Patents by Inventor Hu Geun HWANG

Hu Geun HWANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080169334
    Abstract: Disclosed is a copper plating solid wire for MAG welding with excellent arc stability during welding, in which the solid wire for MAG welding is manufactured by high-speed copper plating by being immersed in a copper plating solution to make a plating layer of 0.2-1.0 ?m in thickness, and the plating layer comprises 100-1000 ppm of Fe, an alkali metal (Na), and alkaline earth metals (Mg, Ca) in total wherein the content of the alkali metal (Na) and the alkaline earth metals (Mg, Ca) ranges from 10 ppm to 500 ppm. According to the present invention, the copper plating solid wire for MAG welding with excellent feedability and arc stability during welding can be obtained despite the high-speed plating process.
    Type: Application
    Filed: March 23, 2006
    Publication date: July 17, 2008
    Inventor: Hu Geun HWANG
  • Publication number: 20060266800
    Abstract: Disclosed is a copper plating solid wire for MAG welding with excellent arc stability during welding, in which the solid wire for MAG welding is manufactured by high-speed copper plating by being immersed in a copper plating solution to make a plating layer of 0.2-1.0 ?m in thickness, and the plating layer comprises 100-1000 ppm of Fe, an alkali metal (Na), and alkaline earth metals (Mg, Ca) in total wherein the content of the alkali metal (Na) and the alkaline earth metals (Mg, Ca) ranges from 10 ppm to 500 ppm. According to the present invention, the copper plating solid wire for MAG welding with excellent feedability and arc stability during welding can be obtained despite the high-speed plating process.
    Type: Application
    Filed: March 23, 2006
    Publication date: November 30, 2006
    Inventor: Hu Geun HWANG