: Guo-Liang Yeh, Tzu-Cheng Yu, Hsun-Chen Chu
  • Patent number: D620002
    Type: Grant
    Filed: July 17, 2009
    Date of Patent: July 20, 2010
    Assignee: FIH (Hong Kong) Limited
    Inventors: Cheng-Chieh Tsai, Ho-Chyuan Su, Tzu-Cheng Yu, Ming-Ling Chen, Hsun-Chen Chu, Po-Ching Huang
  • Patent number: D720345
    Type: Grant
    Filed: May 29, 2012
    Date of Patent: December 30, 2014
    Assignee: Chi Mei Communication Systems, Inc.
    Inventors: Hsun-Chen Chu, Po-Ching Huang, Tzu-Cheng Yu