Patents by Inventor HU PU

HU PU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240413059
    Abstract: A package structure and a method are provided. The package structure includes: a die pad; a plurality of discrete leads disposed on either side of or around the die pad, wherein each of the leads includes an upper surface and a lower surface, a trench extending through a portion of the lower surface and a portion of an outer sidewall surface of a lead being formed in a region, away from the die pad, of the lead, a lateral hole being formed in the lead on a side surface of the trench, the lateral hole communicating with the trench to form a step; a first molding layer filling the gaps between the leads and the die pad; a semiconductor chip disposed on an upper surface of the die pad; and a second molding layer disposed on an upper surface of the first molding layer, the lead, and the die pad.
    Type: Application
    Filed: June 6, 2024
    Publication date: December 12, 2024
    Applicant: JCET Group Co., Ltd.
    Inventors: Lei ZHENG, Ting LIU, Yuesheng ZHANG, Hu PU
  • Publication number: 20230212386
    Abstract: The present disclosure provides an epoxy molding compound composition, a preparation method and use thereof. The epoxy molding compound composition includes the following ingredients in mass percentage: epoxy resin: 4-9 wt %; a curing agent: 4-9 wt %; PN phenolic resin: 1-3 wt %; a curing accelerator: 0.02-0.5 wt %; filler: 70-90 wt %; a coupling agent: 0.2-0.6 wt %; and auxiliary additives: 1-2 wt %. By adding the PN phenolic resin to an epoxy resin system of the epoxy molding compound composition, reducing the mass percentage of the coupling agent and removing a plasticizer, the thermal deformation of the molding compound composition can be effectively reduced, and the stability of a packaged product is improved.
    Type: Application
    Filed: December 29, 2022
    Publication date: July 6, 2023
    Inventors: XINWEN WEI, HAOJIE ZHANG, YUESHENG ZHANG, HU PU
  • Patent number: 8309939
    Abstract: When a predetermined region of a target volume is divided into multiple layers in a depth direction of particle beams and particle beams are irradiated, dose calibration is carried out separately for the divided layers.
    Type: Grant
    Filed: May 13, 2008
    Date of Patent: November 13, 2012
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hisashi Harada, Osamu Takahashi, Yue Hu Pu
  • Publication number: 20110012028
    Abstract: When a predetermined region of a target volume is divided into multiple layers in a depth direction of particle beams and particle beams are irradiated, dose calibration is carried out separately for the divided layers.
    Type: Application
    Filed: May 13, 2008
    Publication date: January 20, 2011
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hisashi Harada, Osamu Takahashi, Yue Hu Pu