Patents by Inventor Hu SHI

Hu SHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240163118
    Abstract: A blockchain-based data processing method, performed by a side chain node, includes obtaining a transaction on-chain request carrying a business transaction transmitted by a business device, determining a transaction execution result corresponding to the business transaction based on the transaction on-chain request, and performing on-chain processing on the transaction execution result and the business transaction; generating business transaction digest information corresponding to the business transaction based on a transaction sequence number, a business type identifier, and the transaction execution result in response to the transaction execution result and the business transaction being successfully stored in a side blockchain; and transmitting the business transaction digest information to a main blockchain to store the business transaction digest information.
    Type: Application
    Filed: January 24, 2024
    Publication date: May 16, 2024
    Inventors: Hanqing LIU, Zongyou WANG, Hu LAN, Gengliang ZHU, Yifang SHI, Qucheng LIU, Zhiyong LIAO, Jinsong ZHANG, Yingjie GUO
  • Patent number: 11973858
    Abstract: Aspects of the disclosure are directed to a method for use on a blockchain network that includes an accounting node subnetwork having accounting nodes configured to record a data block onto a blockchain and a service node having service nodes configured to verify data blocks recorded by the accounting nodes onto the blockchain. The method can include generating a signature based on transaction information to be included in a data block to be added onto the blockchain by using a key specific to the accounting node. The method can further include adding the transaction information and the generated signature to the data block and adding the data block onto the blockchain, and transmitting the signature to the service nodes in the service node subnetwork, so that the service nodes perform signature verification on the signature based on the key specific to the accounting node.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: April 30, 2024
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Maocai Li, Hu Lan, Zongyou Wang, Kaiban Zhou, Haitao Tu, Jinsong Zhang, Yifang Shi, Changqing Yang, Li Kong, Gengliang Zhu, Yong Ding, Qucheng Liu, Qiuping Chen, Peng Wang
  • Patent number: 11968294
    Abstract: This application provide a data management method for a blockchain system, a medium, and an electronic device. The system includes an accounting node sub-network and a service node sub-network. The method includes: adding, after an accounting node generates a first data block, first key information used for verifying a block header of a second data block generated after the first data block to a block header of the first data block; generating a signature corresponding to the first data block, and adding the signature corresponding to the first data block to the block header of the first data block; and releasing the block header of the first data block to the service node sub-network, to cause a service node to verify the signature included in the block header of the first data block, and obtaining the first key information after a successful verification to verify the block header of the second data block.
    Type: Grant
    Filed: January 13, 2021
    Date of Patent: April 23, 2024
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Maocai Li, Zongyou Wang, Li Kong, Kaiban Zhou, Hu Lan, Yifang Shi, Changqing Yang, Jinsong Zhang, Yong Ding, Gengliang Zhu, Qucheng Liu, Qiuping Chen
  • Publication number: 20240129108
    Abstract: A data processing method performed by a first device includes: generating, in response to first service data satisfying a data uploading condition, a first bit array corresponding to the first service data; encrypting the first bit array through a data key to obtain a ciphertext bit array, the data key being generated by a second device in a data intersection application run in a trusted execution environment of the second device; and transmitting the ciphertext bit array to a blockchain node for forwarding to a second device, for the second device to decrypt, in the data intersection application through the data key, the ciphertext bit array to obtain the first bit array.
    Type: Application
    Filed: December 4, 2023
    Publication date: April 18, 2024
    Inventors: Qucheng LIU, Rui GUO, Jun LIANG, Like SHU, Zongyou WANG, Hu LAN, Yang LU, Hanqing LIU, Jun LI, Hui ZHANG, Gengliang ZHU, Kaixuan NIE, Yifang SHI, Zhiyong LIAO, Yangjun HUANG
  • Publication number: 20240104558
    Abstract: In a blockchain transaction execution method, a first transaction of a first blockchain is received from a proxy program component. The first transaction is based on a second transaction of a second blockchain. A data structure of the first transaction is different from a data structure of the second transaction. The second transaction is extracted from the first transaction. A virtual machine is invoked to execute the second transaction of the second blockchain. An execution result of the second transaction is transmitted to the application via the proxy program component.
    Type: Application
    Filed: October 12, 2023
    Publication date: March 28, 2024
    Applicant: Tencent Technology (Shenzhen) Company Limited
    Inventors: Rui GUO, Zongyou WANG, Yifang SHI, Zhiyong LIAO, Gengliang ZHU, Qucheng LIU, Hanqing LIU, Hu LAN
  • Publication number: 20240097898
    Abstract: In a blockchain data processing method, service updating data of each of a plurality of encrypted data is received. The service updating data of each of the plurality of encrypted data includes encrypted primary key information of the respective encrypted data. Each of the plurality of encrypted data includes service data encrypted by a respective service node of a plurality of service nodes. Service intersection data is generated based on a data intersection of the service updating data of the plurality of encrypted data. The service intersection data is transmitted to a service node of the plurality of service nodes. The service intersection data includes supplemental text data from another service node of the plurality of service nodes.
    Type: Application
    Filed: December 2, 2023
    Publication date: March 21, 2024
    Applicant: Tencent Technology (Shenzhen) Company Limited
    Inventors: Hanqing LIU, Zongyou WANG, Hu LAN, Yifang SHI, Gengliang ZHU, Qucheng LIU, Zhiyong LIAO
  • Patent number: 11924358
    Abstract: This application provides a method for issuing a digital certificate performed by a digital certificate issuing center that includes a public-private key generation module and an authentication module. The method includes: receiving a public-private key request from a node in a blockchain network; generating a public key and a private key of the node by using the public-private key generation module, and transmitting the public and private keys to the node; receiving the public key of the node and registration information of the node, and authenticating the registration information by using the authentication module; and generating, in accordance with a determination that the authentication succeeds, a digital certificate of the node by using the authentication module, and transmitting the digital certificate to the node. The embodiments of this application can improve the probative value of an issued digital certificate, thereby improving the security of data exchange in a blockchain network.
    Type: Grant
    Filed: February 9, 2021
    Date of Patent: March 5, 2024
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Jun Zang, Jianjun Zhang, Luohai Zheng, Junjie Shi, Hujia Chen, Zichao Tang, Yige Cai, Qing Qin, Chuanbing Dai, Hu Lan, Jinlong Chen
  • Publication number: 20240073045
    Abstract: A blockchain-based data processing method, apparatus, and computer-readable medium are provided. Block proposal information is received including a block and a digital signature transmitted by an out-block node. The digital signature is obtained by performing digital signature processing on block header information included in the block. The block header information includes a first Merkel root determined based on transaction data in the block body information. Digest calculation on the block header information is performed to obtain first digest information. De-signature processing is performed on the digital signature to obtain second digest information. A second Merkel root is determined based on the transaction data acquired from the block proposal information when the first digest information and the second digest information are matched. An operation on the block is performed based on a comparison result of the first Merkel root and the second Merkel root.
    Type: Application
    Filed: November 7, 2023
    Publication date: February 29, 2024
    Applicant: Tencent Technology (Shenzhen) Company Limited
    Inventors: Qucheng LIU, Zongyou WANG, Jinsong ZHANG, Gengliang ZHU, Yifang SHI, Hanqing LIU, Yingjie GUO, Zhiyong LIAO, Hu LAN
  • Patent number: 11917918
    Abstract: Fingerprint identification modules, methods for forming the fingerprint identification modules and electronic devices are provided. The method may include providing a substrate, containing a signal process circuit formed therein; providing a carrier substrate; forming one or more piezoelectric transducers on the carrier substrate, wherein a piezoelectric transducer of the one or more piezoelectric transducers includes a first electrode, a piezoelectric layer on the first electrode and a second electrode on the piezoelectric layer; forming a permanent bonding layer, containing one or more cavities, on one of the carrier substrate and the substrate; bonding the carrier substrate with the substrate using the permanent bonding layer, wherein the permanent bonding layer is between the one or more piezoelectric transducers and the substrate, and each piezoelectric transducer covers one cavity; and removing the carrier substrate.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: February 27, 2024
    Assignee: NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
    Inventors: Hu Shi, Mengbin Liu, Yanghui Xiang
  • Patent number: 11917057
    Abstract: The present disclosure includes a method for processing distributed data. In the method, the distributed data of a first main body is obtained. The distributed data has a transfer identifier. The distributed data is transferred, in response to a second main body different from the first main body, to a management address based on the transfer identifier when the distributed data meets a first condition. The first condition is that the distributed data includes abnormal information. The distributed data transferred to the management address freezes transfer of the distributed data by the first main body.
    Type: Grant
    Filed: June 1, 2021
    Date of Patent: February 27, 2024
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Maocai Li, Zongyou Wang, Hu Lan, Yifang Shi
  • Publication number: 20240007775
    Abstract: The present disclosure provides a service resource configuration method, including: configuring resource parameters for a service to be configured according to an action policy, calculating a timely reward in a current state, performing IV analysis according to the action policy, and ending one episode after the IV analysis is completed; calculating and updating, according to the timely reward in each state, an optimization objective policy parameter in each state; iterating a preset number of episodes to calculate and update the optimization objective policy parameter in each state; determining, according to the optimization objective policy parameter in each state in the preset number of episodes, an optimal optimization objective policy parameter in each state; and updating the action policy according to the optimal optimization objective policy parameter in each state.
    Type: Application
    Filed: November 9, 2021
    Publication date: January 4, 2024
    Inventors: Dajiang WANG, Youdao YE, Xiaojian LI, Hu SHI, Zhenyu WANG
  • Publication number: 20230263302
    Abstract: Disclosed are a fireproof cabinet body structure and a fireproof safety cabinet. The fireproof cabinet body structure comprises a cabinet body, the cabinet body comprises an inner panel, a gypsum board and a keel frame, and the inner panel and the gypsum board are fixedly mounted on two sides of the keel frame. The fireproof safety cabinet comprises a cabinet body and a cabinet door, the cabinet body is provided with an air inlet and an air outlet, ventilation fire-retardant valves are mounted at the air inlet and the air outlet, an inner side of the cabinet body is provided with an air supply opening corresponding to the air inlet and an air return opening corresponding to the air outlet, and the cabinet body is provided with electrostatic grounding bolts connected with the keel frame at the top part and/or side part of the cabinet body.
    Type: Application
    Filed: March 22, 2023
    Publication date: August 24, 2023
    Applicant: Justrite Safety Technology (Wuxi) Co., Ltd.
    Inventors: Ji SUN, Hu SHI, Chunxia LYV
  • Publication number: 20230069675
    Abstract: A power-assisted negative pressure type flexible exoskeleton system used for an extravehicular spacesuit. The system includes an exoskeleton pneumatic control system, a plurality of inertial sensors, a plurality of negative pressure type flexible actuators and a plurality of flexible bending sensors, wherein pneumatic energy is provided for the exoskeleton system by a gas source in the exoskeleton control system, compressed air is cleaned by a water-separating gas filter, normal work of a pneumatic actuating element is guaranteed, a pressure reducing valve and a pressure gauge carry out voltage stability control on the output pressure of the gas source, a two-position two-way valve serves as a gas source switch valve, and three-position three-way valves, proportional pressure valves and the flexible actuators form four pneumatic control loops of the left and right elbow joints and the left and right knee joints of the exoskeleton system.
    Type: Application
    Filed: June 10, 2022
    Publication date: March 2, 2023
    Inventors: Hu Shi, Kun Tan, Xuesong Mei, Tao Geng, Wenqiao Liu
  • Publication number: 20220234323
    Abstract: A system and method for joining a plurality of paper material together with ultrasonic welding to form a hang tab for displaying products, such as, e.g., in a retail environment, without the use of an adhesive, such as, e.g., glue, and/or printing dye or ink. The paper hang tab may replace plastic hooks or tabs, which may be more environmentally beneficial. Two or more pieces of paper may be inserted into a gap between a sonotrode and an anvil of an ultrasonic joining device. A joining force from an actuator may be applied to secure the pieces of paper, and the sonotrode may oscillate a high-frequency. Adequate compaction of the pieces of paper is produced in addition to a high development of heat from friction generated in the micro-region of the thermoplastic coating. Melting of thermoplastic coating then forms a physical connection between the pieces of paper, effectively fusing them together.
    Type: Application
    Filed: January 27, 2022
    Publication date: July 28, 2022
    Inventors: Hu Shi, Sun Ying
  • Publication number: 20210193903
    Abstract: Fingerprint identification modules, methods for forming the fingerprint identification modules and electronic devices are provided. The method may include providing a substrate, containing a signal process circuit formed therein; providing a carrier substrate; forming one or more piezoelectric transducers on the carrier substrate, wherein a piezoelectric transducer of the one or more piezoelectric transducers includes a first electrode, a piezoelectric layer on the first electrode and a second electrode on the piezoelectric layer; forming a permanent bonding layer, containing one or more cavities, on one of the carrier substrate and the substrate; bonding the carrier substrate with the substrate using the permanent bonding layer, wherein the permanent bonding layer is between the one or more piezoelectric transducers and the substrate, and each piezoelectric transducer covers one cavity; and removing the carrier substrate.
    Type: Application
    Filed: March 9, 2021
    Publication date: June 24, 2021
    Inventors: Hu SHI, Mengbin LIU, Yanghui XIANG
  • Patent number: 10755979
    Abstract: A wafer-level packaging method includes providing a base substrate and providing first chips. A photolithographic bonding layer is formed on the base substrate or on the first chips. First vias are formed in the photolithographic bonding layer. The first chips are pre-bonded to the base substrate through a photolithographic bonding layer with each first chip corresponding to a first via. A thermal compression bonding process is used to bond the first chips to the base substrate such that an encapsulation material fills between adjacent first chips and covers the first chips and the base substrate. The base substrate is etched to form second vias through the base substrate with each second via connected to a first via to form a first conductive via. A first conductive plug is formed in the first conductive via to electrically connect to a corresponding first chip.
    Type: Grant
    Filed: December 30, 2018
    Date of Patent: August 25, 2020
    Assignee: Ningbo Semiconductor International Corporation
    Inventors: Hu Shi, Mengbin Liu
  • Publication number: 20200135689
    Abstract: A wafer-level packaging method using a photolithographic bonding material includes providing a base substrate; providing a plurality of first chips; forming a photolithographic bonding layer on the base substrate or on the first chips; forming a plurality of first vias in the photolithographic bonding layer; pre-bonding the first chips to the base substrate through the photolithographic bonding layer with each first chip corresponding to a first via; using a thermal compression bonding process to bond the first chips to the base substrate such that an encapsulation material fills between adjacent first chips and covers the first chips and the base substrate; etching the base substrate to form a plurality of second vias through the base substrate with each second via connected to a first via to form a first conductive via; and forming a first conductive plug in the first conductive via to electrically connect to a corresponding first chip.
    Type: Application
    Filed: December 30, 2018
    Publication date: April 30, 2020
    Inventors: Hu SHI, Mengbin LIU
  • Patent number: 8508326
    Abstract: The present invention may provide a surge protection device, which may include a reference node, first, second, and third nodes, a first arcing section (GAP) coupled between the first and second nodes, and configured to receive a surge voltage from the first node, a first metal oxide varistor (MOV) coupled between the second and reference nodes, and configured to reduce the surge voltage to a first sub-surge voltage at the second node, a second arcing section (GAP) coupled between the second and third nodes, and configured to receive the first sub-surge voltage from the second node, and a second metal oxide varistor (MOV) coupled between the third and reference nodes, and configured to reduce the first sub-surge voltage to a second sub-surge voltage at the third node.
    Type: Grant
    Filed: November 8, 2011
    Date of Patent: August 13, 2013
    Assignee: Shenzhen Dowin Lighting Technologies Co., Ltd.
    Inventors: Guo Yao Kang, Hui Ping Guo, Bing Yu Shi, Wen Hu Shi, Rong Huang, Ya Ping Guo
  • Publication number: 20120112872
    Abstract: The present invention may provide a surge protection device, which may include a reference node, first, second, and third nodes, a first arcing section (GAP) coupled between the first and second nodes, and configured to receive a surge voltage from the first node, a first metal oxide varistor (MOV) coupled between the second and reference nodes, and configured to reduce the surge voltage to a first sub-surge voltage at the second node, a second arcing section (GAP) coupled between the second and third nodes, and configured to receive the first sub-surge voltage from the second node, and a second metal oxide varistor (MOV) coupled between the third and reference nodes, and configured to reduce the first sub-surge voltage to a second sub-surge voltage at the third node.
    Type: Application
    Filed: November 8, 2011
    Publication date: May 10, 2012
    Applicant: SHENZHEN DOWIN LIGHTNING TECHNOLOGY, CO. LTD.
    Inventors: Guo Yao Kang, Hui Ping Guo, Bing Yu Shi, Wen Hu Shi, Rong Huang, Ya Ping Guo