Patents by Inventor Hua-Bin Chi

Hua-Bin Chi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Vacuum suction membrane for holding silicon wafer
    Patent number: 7070490
    Abstract: A membrane for vacuum suction of a silicon water typically used inside a polishing head. The membrane has a flat main body and a plurality of protrusions each having a spiny shape over the surface of the flat main body. The protrusions are formed in positions that correspond to the holes of a supporting multiple-hole panel. The protrusions on the flat main body lower the suction pressure between the wafer and the membrane somewhat so that wafer unloading failure is minimized.
    Type: Grant
    Filed: March 28, 2002
    Date of Patent: July 4, 2006
    Assignee: United Microelectronics Corp.
    Inventors: Tzu-Shin Chen, Ming-Hsing Kao, Wen-Chin Lin, Hua-Bin Chi
  • Vacuum suction membrane for holding silicon wafer
    Publication number: 20030157870
    Abstract: A membrane for vacuum suction of a silicon water typically used inside a polishing head. The membrane has a flat main body and a plurality of protrusions each having a particle-like profile over the surface of the flat main body. The protrusions are formed in positions that correspond to the holes of a supporting multiple-hole panel. The protrusions on the flat main body lower the suction pressure between the wafer and the membrane somewhat so that wafer unloading failure is minimized.
    Type: Application
    Filed: March 28, 2002
    Publication date: August 21, 2003
    Inventors: Tzu-Shin Chen, Ming-Hsing Kao, Wen-Chin Lin, Hua-Bin Chi