Abstract: Disclosed are a fireproof cabinet body structure and a fireproof safety cabinet. The fireproof cabinet body structure comprises a cabinet body, the cabinet body comprises an inner panel, a gypsum board and a keel frame, and the inner panel and the gypsum board are fixedly mounted on two sides of the keel frame. The fireproof safety cabinet comprises a cabinet body and a cabinet door, the cabinet body is provided with an air inlet and an air outlet, ventilation fire-retardant valves are mounted at the air inlet and the air outlet, an inner side of the cabinet body is provided with an air supply opening corresponding to the air inlet and an air return opening corresponding to the air outlet, and the cabinet body is provided with electrostatic grounding bolts connected with the keel frame at the top part and/or side part of the cabinet body.

Abstract: A power-assisted negative pressure type flexible exoskeleton system used for an extravehicular spacesuit. The system includes an exoskeleton pneumatic control system, a plurality of inertial sensors, a plurality of negative pressure type flexible actuators and a plurality of flexible bending sensors, wherein pneumatic energy is provided for the exoskeleton system by a gas source in the exoskeleton control system, compressed air is cleaned by a water-separating gas filter, normal work of a pneumatic actuating element is guaranteed, a pressure reducing valve and a pressure gauge carry out voltage stability control on the output pressure of the gas source, a two-position two-way valve serves as a gas source switch valve, and three-position three-way valves, proportional pressure valves and the flexible actuators form four pneumatic control loops of the left and right elbow joints and the left and right knee joints of the exoskeleton system.

Abstract: An OSNR measurement method and apparatus, and a computer storage medium are disclosed. The OSNR measurement method may include: adjusting a measurement light source to an ASE state (S100); adjusting a signal width of the measurement light source to a first width according to a spectral bandwidth of a channel to be measured, and acquiring a total channel power at an OPM point of a receive-end station (S200); adjusting the signal width of the measurement light source to a second width, and acquiring a noise power at the OPM point of the receive-end station (S300), where the second width is less than the first width, and center frequencies of signals corresponding to the first width and the second width are staggered apart from each other; and determining an OSNR of the channel to be measured according to the total channel power and the noise power (S400).

Abstract: Fingerprint identification modules, methods for forming the fingerprint identification modules and electronic devices are provided. The method may include providing a substrate, containing a signal process circuit formed therein; providing a carrier substrate; forming one or more piezoelectric transducers on the carrier substrate, wherein a piezoelectric transducer of the one or more piezoelectric transducers includes a first electrode, a piezoelectric layer on the first electrode and a second electrode on the piezoelectric layer; forming a permanent bonding layer, containing one or more cavities, on one of the carrier substrate and the substrate; bonding the carrier substrate with the substrate using the permanent bonding layer, wherein the permanent bonding layer is between the one or more piezoelectric transducers and the substrate, and each piezoelectric transducer covers one cavity; and removing the carrier substrate.

Abstract: The present disclosure provides a service resource configuration method, including: configuring resource parameters for a service to be configured according to an action policy, calculating a timely reward in a current state, performing IV analysis according to the action policy, and ending one episode after the IV analysis is completed; calculating and updating, according to the timely reward in each state, an optimization objective policy parameter in each state; iterating a preset number of episodes to calculate and update the optimization objective policy parameter in each state; determining, according to the optimization objective policy parameter in each state in the preset number of episodes, an optimal optimization objective policy parameter in each state; and updating the action policy according to the optimal optimization objective policy parameter in each state.

Abstract: Disclosed are a fireproof cabinet body structure and a fireproof safety cabinet. The fireproof cabinet body structure comprises a cabinet body, the cabinet body comprises an inner panel, a gypsum board and a keel frame, and the inner panel and the gypsum board are fixedly mounted on two sides of the keel frame. The fireproof safety cabinet comprises a cabinet body and a cabinet door, the cabinet body is provided with an air inlet and an air outlet, ventilation fire-retardant valves are mounted at the air inlet and the air outlet, an inner side of the cabinet body is provided with an air supply opening corresponding to the air inlet and an air return opening corresponding to the air outlet, and the cabinet body is provided with electrostatic grounding bolts connected with the keel frame at the top part and/or side part of the cabinet body.

Abstract: A power-assisted negative pressure type flexible exoskeleton system used for an extravehicular spacesuit. The system includes an exoskeleton pneumatic control system, a plurality of inertial sensors, a plurality of negative pressure type flexible actuators and a plurality of flexible bending sensors, wherein pneumatic energy is provided for the exoskeleton system by a gas source in the exoskeleton control system, compressed air is cleaned by a water-separating gas filter, normal work of a pneumatic actuating element is guaranteed, a pressure reducing valve and a pressure gauge carry out voltage stability control on the output pressure of the gas source, a two-position two-way valve serves as a gas source switch valve, and three-position three-way valves, proportional pressure valves and the flexible actuators form four pneumatic control loops of the left and right elbow joints and the left and right knee joints of the exoskeleton system.

Abstract: A system and method for joining a plurality of paper material together with ultrasonic welding to form a hang tab for displaying products, such as, e.g., in a retail environment, without the use of an adhesive, such as, e.g., glue, and/or printing dye or ink. The paper hang tab may replace plastic hooks or tabs, which may be more environmentally beneficial. Two or more pieces of paper may be inserted into a gap between a sonotrode and an anvil of an ultrasonic joining device. A joining force from an actuator may be applied to secure the pieces of paper, and the sonotrode may oscillate a high-frequency. Adequate compaction of the pieces of paper is produced in addition to a high development of heat from friction generated in the micro-region of the thermoplastic coating. Melting of thermoplastic coating then forms a physical connection between the pieces of paper, effectively fusing them together.

Abstract: Fingerprint identification modules, methods for forming the fingerprint identification modules and electronic devices are provided. The method may include providing a substrate, containing a signal process circuit formed therein; providing a carrier substrate; forming one or more piezoelectric transducers on the carrier substrate, wherein a piezoelectric transducer of the one or more piezoelectric transducers includes a first electrode, a piezoelectric layer on the first electrode and a second electrode on the piezoelectric layer; forming a permanent bonding layer, containing one or more cavities, on one of the carrier substrate and the substrate; bonding the carrier substrate with the substrate using the permanent bonding layer, wherein the permanent bonding layer is between the one or more piezoelectric transducers and the substrate, and each piezoelectric transducer covers one cavity; and removing the carrier substrate.

Abstract: A wafer-level packaging method includes providing a base substrate and providing first chips. A photolithographic bonding layer is formed on the base substrate or on the first chips. First vias are formed in the photolithographic bonding layer. The first chips are pre-bonded to the base substrate through a photolithographic bonding layer with each first chip corresponding to a first via. A thermal compression bonding process is used to bond the first chips to the base substrate such that an encapsulation material fills between adjacent first chips and covers the first chips and the base substrate. The base substrate is etched to form second vias through the base substrate with each second via connected to a first via to form a first conductive via. A first conductive plug is formed in the first conductive via to electrically connect to a corresponding first chip.

Abstract: A wafer-level packaging method using a photolithographic bonding material includes providing a base substrate; providing a plurality of first chips; forming a photolithographic bonding layer on the base substrate or on the first chips; forming a plurality of first vias in the photolithographic bonding layer; pre-bonding the first chips to the base substrate through the photolithographic bonding layer with each first chip corresponding to a first via; using a thermal compression bonding process to bond the first chips to the base substrate such that an encapsulation material fills between adjacent first chips and covers the first chips and the base substrate; etching the base substrate to form a plurality of second vias through the base substrate with each second via connected to a first via to form a first conductive via; and forming a first conductive plug in the first conductive via to electrically connect to a corresponding first chip.

Abstract: The present invention may provide a surge protection device, which may include a reference node, first, second, and third nodes, a first arcing section (GAP) coupled between the first and second nodes, and configured to receive a surge voltage from the first node, a first metal oxide varistor (MOV) coupled between the second and reference nodes, and configured to reduce the surge voltage to a first sub-surge voltage at the second node, a second arcing section (GAP) coupled between the second and third nodes, and configured to receive the first sub-surge voltage from the second node, and a second metal oxide varistor (MOV) coupled between the third and reference nodes, and configured to reduce the first sub-surge voltage to a second sub-surge voltage at the third node.

Abstract: The present invention may provide a surge protection device, which may include a reference node, first, second, and third nodes, a first arcing section (GAP) coupled between the first and second nodes, and configured to receive a surge voltage from the first node, a first metal oxide varistor (MOV) coupled between the second and reference nodes, and configured to reduce the surge voltage to a first sub-surge voltage at the second node, a second arcing section (GAP) coupled between the second and third nodes, and configured to receive the first sub-surge voltage from the second node, and a second metal oxide varistor (MOV) coupled between the third and reference nodes, and configured to reduce the first sub-surge voltage to a second sub-surge voltage at the third node.