Patents by Inventor Hu-Hai Zhang

Hu-Hai Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8112880
    Abstract: A method for manufacturing a printed circuit board (PCB) includes: providing a first PCB substrate, a second PCB substrate and an adhesive layer, the first PCB substrate having a first main portion and a first unwanted portion divided by a first imaginary boundary, the second PCB substrate including a second main portion and a second unwanted portion divided by a second imaginary boundary; forming an opening in the adhesive layer; filling an filling mass in the opening; laminating the first PCB substrate, the second PCB substrate and the adhesive layer such that the adhesive layer is sandwiched between the first PCB substrate and the second PCB substrate, and the first, second imaginary boundaries are misaligned, a projection of each of the first and second imaginary boundaries in the adhesive layer being within the opening; and cutting the first and second PCB substrates along the first and second imaginary boundaries respectively.
    Type: Grant
    Filed: December 23, 2008
    Date of Patent: February 14, 2012
    Assignees: FuKui Precision Component (Shenzhen) Co., Ltd., Zhen Ding Technology Co., Ltd.
    Inventors: Hu-Hai Zhang, Ying Su, Cheng-Hsien Lin
  • Patent number: 7943490
    Abstract: The present invention relates to a method of cutting PCB module using a laser. The method includes steps of: providing a coverlay film, the coverlay film including at least one opening defined therein; attaching the coverlay film onto the PCB module such that the through holes of the PCB module are covered by the coverlay film and the laser cutting area thereof is exposed via the at least one opening; applying a laser beam to the exposed laser cutting area of the PCB module to cut the PCB module; and removing the coverlay film. A high positioning precision of the PCB module and better cutting result can be obtained.
    Type: Grant
    Filed: March 19, 2008
    Date of Patent: May 17, 2011
    Assignees: FuKui Precision Compenent(Shenzhen) Co., Ltd., Foxconn Advanced Technology Inc.
    Inventors: Ying Su, Hu-Hai Zhang, Huan-Long Lin
  • Publication number: 20090229121
    Abstract: A method for manufacturing a printed circuit board (PCB) includes: providing a first PCB substrate, a second PCB substrate and an adhesive layer, the first PCB substrate having a first main portion and a first unwanted portion divided by a first imaginary boundary, the second PCB substrate including a second main portion and a second unwanted portion divided by a second imaginary boundary; forming an opening in the adhesive layer; filling an filling mass in the opening; laminating the first PCB substrate, the second PCB substrate and the adhesive layer such that the adhesive layer is sandwiched between the first PCB substrate and the second PCB substrate, and the first, second imaginary boundaries are misaligned, a projection of each of the first and second imaginary boundaries in the adhesive layer being within the opening; and cutting the first and second PCB substrates along the first and second imaginary boundaries respectively.
    Type: Application
    Filed: December 23, 2008
    Publication date: September 17, 2009
    Applicants: FuKui Precision Component (Shenzhen) Co. Ltd., FOXCONN ADVANCED TECHNOLOGY INC.
    Inventors: Hu-Hai Zhang, Ying Su, Cheng-Hsien Lin
  • Publication number: 20090042370
    Abstract: The present invention relates to a method of cutting PCB module using a laser. The method includes steps of: providing a coverlay film, the coverlay film including at least one opening defined therein; attaching the coverlay film onto the PCB module such that the through holes of the PCB module are covered by the coverlay film and the laser cutting area thereof is exposed via the at least one opening; applying a laser beam to the exposed laser cutting area of the PCB module to cutt the PCB module; and removing the coverlay film. A high positioning precision of the PCB module and better cutting result can be obtained.
    Type: Application
    Filed: March 19, 2008
    Publication date: February 12, 2009
    Applicants: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD., FOXCONN ADVANCED TECHNOLOGY INC.
    Inventors: YING SU, HU-HAI ZHANG, HUAN-LONG LIN