Abstract: A package comprises a substrate including a first surface, and an upper conductive layer arranged on the first surface, a first light-emitting unit arranged on the upper conductive layer, and comprises a first semiconductor layer, a first substrate, a first light-emitting surface and a first side wall, a second light-emitting unit, which is arranged on the upper conductive layer, and comprises a second light-emitting surface and a second side wall, a light-transmitting layer arranged on the first surface and covers the upper conductive layer, the first light-emitting unit, and the second light-emitting unit, a light-absorbing layer, which is arranged between the substrate and the light-transmitting layer in a continuous configuration of separating the first light-emitting unit and the second light-emitting unit from each other, and a reflective wall arranged on the first side wall, wherein a height of the reflective wall is lower than that of the light-absorbing layer.

Abstract: A semiconductor light-emitting device includes a semiconductor stack including a first semiconductor layer and a second semiconductor layer; a first reflective layer formed on the first semiconductor layer and including a plurality of vias; a plurality of contact structures respectively filled in the vias and electrically connected to the first semiconductor layer; a second reflective layer including metal material formed on the first reflective layer and contacting the contact structures; a plurality of conductive vias surrounded by the semiconductor stack; a connecting layer formed in the conductive vias and electrically connected to the second semiconductor layer; a first pad portion electrically connected to the second semiconductor layer; and a second pad portion electrically connected to the first semiconductor layer, wherein a shortest distance between two of the conductive vias is larger than a shortest distance between the first pad portion and the second pad portion.

Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.

Abstract: An storage carrier, having a body, the body having a substrate, a first frame board and a second frame board, with the first and second frame boards disposed at two opposite ends of the substrate, respectively, allowing a receiving space to be formed between the first frame board and the second frame board and adapted to receive and position an storage device. First positioning portions and second positioning portions are disposed on opposing inner sides of the first frame board and the second frame board and engaged with fixing holes of the storage device, respectively, with the first positioning portions being of higher structural rigidity than the second positioning portions, where a panel is coupled to another end of the substrate and positioned proximate to the first frame board and the second frame board, with a lid movably pivotally connected to the panel.

Abstract: A high-density storage assembly having a casing, an engaging mechanism, and a recording medium machine; the casing has a receiving space, with a plurality of fixing portions disposed on a substrate at a bottom of the casing, the engaging mechanism has at least two supporting portions arranged in a side by side in a transverse width direction, each having a coupling portion and a supporting plate, with the coupling portions connected to the fixing portions of the substrate of the casing, respectively, and extended upward and obliquely to form the supporting plates. A containing space for movably placing and positioning the recording medium machine is formed between an abutting leaf spring and a limit plate which are disposed on a lower surface of the supporting plate of one of two adjacent said supporting portions and an upper surface of the supporting plate of another said supporting portion, respectively.

Abstract: A high-density storage assembly having a casing, an engaging mechanism, and a recording medium machine; the casing has a receiving space, with a plurality of fixing portions disposed on a substrate at a bottom of the casing, the engaging mechanism has at least two supporting portions arranged in a side by side in a transverse width direction, each having a coupling portion and a supporting plate, with the coupling portions connected to the fixing portions of the substrate of the casing, respectively, and extended upward and obliquely to form the supporting plates. A containing space for movably placing and positioning the recording medium machine is formed between an abutting leaf spring and a limit plate which are disposed on a lower surface of the supporting plate of one of two adjacent said supporting portions and an upper surface of the supporting plate of another said supporting portion, respectively.

Abstract: An storage carrier, having a body, the body having a substrate, a first frame board and a second frame board, with the first and second frame boards disposed at two opposite ends of the substrate, respectively, allowing a receiving space to be formed between the first frame board and the second frame board and adapted to receive and position an storage device. First positioning portions and second positioning portions are disposed on opposing inner sides of the first frame board and the second frame board and engaged with fixing holes of the storage device, respectively, with the first positioning portions being of higher structural rigidity than the second positioning portions, where a panel is coupled to another end of the substrate and positioned proximate to the first frame board and the second frame board, with a lid movably pivotally connected to the panel.

Abstract: An in-box quick release access device mounting structure includes a rigid holder shell including an accommodation chamber surrounded by a bottom panel and two opposite side panels thereof, a first positioning member and a first locating member located at the bottom panel and defining a mounting space therebetween, a second positioning member and a second locating member respectively located at the two side panels, and a retaining mechanism including a first retaining plate fastened to the first positioning member and adapted for detachably securing a small access device in the mounting space and a second retaining plate fastened to the second locating member and adapted for detachably securing a large access device in the accommodation chamber.

Abstract: An in-box quick release access device mounting structure includes a rigid holder shell including an accommodation chamber surrounded by a bottom panel and two opposite side panels thereof, a first positioning member and a first locating member located at the bottom panel and defining a mounting space therebetween, a second positioning member and a second locating member respectively located at the two side panels, and a retaining mechanism including a first retaining plate fastened to the first positioning member and adapted for detachably securing a small access device in the mounting space and a second retaining plate fastened to the second locating member and adapted for detachably securing a large access device in the accommodation chamber.

Abstract: A motion compensation image processing apparatus includes an external memory, a cache, a motion compensation module, a determination module and a fetching module. The external memory stores a reference frame associated with an image block. The motion compensation module sequentially performs motion compensation on a previous image block and the image block. When the motion compensation module performs motion compensation on the previous image block, the determination module determines a motion vector relative to the reference frame. Before the motion compensation module performs motion compensation on the image block, the fetching module fetches a reference region, corresponding to the motion block, in the reference frame from the external memory to the cache.

Abstract: The present invention discloses a hybrid data transmission exchanger and a hybrid data transmission method, whereby hosts can access storage units and share data. The hybrid data transmission exchanger comprises an embedded central processing unit, a virtual bridge/switch unit, an optical fiber network connection unit and an Ethernet connection unit. The embedded central processing unit is connected with the storage units and detects the virtual bridge/switch unit, optical fiber network connection unit and Ethernet connection unit to detect the connection states of a host. A host can directly access the storage units via the optical fiber network connection unit or the Ethernet connection unit. When a host is linked to the exchanger via a PCIe interface, the virtual bridge/switch unit converts an address area and a request identification code of the host to correspond to the embedded central processing unit, whereby the host can access storage units.

Abstract: High-strength, deep-drawable, steel sheet exhibiting dual-phase properties is produced by (i) initially annealing the sheet to achieve crystallographic textures yielding high deep drawability, (ii) heating the sheet to a temperature above the A.sub.1 for a time sufficient to produce from 2 to 10% austenite, and thereafter (iii) rapidly cooling to transform at least a portion of the austenite to martensite or bainite. To achieve such transformation of austenite, the composition of the steel must be selected to provide a requisite degree of hardenability.

Abstract: The drawability of low carbon (0.015 to 0.06%), low Mn (<0.25%) steel strip, is improved by (i) employing cold reductions higher than is conventionally employed, i.e. > 80% and (ii) by annealing in the two-phase (ferrite and austenite) region. The effectiveness of such high temperature annealing and such high cold reductions is further enhanced as the phosphorus content increases.