Abstract: Provided is an ultra-stable multi-directional low-frequency actuator, including a baseplate, a bearing plate, a connecting mechanism, and two executing mechanisms symmetrically arranged on the baseplate about a Y axis. Both ends of a lower part of the support leg are connected with the baseplate through one high-static low-dynamic spring damper and one vertical executer arranged in parallel, respectively. Both ends of an upper part of the support leg are provided with one sensing component, respectively. A horizontal executer and an elastic component are arranged in parallel between each of both sides of a lateral support seat and a first groove, and sensing components corresponding to the horizontal executers one by one are arranged at an inner side of the support leg. The connecting mechanism is configured to connect two support legs, both ends of the bearing plate are mounted at the upper parts of the two support leg.

Abstract: The present disclosure relates to a semiconductor apparatus, a fabrication method thereof, and a memory system. In the present disclosure, different semiconductor devices (e.g., a high-voltage device and a low-voltage device) of a semiconductor apparatus are provided with gate spacers of different thicknesses by two dielectric deposition operations. Due to the use of the two dielectric deposition operations, the present disclosure can both provide a high-voltage device with a gate spacer having a relatively larger thickness and provide a low-voltage device with a gate spacer having a relatively smaller thickness, such as a thin gate spacer having a thickness less than 8 nm.

Abstract: The present application discloses a peripheral circuit assembly, a memory system and a fabrication method of the memory system. The peripheral circuit assembly includes a first peripheral circuit chip; a second peripheral circuit chip located on a side of the first peripheral circuit chip along a first direction, wherein one of the first peripheral circuit chip and the second peripheral circuit chip includes a low low voltage device, and the other one includes a high voltage device, and the first peripheral circuit chip or the second peripheral circuit chip further includes a controller.

Abstract: An integrated high-precision weighing module is provided which includes a scale pan, a lever, an internal calibration system, a bottom plate assembly, and a sensor main body. The scale pan is mounted on the lever, and the lever is connected to the sensor main body. The internal calibration system, the sensor main body and the lever are arranged transversely, and the internal calibration system and the sensor main body are respectively attached to the bottom plate assembly.