Patents by Inventor Hu Wei
Hu Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240395571Abstract: An apparatus for cleaning a package device is provided. The apparatus includes a package device loader; a package device unloader; a first cleaning area disposed between the package device loader and the package device unloader; and a conveyor. The conveyor includes a frame extending from the package device loader to the package device unloader and through the first cleaning area; and a belt wrapping the frame, wherein the belt includes a movable upper surface between the package device loader and the package device unloader, wherein the movable upper surface is configured to move relative to and over the frame, and a first distance between the movable upper surface and the frame in the first cleaning area increases in a direction from the package device loader to the package device unloader.Type: ApplicationFiled: July 31, 2024Publication date: November 28, 2024Inventors: Ying-Hao Wang, Chien-Lung Chen, Chien-Chi Tzeng, Meng-Fu Shih, Hu-Wei Lin
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Publication number: 20240019031Abstract: The present invention discloses a flow regulating push switch conjoined valve, comprising a valve housing, a flow regulation assembly and a push switch assembly. The valve housing has a first chamber and a second chamber which are isolated from each other, a communication channel is disposed between the first chamber and the second chamber, and a first connection pipe and a second connection pipe are devised on the valve housing. The first connection pipe has a first channel which is in communication with the first chamber and the second connection pipe has a second channel which is in communication with the second chamber. The flow regulation assembly is installed in the first chamber for regulating a flow rate of a fluid between the first channel and the communication channel. The push switch assembly is installed in the second chamber for controlling connection and disconnection of a flow path between the second channel and the communication channel.Type: ApplicationFiled: July 12, 2023Publication date: January 18, 2024Inventor: Hu Wei
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Publication number: 20230386875Abstract: An under boat support (UBS) includes an electrostatic discharge (ESD) safe ceramic body and a conductive body. The ESD safe ceramic body is coupled to a surface of the conductive body by an adhesive, which may be resistant to high temperatures. A plurality of springs are present within the adhesive and extend from the surface of the conductive body to a surface of the ESD safe ceramic body. For example, first ends of the plurality of springs are electrically coupled to the surface of the conductive body, and second ends of the plurality of springs, which are opposite to corresponding ones of the first ends of the plurality of springs, are electrically coupled to the surface of the ESD safe ceramic body. The plurality of springs form electrical pathways such that the ESD safe ceramic body is electrically coupled to the conductive body.Type: ApplicationFiled: January 31, 2023Publication date: November 30, 2023Inventors: Ying-Hao WANG, Chien-Lung CHEN, Wei-Hao CHEN, Chien-Chi TZENG, Hu-Wei LIN
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Publication number: 20230377910Abstract: An apparatus for cleaning a package device is provided. The apparatus includes a package device loader; a package device unloader; a first cleaning area disposed between the package device loader and the package device unloader; and a conveyor. The conveyor includes a frame extending from the package device loader to the package device unloader and through the first cleaning area; and a belt wrapping the frame, wherein the belt includes a movable upper surface between the package device loader and the package device unloader, wherein the movable upper surface is configured to move relative to and over the frame, and a first distance between the movable upper surface and the frame in the first cleaning area increases in a direction from the package device loader to the package device unloader.Type: ApplicationFiled: May 23, 2022Publication date: November 23, 2023Inventors: Ying-Hao Wang, Chien-Lung Chen, Chien-Chi Tzeng, Meng-Fu Shih, Hu-Wei Lin
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Publication number: 20230351577Abstract: A method includes forming a package component, the package component comprising an integrated circuit die, attaching the package component to a package substrate; placing a heat spreader over the package component and the package substrate to form an integrated circuit package, wherein a height of the integrated circuit package is in a range from 2.5 mm to 6 mm, and performing a first automatic optical inspection (AOI) process on the integrated circuit package using an AOI apparatus to determine if the orientation and alignment of the heat spreader with regards to the package substrate is within specification, wherein the AOI apparatus comprises a lens that has a maximum depth of field that is greater than the height of the integrated circuit package, and wherein during the first AOI process the depth of field encompasses an entirety of the height of the integrated circuit package.Type: ApplicationFiled: April 27, 2022Publication date: November 2, 2023Inventors: I-Hsuan Chen, Ying-Hao Wang, Chien-Lung Chen, Chien-Chi Tzeng, Hu-Wei Lin
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Patent number: 11562968Abstract: The present disclosure relates a lithographic substrate marking tool. The tool includes a first electromagnetic radiation source disposed within a housing and configured to generate a first type of electromagnetic radiation. A radiation guide is configured to provide the first type of electromagnetic radiation to a photosensitive material over a substrate. A second electromagnetic radiation source is disposed within the housing and is configured to generate a second type of electromagnetic radiation that is provided to the photosensitive material.Type: GrantFiled: May 3, 2019Date of Patent: January 24, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hu-Wei Lin, Chih-Hsien Hsu, Yu-Wei Chiu, Hai-Yin Chen, Ying-Hao Wang, Yu-Hen Wu
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Patent number: 10489471Abstract: Disclosed is a recommendation method and device.Type: GrantFiled: September 21, 2016Date of Patent: November 26, 2019Assignee: ALIBABA GROUP HOLDING LIMITEDInventors: Junwu Xiong, Zhongyi Liu, Hu Wei
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Patent number: 10460373Abstract: Disclosed is a recommendation method and apparatus. The recommendation method comprises: identifying at least one core user of a network service provider and a set of users who have demonstrated one or more network-related behaviors with respect to a first predetermined association item; sampling the set of users to identify a set of sample users; calculating a similarity between the sample users to identify a list of similar users; and sending a recommendation of potential users to a network service provider, the recommendation of potential users based on the list of similar users and the at least one core user of a network service provider. Potential users may be efficiently recommended to a network service provider.Type: GrantFiled: November 15, 2016Date of Patent: October 29, 2019Assignee: ALIBABA GROUP HOLDING LIMITEDInventors: Chao Yang, Na Ni, Zhongyi Liu, Hu Wei
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Publication number: 20190259710Abstract: The present disclosure relates a lithographic substrate marking tool. The tool includes a first electromagnetic radiation source disposed within a housing and configured to generate a first type of electromagnetic radiation. A radiation guide is configured to provide the first type of electromagnetic radiation to a photosensitive material over a substrate. A second electromagnetic radiation source is disposed within the housing and is configured to generate a second type of electromagnetic radiation that is provided to the photosensitive material.Type: ApplicationFiled: May 3, 2019Publication date: August 22, 2019Inventors: Hu-Wei Lin, Chih-Hsien Hsu, Yu-Wei Chiu, Hai-Yin Chen, Ying-Hao Wang, Yu-Hen Wu
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Patent number: 10283457Abstract: The present disclosure relates a method of forming substrate identification marks. In some embodiments, the method may be performed by forming a photosensitive material over a substrate. A first type of electromagnetic radiation is selectively provided to the photosensitive material to expose a plurality of substrate identification marks within the photosensitive material, and a second type of electromagnetic radiation is selectively provided to the photosensitive material to expose one or more alignment marks within the photosensitive material. Exposed portions of the photosensitive material are removed to form a patterned photosensitive material. The substrate is etched according to the patterned photosensitive material to form recesses within the substrate that are defined by the plurality of substrate identification marks and the one or more alignment marks.Type: GrantFiled: August 28, 2018Date of Patent: May 7, 2019Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Hu-Wei Lin, Chih-Hsien Hsu, Yu-Wei Chiu, Hai-Yin Chen, Ying-Hao Wang, Yu-Hen Wu
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Patent number: 10283456Abstract: In some embodiments, the present disclosure relates a lithographic substrate marking tool. The lithographic substrate marking tool has a first lithographic exposure tool arranged within a shared housing and configured to generate a first type of electromagnetic radiation during a plurality of exposures. A mobile reticle has a plurality of different reticle fields respectively configured to block a portion of the first type of electromagnetic radiation to expose a substrate identification mark within a photosensitive material overlying a semiconductor substrate. A transversal element is configured to move the mobile reticle so that separate ones of the plurality of reticle fields are exposed onto the photosensitive material during separate ones of the plurality of exposures.Type: GrantFiled: May 13, 2016Date of Patent: May 7, 2019Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Hu-Wei Lin, Chih-Hsien Hsu, Yu-Wei Chiu, Hai-Yin Chen, Ying-Hao Wang, Yu-Hen Wu
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Publication number: 20180366415Abstract: The present disclosure relates a method of forming substrate identification marks. In some embodiments, the method may be performed by forming a photosensitive material over a substrate. A first type of electromagnetic radiation is selectively provided to the photosensitive material to expose a plurality of substrate identification marks within the photosensitive material, and a second type of electromagnetic radiation is selectively provided to the photosensitive material to expose one or more alignment marks within the photosensitive material. Exposed portions of the photosensitive material are removed to form a patterned photosensitive material. The substrate is etched according to the patterned photosensitive material to form recesses within the substrate that are defined by the plurality of substrate identification marks and the one or more alignment marks.Type: ApplicationFiled: August 28, 2018Publication date: December 20, 2018Inventors: Hu-Wei Lin, Chih-Hsien Hsu, Yu-Wei Chiu, Hai-Yin Chen, Ying-Hao Wang, Yu-Hen Wu
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Patent number: 9819900Abstract: Method and apparatus for de-interlacing a television signal are provided. The method includes: determining whether a pixel to be interpolated is in a strictly static mode; if it is in the strictly static mode, obtaining a pixel value of a first pixel in a previous field which corresponds to the pixel to be interpolated, and setting a pixel value of the pixel to be interpolated to be equal to the pixel value of the first pixel; if it is not in the strictly static mode, determining gradient bands along a plurality of directions by taking the pixel to be interpolated as a center, determining a direction of the pixel to be interpolated based on the gradient bands, and setting the pixel value of the pixel to be interpolated by interpolation based on the direction. Accuracy of the pixel value of the pixel to be interpolated may be improved.Type: GrantFiled: August 11, 2016Date of Patent: November 14, 2017Assignee: SPREADTRUM COMMUNICATIONS (SHANGHAI) CO., LTD.Inventors: Hong Zhou, Hu Wei, Xiaowei Luo, Sen Wang, Minjie Chen, Jun Zhu, Duan Xue, Fuhuei Lin
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Patent number: 9720325Abstract: A method includes rotating a wafer at a first speed for a first time duration. The wafer is rotated at a second speed that is lower than the first speed for a second time duration after the first time duration. The wafer is rotated at a third speed that is higher than the second speed for a third time duration after the second time duration. A photoresist is dispensed on the wafer during the first time duration and at least a portion of a time interval that includes the second time duration and the third time duration.Type: GrantFiled: September 17, 2013Date of Patent: August 1, 2017Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hsien Hsu, Hong-Hsing Chou, Hu-Wei Lin, Chi-Jen Hsieh, Jr-Wei Ye, Yuan-Ting Huang, Ching-Hsing Chiang, Hua-Kuang Teng, Yen-Chen Lin, Carolina Poe, Tsung-Cheng Huang, Chia-Hung Chu
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Publication number: 20170195621Abstract: Method and apparatus for de-interlacing a television signal are provided. The method includes: determining whether a pixel to be interpolated is in a strictly static mode; if it is in the strictly static mode, obtaining a pixel value of a first pixel in a previous field which corresponds to the pixel to be interpolated, and setting a pixel value of the pixel to be interpolated to be equal to the pixel value of the first pixel; if it is not in the strictly static mode, determining gradient bands along a plurality of directions by taking the pixel to be interpolated as a center, determining a direction of the pixel to be interpolated based on the gradient bands, and setting the pixel value of the pixel to be interpolated by interpolation based on the direction. Accuracy of the pixel value of the pixel to be interpolated may be improved.Type: ApplicationFiled: August 11, 2016Publication date: July 6, 2017Inventors: Hong ZHOU, Hu WEI, Xiaowei LUO, Sen WANG, Minjie CHEN, Jun ZHU, Duan XUE, Fuhuei LIN
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Publication number: 20170140454Abstract: Disclosed is a recommendation method and apparatus. The recommendation method comprises: identifying at least one core user of a network service provider and a set of users who have demonstrated one or more network-related behaviors with respect to a first predetermined association item; sampling the set of users to identify a set of sample users; calculating a similarity between the sample users to identify a list of similar users; and sending a recommendation of potential users to a network service provider, the recommendation of potential users based on the list of similar users and the at least one core user of a network service provider. Potential users may be efficiently recommended to a network service provider.Type: ApplicationFiled: November 15, 2016Publication date: May 18, 2017Inventors: Chao YANG, Na NI, Zhongyi LIU, Hu WEI
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Publication number: 20170117227Abstract: In some embodiments, the present disclosure relates a lithographic substrate marking tool. The lithographic substrate marking tool has a first lithographic exposure tool arranged within a shared housing and configured to generate a first type of electromagnetic radiation during a plurality of exposures. A mobile reticle has a plurality of different reticle fields respectively configured to block a portion of the first type of electromagnetic radiation to expose a substrate identification mark within a photosensitive material overlying a semiconductor substrate. A transversal element is configured to move the mobile reticle so that separate ones of the plurality of reticle fields are exposed onto the photosensitive material during separate ones of the plurality of exposures.Type: ApplicationFiled: May 13, 2016Publication date: April 27, 2017Inventors: Hu-Wei Lin, Chih-Hsien Hsu, Yu-Wei Chiu, Hai-Yin Chen, Ying-Hao Wang, Yu-Hen Wu
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Publication number: 20170103133Abstract: Disclosed is a recommendation method and device.Type: ApplicationFiled: September 21, 2016Publication date: April 13, 2017Inventors: Junwu XIONG, Zhongyi LIU, Hu WEI
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Patent number: 9575012Abstract: In semiconductor fabrication processes, one or more wafers are often exposed to processes such as chemical vapor deposition to form semiconductor components thereupon. Often, some of the wafers exhibit flaws due to contamination or processing errors occurring before, during, or after component formation. Inspection of the wafers is often performed by direct visual inspection of humans, which is prone to errors due to flaws that are too small to view directly; to particles naturally arising in the human eye; and to fatigue caused by inspection of large numbers of wafers. Presented herein are inspection techniques involving positioning the wafer in a dark chamber exposing the surface of the wafer to a light source at a first angle, and capturing with a camera an image of the light source reflected from the surface of the wafer at a second angle. Wafers identified as exhibiting flaws are removed from the wafer set.Type: GrantFiled: September 27, 2013Date of Patent: February 21, 2017Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Hu-Wei Lin, Hsiao-Yu Chen, Jr-Wei Ye, Hong-Hsing Chou, Chih-Hsien Hsu, Tsung-Cheng Huang, Hua-Kuang Teng, Hsieh Chi-Jen, Chun-Chih Chen
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Patent number: 9554735Abstract: A system for determining the concentration of an analyte in at least one body fluid in body tissue comprises an infrared light source, a body tissue interface, a detector, and a central processing unit. The body tissue interface is adapted to contact body tissue and to deliver light from the infrared light source to the contacted body tissue. The detector is adapted to receive spectral information corresponding to infrared light transmitted through the portion of body tissue being analyzed and to convert the received spectral information into an electrical signal indicative of the received spectral information. The central processing unit is adapted to compare the electrical signal to an algorithm built upon correlation with the analyte in body fluid, the algorithm adapted to convert the received spectral information into the concentration of the analyte in at least one body fluid.Type: GrantFiled: April 26, 2013Date of Patent: January 31, 2017Assignee: Ascensia Diabetes Care Holdings AGInventors: Mihailo V. Rebec, James E. Smous, Steven D. Brown, Hu-Wei Tan