Patents by Inventor Hu CAI

Hu CAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11945004
    Abstract: A semiconductor manufacturing equipment cleaning system has a multi-station cleaning and inspection system. Within semiconductor manufacturing equipment cleaning system, a tray cleaning station uses a first rotating brush passing over a first surface of a carrier and possibly semiconductor die, and a second rotating brush passing over a second surface of the carrier and semiconductor die opposite the first surface of the carrier and semiconductor die. Debris and contaminants dislodged from the first surface and second surface of the carrier by the first rotating brush and second rotating brush are removed under vacuum suction. A conveyor transports the carrier through the multi-station cleaning and inspection system. The first rotating brush and second rotating brush move in tandem across the first surface and second surface of the carrier. Air pressure is injected across the first rotating brush and second rotating brush to further remove debris and contaminants.
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: April 2, 2024
    Assignee: UTAC Headquarters Pte. Ltd.
    Inventors: Hua Hong Tan, Wing Keung Lam, Zong Xiang Cai, Wei Ming Xian, Yao Hong Wu, Tao Hu
  • Patent number: 11943373
    Abstract: An identity certificate may be issued to a blockchain node. The issuance may include issuing a first identity certificate to a first terminal and receiving a second identity certificate issuance request that is from the first terminal. A second identity certificate may be issued to the first terminal, and a third identity certificate issuance request is received from the second terminal. A third identity certificate is issued to the second terminal, so that the second terminal forwards the third identity certificate to the third terminal.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: March 26, 2024
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Mao Cai Li, Zong You Wang, Kai Ban Zhou, Chang Qing Yang, Hu Lan, Li Kong, Jin Song Zhang, Yi Fang Shi, Geng Liang Zhu, Qu Cheng Liu, Qiu Ping Chen
  • Patent number: 11924358
    Abstract: This application provides a method for issuing a digital certificate performed by a digital certificate issuing center that includes a public-private key generation module and an authentication module. The method includes: receiving a public-private key request from a node in a blockchain network; generating a public key and a private key of the node by using the public-private key generation module, and transmitting the public and private keys to the node; receiving the public key of the node and registration information of the node, and authenticating the registration information by using the authentication module; and generating, in accordance with a determination that the authentication succeeds, a digital certificate of the node by using the authentication module, and transmitting the digital certificate to the node. The embodiments of this application can improve the probative value of an issued digital certificate, thereby improving the security of data exchange in a blockchain network.
    Type: Grant
    Filed: February 9, 2021
    Date of Patent: March 5, 2024
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Jun Zang, Jianjun Zhang, Luohai Zheng, Junjie Shi, Hujia Chen, Zichao Tang, Yige Cai, Qing Qin, Chuanbing Dai, Hu Lan, Jinlong Chen
  • Patent number: 11144690
    Abstract: Techniques and systems for implementing a general extensible layer mapping approach that maps between integrated circuit (IC) design database layers and process layers are described. A first IC design layout having in-design layers can be converted into a second IC design layout having derived layers, wherein said converting comprises mapping the in-design layers to the derived layers by applying a set of layer derivation rules to shapes in the IC design layout, and wherein the set of layer derivation rules implements a one-to-many mapping between the in-design layers and the derived layers. Next, a one-to-one mapping between the derived layers and process layers used in a parasitic extraction tool can be generated. Parasitic extraction on the IC design layout then be performed by providing the second IC design layout and the one-to-one mapping to the parasitic extraction tool.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: October 12, 2021
    Assignee: Synopsys, Inc.
    Inventors: Jun Wang, Yun-Jui Li, Bin Xu, Cheng-Ming Wu, Yu Fan Lu, Hu Cai, Yuting Fu, Hwei-Tseng Wang, Sui Zheng, Jeong-Tyng Li
  • Publication number: 20200202061
    Abstract: Techniques and systems for implementing a general extensible layer mapping approach that maps between integrated circuit (IC) design database layers and process layers are described. A first IC design layout having in-design layers can be converted into a second IC design layout having derived layers, wherein said converting comprises mapping the in-design layers to the derived layers by applying a set of layer derivation rules to shapes in the IC design layout, and wherein the set of layer derivation rules implements a one-to-many mapping between the in-design layers and the derived layers. Next, a one-to-one mapping between the derived layers and process layers used in a parasitic extraction tool can be generated. Parasitic extraction on the IC design layout then be performed by providing the second IC design layout and the one-to-one mapping to the parasitic extraction tool.
    Type: Application
    Filed: December 18, 2019
    Publication date: June 25, 2020
    Applicant: Synopsys, Inc.
    Inventors: Jun Wang, Yun-Jui Li, Bin Xu, Cheng-Ming Wu, Yu Fan Lu, Hu Cai, Yuting Fu, Hwei-Tseng Wang, Sui Zheng, Jeong-Tyng Li
  • Patent number: 10372867
    Abstract: Techniques for analyzing a routed interconnection of a net of a circuit are discussed herein. Some embodiments may include a method comprising with a computer, analyzing the circuit to determine a performance parameter of the net, wherein the circuit is analyzed based at least in part on applying pre-layout simulation data of the net to layout data of the circuit. Additionally or alternatively, the circuit may be analyzed based on extracting characteristics of the routed interconnection from the layout data of the net.
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: August 6, 2019
    Assignee: SYNOPSYS, INC.
    Inventors: Jun Wang, Randy Bishop, Jingyu Xu, Dick Liu, Hu Cai, Jun Lu
  • Publication number: 20170249415
    Abstract: Techniques for analyzing a routed interconnection of a net of a circuit are discussed herein. Some embodiments may include a method comprising with a computer, analyzing the circuit to determine a performance parameter of the net, wherein the circuit is analyzed based at least in part on applying pre-layout simulation data of the net to layout data of the circuit. Additionally or alternatively, the circuit may be analyzed based on extracting characteristics of the routed interconnection from the layout data of the net.
    Type: Application
    Filed: September 2, 2015
    Publication date: August 31, 2017
    Inventors: Jun WANG, Randy BISHOP, Jingyu XU, Dick LIU, Hu CAI, Jun LU
  • Publication number: 20170061064
    Abstract: Techniques for analyzing a routed interconnection of a net of a circuit are discussed herein. Some embodiments may include a method comprising with a computer, analyzing the circuit to determine a performance parameter of the net, wherein the circuit is analyzed based at least in part on applying pre-layout simulation data of the net to layout data of the circuit. Additionally or alternatively, the circuit may be analyzed based on extracting characteristics of the routed interconnection from the layout data of the net.
    Type: Application
    Filed: September 2, 2015
    Publication date: March 2, 2017
    Inventors: Jun WANG, Randy BISHOP, Jingyu XU, Dick LIU, Hu CAI, Jun LU
  • Patent number: D786477
    Type: Grant
    Filed: November 18, 2015
    Date of Patent: May 9, 2017
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Gary Lauderdale, Chris Warner, Dustin King, Dylan Akinrele, Christopher Boissevain, Mason Morton, Zhen Yi Zheng, Xiao Hu Cai