Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first bump structure formed over a first substrate. The first bump structure includes a first pillar layer formed over the first substrate and a first barrier layer formed over the first pillar layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first edge of the first pillar layer. The package structure further includes a second bump structure bonded to the first bump structure through a solder joint. In addition, the second bump structure includes a second pillar layer formed over a second substrate and a second barrier layer formed over the second pillar layer. The first protruding portion of the first barrier layer is spaced apart from the solder joint.

Abstract: A semiconductor device includes a single-layered dielectric layer, a conductive line, a conductive via and a conductive pad. The conductive line and the conductive via are disposed in the single-layered dielectric layer. The conductive pad is extended into the single-layered dielectric layer to electrically connected to the conductive line.

Abstract: The present invention relates to silicon-based powders and a method for producing the silicon-based powders. The method for producing the silicon-based powders includes a hydrolysis step of a silicon precursor having an alkoxy group, a condensation step and a drying step. By a specific weight ratio of water to the silicon precursor having the alkoxy group and a silicon precursor having a secondary amino group and an alkyl group, in the method for producing the silicon-based powders, the condensation step can be performed without organic solvents, and a modification on silicon-based gels can be performed to enhance a safety of processes and a hydrophobicity of the resulted silicon-based powders, and decrease a thermal conductivity and a bulk density of the resulted silicon-based powders.

Abstract: The present invention relates to a fiber composite material and a method for producing the fiber composite material. The method for producing the fiber composite material includes a hydrolysis step of a silicon precursor having an alkoxy group, an in-situ condensation step and a drying step. A specific silicon precursor having a secondary amino group and alkyl groups is used therein, as well as a specific weight ratio of the silicon precursor to a fiber material, the in-situ condensation step can be performed in the absence of organic solvents in the method for producing the fiber composite material, and a hydrophobic modification on silicon-based gels can be performed, thereby simplifying the process, decreasing a thermal conductivity of the resulted fiber composite material and preventing drop dust of the resulted fiber composite material.

Abstract: A method includes the steps of (a) adding an organosilicon compound containing methyl groups and a surfactant into water, mixing well and carrying out hydrolysis to get a mixed aqueous solution; (b) mixing the mixed aqueous solution with 0.1-0.2M ammonium hydroxide and a remaining percentage of an organic solvent, and stirring the mixture under nitrogen atmosphere for emulsion polymerization to get a water-in-oil (w/o) emulsion; and (c) removing the organic solvent and drying the w/o emulsion to get aerogel particles. Thereby the aerogel particles are produced by the present method without hydrophobic treatment and solvent exchange. Therefore the cost and time used for preparing the aerogel particles are saved.

Abstract: Aerogel particles and a method of making the same are revealed. The method includes the steps of (a) adding a siloxane compound containing methyl groups and a surfactant into water, mixing well and carrying out hydrolysis to get a mixed aqueous solution; (b) mixing the mixed aqueous solution with 0.1-0.2M ammonium hydroxide and a remaining percentage of an organic solvent, and stirring the mixture under nitrogen atmosphere for emulsion polymerization to get a water-in-oil (w/o) lotion; and (c) removing the organic solvent and drying the w/o lotion to get aerogel particles. Thereby the aerogel particles are produced by the present method without hydrophobic treatment and solvent exchange. Therefore the cost and time used for preparing the aerogel particles are saved.

Abstract: In some embodiments, methods for improving the survival of pancreatic ?-cell progenitors in culture are provided. Such methods may include contacting a population of pancreatic progenitor cells with an amino acid (aa) sequence comprising IKVAV (SEQ ID NO:1). In other embodiments, methods for (i) verifying the establishment of a population of pancreatic progenitor or stem cells and (ii) methods for generating or establishing a population of pancreatic endocrine progenitor cells in vitro are provided.

Abstract: In some embodiments, methods for improving the survival of pancreatic ?-cell progenitors in culture are provided. Such methods may include contacting a population of pancreatic progenitor cells with an amino acid (aa) sequence comprising IKVAV (SEQ ID NO:1). In other embodiments, methods for (i) verifying the establishment of a population of pancreatic progenitor or stem cells and (ii) methods for generating or establishing a population of pancreatic endocrine progenitor cells in vitro are provided.