Patents by Inventor Hua A. Zeng
Hua A. Zeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8823389Abstract: A method for identifying EMI sources in a system having a plurality of electrical components connected together by cables wherein each set of two electrical components connected by a cable forms a potential EMI source. A plurality of antennas are positioned around the vehicle and the EMI from each antenna is measured over a plurality of frequencies and the frequencies having an EMI greater than a predetermined threshold and a measurement profile of the received EMI versus the antennas for each of the identified frequencies is created. EMI reception is then simulated for each potential EMI source and a simulation profile of the received EMI versus the antennas is plotted for each potential EMI source. The actual source of the EMI is then identified by comparing the measurement profile with the simulation profile for the potential EMI sources at each frequency to determine a match of the profiles.Type: GrantFiled: August 29, 2012Date of Patent: September 2, 2014Assignee: Hitachi, Ltd.Inventors: Masayoshi Takahashi, Hua Zeng
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Publication number: 20140166657Abstract: A packing assembly for transporting workpieces which have a plurality of pins, includes at least one packing member. Each packing member includes a top wall which includes at least one packing portion. Each packing portion defines a plurality of receiving grooves for receiving the workpieces. In each receiving groove, a bottom surface and two side surfaces are defined. The two side surfaces extend from opposite sides of the bottom surface. Each packing portion further includes a plurality of connecting surfaces. Each connecting surface connects two adjacent side surfaces of two adjacent receiving grooves, and defines a retrieving groove for facilitating the picking up and extraction of each workpiece. The bottom surface defines a plurality of passing-through holes for receiving and protecting the plurality of pins of the workpieces during transport.Type: ApplicationFiled: December 8, 2013Publication date: June 19, 2014Applicants: HON HAI PRECISION INDUSTRY CO., LTD., FU DING ELECTRONICAL TECHNOLOGY (JIASHAN) CO.,LTD.Inventor: JI-HUA ZENG
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Patent number: 8698571Abstract: In a vehicle network for controlling electronic devices of the type having a network driver with at least one output line connected to the network through a common mode choke. A circuit for improving the immunity of the network includes a resistor and a capacitor connected in series between the signal output line and ground. The series resistor and capacitor protect the network from communication errors.Type: GrantFiled: March 30, 2011Date of Patent: April 15, 2014Assignee: Hitachi, Ltd.Inventors: Masayoshi Takahashi, Hua Zeng
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Publication number: 20140062502Abstract: A method for identifying EMI sources in a system having a plurality of electrical components connected together by cables wherein each set of two electrical components connected by a cable forms a potential EMI source. A plurality of antennas are positioned around the vehicle and the EMI from each antenna is measured over a plurality of frequencies and the frequencies having an EMI greater than a predetermined threshold and a measurement profile of the received EMI versus the antennas for each of the identified frequencies is created. EMI reception is then simulated for each potential EMI source and a simulation profile of the received EMI versus the antennas is plotted for each potential EMI source. The actual source of the EMI is then identified by comparing the measurement profile with the simulation profile for the potential EMI sources at each frequency to determine a match of the profiles.Type: ApplicationFiled: August 29, 2012Publication date: March 6, 2014Applicant: Hitachi, LtdInventors: Masayoshi Takahashi, Hua Zeng
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Publication number: 20130118875Abstract: The Present Disclosure provides a touch panel, which consists of a main panel and a light-emitting touch module mounted under the main panel. The light-emitting touch module consists of a first circuit board provided with a plethora of touch sensors and light-emitting devices under the main panel. These touch sensors are used to induce the approaching signals of the operator, and transmit the induction signals to a touch control circuit for controlling the light-emitting status of the corresponding light-emitting device. The light-emitting touch module also consists of a second circuit board, electrically connected with the first circuit board. The touch control circuit is provided on the second circuit board, spatially separated from the first circuit board by a certain distance, so that the electromagnetic interferences of the touch control circuit on the touch sensors may be reduced.Type: ApplicationFiled: May 7, 2012Publication date: May 16, 2013Applicant: MOLEX INCORPORATEDInventors: Qiang Wang, Zhi-Hua Zeng, Chong-Jun Li, Bing-Quan Fan
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Publication number: 20130082522Abstract: A system for reducing electromagnetic noise generated by common mode currents in electrical connections of a power inverter and battery in an electric or hybrid electric vehicle. A pair of spaced apart electrical conductors extends along the vehicle chassis and electrically connects the power inverter to the battery. An electrically conductive metal plate is positioned in between the spaced apart electrical conductors. This metal plate is electrically connected to the chassis adjacent at least both of the power inverter and the battery/motor. Besides this, more connecting points are required to keep the distance between two points less than half wavelength of the maximum frequency of EMI requirements, and most preferably this metal plate is electrically connected to the chassis all the way with infinite connecting points. The metal plate is positioned so that the metal plate is closer to the electrical conductors than the space in between the electrical conductors and the vehicle chassis.Type: ApplicationFiled: October 4, 2011Publication date: April 4, 2013Applicant: Hitachi, LtdInventors: Hua Zeng, Masayoshi Takahashi
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Publication number: 20120280937Abstract: The Present Disclosure proposes a touch panel, comprising a main panel and a light-emitting touch module mounted below the main panel. A combination touch area and a plurality of sub display units corresponding to the combination touch area are arranged on the main panel. The light-emitting touch module at least comprises a first circuit board and a touch control circuit. The first circuit board is correspondingly provided with a plurality of continuously arrayed touch sensors below the combination touch area and correspondingly provided with light-emitting devices below the sub display units. These touch sensors can be used for sensing a proximity signal and sending the sensed signal to the touch control circuit to control the light-emitting state of the light-emitting device below each sub display unit.Type: ApplicationFiled: May 7, 2012Publication date: November 8, 2012Applicant: MOLEX INCORPORATEDInventors: Qiang Wang, Zhi-Hua Zeng, Chong-Jun Li, Bing-Quan Fan
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Publication number: 20120280936Abstract: The Present Disclosure provides a touch panel, comprising a main panel and a light-emitting touch module disposed underneath. The main panel is provided with a plurality of display patterns thereon. A light-emitting touch module includes a first circuit board provided with a plurality of touch sensors, a plurality of light-emitting devices and a plurality of light guiding parts attached to the side edges of the light-emitting devices so as to evenly project the light emitted from the light-emitting devices upward to the display patterns. The light-emitting touch module further comprises a light reflecting part disposed underneath the light guiding parts capable of reflecting the light emitted from the bottom surface of the light guiding parts back to the light guiding parts, which is further projected upward from the display patterns so as to improve the brightness of the patterns.Type: ApplicationFiled: May 7, 2012Publication date: November 8, 2012Applicant: MOLEX INCORPORATEDInventors: Qiang Wang, Zhi-Hua Zeng, Chong-Jun Li, Bing-Quan Fan
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Publication number: 20120249257Abstract: In a vehicle network for controlling electronic devices of the type having a network driver with at least one output line connected to the network through a common mode choke. A circuit for improving the immunity of the network includes a resistor and a capacitor connected in series between the signal output line and ground. The series resistor and capacitor protect the network from communication errors.Type: ApplicationFiled: March 30, 2011Publication date: October 4, 2012Applicant: Hitachi, Ltd.Inventors: Masayoshi Takahashi, Hua Zeng
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Patent number: 8016453Abstract: An LED lamp assembly includes a lamp supporter and an LED lamp supported by the lamp supporter. The LED lamp includes a lamp cover defining a first opening, a reflector received in the lamp cover and defining a second opening, a heat sink secured to a top of the lamp cover and a plurality of LED modules attached on the heat sink. The heat sink has a plurality of heat-conducting faces formed on a periphery thereof and the LED modules are attached on the heat-conducting faces to generate a wide illumination. The heat sink defines a through hole. Heat generated by the LED modules is absorbed by the heat-conducting faces and directly dissipated to an exterior through the first opening of the lamp cover. The first and second openings and the through hole of the heat sink are communicated with each other.Type: GrantFiled: April 10, 2009Date of Patent: September 13, 2011Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Xin-Jian Xiao, Shih-Hsun Wung, Yong-Dong Chen, Jun-Hua Zeng
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Patent number: 7896528Abstract: An LED lamp includes a housing, a bracket snugly received in the housing, a connecting member fixed to a top of the bracket, a heat sink standing on a top of the connecting member, a plurality of LEDs attached an outer surface of the heat sink and an envelope which is placed on the top of the connecting member, encloses the heat sink and the LEDs therein and engages with the housing. The bracket has a connecting plate. A plurality of electronic components is mounted on a front side of the connecting plate and a plurality fins extending from a rear side of the connecting plate. A covering panel is used to cover an opening of the bracket in front of the connecting plate.Type: GrantFiled: June 5, 2008Date of Patent: March 1, 2011Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Jun-Hua Zeng, Yong-Dong Chen, Shih-Hsun Wung
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Patent number: 7810957Abstract: An LED lamp assembly includes an LED lamp and a supporting member supporting the LED lamp. The LED lamp includes a plurality of LED modules and a heat sink supporting and cooling the LED modules. The supporting member includes a pair of supporting arms supporting the LED lamp and pivotably engaging with the heat sink of the LED lamp. The heat sink is rotatable relative to the supporting arms of the supporting member to vary an illumination angle of the LED lamp assembly.Type: GrantFiled: March 24, 2008Date of Patent: October 12, 2010Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Jun-Hua Zeng, Yong-Dong Chen, Shih-Hsun Wung
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Publication number: 20100039807Abstract: An LED lamp assembly includes a lamp supporter and an LED lamp supported by the lamp supporter. The LED lamp includes a lamp cover defining a first opening, a reflector received in the lamp cover and defining a second opening, a heat sink secured to a top of the lamp cover and a plurality of LED modules attached on the heat sink. The heat sink has a plurality of heat-conducting faces formed on a periphery thereof and the LED modules are attached on the heat-conducting faces to generate a wide illumination. The heat sink defines a through hole. Heat generated by the LED modules is absorbed by the heat-conducting faces and directly dissipated to an exterior through the first opening of the lamp cover. The first and second openings and the through hole of the heat sink are communicated with each other.Type: ApplicationFiled: April 10, 2009Publication date: February 18, 2010Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.Inventors: XIN-JIAN XIAO, SHIH-HSUN WUNG, YONG-DONG CHEN, JUN-HUA ZENG
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Publication number: 20090268462Abstract: An LED lamp includes a housing, a bracket snugly received in the housing, a connecting member fixed to a top of the bracket, a heat sink standing on a top of the connecting member, a plurality of LEDs attached an outer surface of the heat sink and an envelope which is placed on the top of the connecting member, encloses the heat sink and the LEDs therein and engages with the housing. The bracket has a connecting plate. A plurality of electronic components is mounted on a front side of the connecting plate and a plurality fins extending from a rear side of the connecting plate. A covering panel is used to cover an opening of the bracket in front of the connecting plate.Type: ApplicationFiled: June 5, 2008Publication date: October 29, 2009Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.Inventors: Jun-Hua Zeng, Yong-Dong Chen, Shih-Hsun Wung
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Publication number: 20090237934Abstract: An LED lamp assembly includes an LED lamp and a supporting member supporting the LED lamp. The LED lamp includes a plurality of LED modules and a heat sink supporting and cooling the LED modules. The supporting member includes a pair of supporting arms supporting the LED lamp and pivotably engaging with the heat sink of the LED lamp. The heat sink is rotatable relative to the supporting arms of the supporting member to vary an illumination angle of the LED lamp assembly.Type: ApplicationFiled: March 24, 2008Publication date: September 24, 2009Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.Inventors: JUN-HUA ZENG, YONG-DONG CHEN, SHIH-HSUN WUNG
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Publication number: 20060023371Abstract: A method of manufacturing a GMR, TMR or CPP GMR sensor having a smooth interface between magnetic and non-magnetic layers to improve sensor performance by exposing a layer to a low energy ion beam prior to depositing a subsequent layer.Type: ApplicationFiled: July 30, 2004Publication date: February 2, 2006Inventors: Phong Chau, James Freitag, Mustafa Pinarbasi, Hua Zeng
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Publication number: 20050068696Abstract: An apparatus having improved hard bias properties of layers of a magnetoresistance sensor is disclosed. Properties of the hard bias layer are improved using a seedlayer structure that includes at least a layer of silicon and a layer comprising chromium or chromium molybdenum. Further, benefits are achieved when the seedlayer structure includes a layer of tantalum.Type: ApplicationFiled: September 30, 2003Publication date: March 31, 2005Inventors: Phong Chau, James Freitag, Mustafa Pinarbasi, Hua Zeng, Howard Zolla
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Publication number: 20050066514Abstract: A method for improving hard bias properties of layers of a magnetoresistance sensor is disclosed. Properties of the hard bias layer are improved using a seedlayer structure that includes at least a first layer of silicon and a second layer comprising chromium or chromium molybdenum. Further, benefits are achieved when the seedlayer structure includes a layer of tantalum.Type: ApplicationFiled: September 30, 2003Publication date: March 31, 2005Inventors: Phong Chau, James Freitag, Mustafa Pinarbasi, Hua Zeng, Howard Zolla
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Patent number: D578694Type: GrantFiled: February 26, 2008Date of Patent: October 14, 2008Assignee: Foxconn Technology Co., Ltd.Inventors: Jun-Hua Zeng, Yong-Dong Chen, Shih-Hsun Wung
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Patent number: D598153Type: GrantFiled: April 21, 2008Date of Patent: August 11, 2009Assignee: Foxconn Technology Co., Ltd.Inventors: Jun-Hua Zeng, Yong-Dong Chen, Shih-Hsun Wung