Patents by Inventor Hua Chao

Hua Chao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240129006
    Abstract: Disclosed are example embodiments of methods, apparatuses and systems supporting beam diversity for multimedia broadcast multicast services. A method may comprise receiving information of one or more beams and abeam-specific repetition pattern for at least one of the one or more beams for transmission of a service from a network device, and receiving the service on the at least one of the one or more beams based on the beam-specific repetition pattern.
    Type: Application
    Filed: May 13, 2021
    Publication date: April 18, 2024
    Inventors: Hua CHAO, Yonggang WANG, Naizheng ZHENG
  • Publication number: 20240124241
    Abstract: A transporting device can transport at least one product, the transporting device includes a mounting frame, a driving mechanism, a transmitting mechanism including a plurality of bent portions, a plurality of guiding mechanisms, and a supporting mechanism. Each guiding mechanism includes a rotating wheel and a guiding plate. Each bent portion is connected to the rotating wheel. The guiding plate is connected to the rotating wheel. The supporting mechanism can support the product. The driving mechanism is further connected to the rotating wheel and can drive the transmitting mechanism to rotate to drive the supporting mechanism to move. The driving mechanism is further connected to the guiding plate, the guiding plate and the rotating wheel can synchronously rotate to drive the supporting mechanism to pass through the bent portions. The present disclosure further provides a heating device.
    Type: Application
    Filed: December 27, 2023
    Publication date: April 18, 2024
    Inventors: Huan ZHANG, Qi KUANG, Hua WAN, Yi LIU, Wei-Wei WU, Jing-Chao YANG, Wen-Jin XIA
  • Publication number: 20240113056
    Abstract: A semiconductor package including a first interposer comprising a first substrate, first optical components over the first substrate, a first dielectric layer over the first optical components, and first conductive connectors embedded in the first dielectric layer, a photonic package bonded to a first side of the first interposer, where a first bond between the first interposer and the photonic package includes a dielectric-to-dielectric bond between a second dielectric layer on the photonic package and the first dielectric layer, and a second bond between the first interposer and the photonic package includes a metal-to-metal bond between a second conductive connector on the photonic package and a first one of the first conductive connectors and a first die bonded to the first side of the first interposer.
    Type: Application
    Filed: March 3, 2023
    Publication date: April 4, 2024
    Inventors: Hsing-Kuo Hsia, Chen-Hua Yu, Chih-Wei Tseng, Jui Lin Chao
  • Publication number: 20240103236
    Abstract: A method includes forming an optical engine, which includes a photonic die. The photonic die further includes a grating coupler. The method further includes forming a fiber unit including a fiber platform having a groove, and an optical fiber attached to the fiber platform. The optical fiber extends into the groove. The fiber platform further includes a reflector. The fiber unit is attached to the optical engine, and the reflector is configured to deflect a light beam, so that the light beam emitted by a first one of the optical fiber and the grating coupler is received by a second one of the optical fiber and the grating coupler.
    Type: Application
    Filed: January 3, 2023
    Publication date: March 28, 2024
    Inventors: Chih-Wei Tseng, Jui Lin Chao, Hsing-Kuo Hsia, Chen-Hua Yu
  • Publication number: 20240103218
    Abstract: Optical devices and methods of manufacture are presented in which a laser die or other heterogeneous device is embedded within an optical device and evanescently coupled to other devices. The evanescent coupling can be performed either from the laser die to a waveguide, to an external cavity, to an external coupler, or to an interposer substrate.
    Type: Application
    Filed: January 12, 2023
    Publication date: March 28, 2024
    Inventors: Hsing-Kuo Hsia, Jui Lin Chao, Chen-Hua Yu, Chih-Hao Yu, Shih-Peng Tai
  • Publication number: 20240107781
    Abstract: Optical devices and methods of manufacture are presented in which an opening is formed within a first semiconductor device and then bonded to other optical devices. A laser die or other fill material may be used to refill the opening. The first semiconductor device is then electrically connected to an optical interposer.
    Type: Application
    Filed: March 28, 2023
    Publication date: March 28, 2024
    Inventors: Hsing-Kuo Hsia, Chen-Hua Yu, Jui Lin Chao
  • Publication number: 20240094469
    Abstract: A method includes patterning a top silicon layer in a substrate to form a plurality of photonic devices. The substrate includes the top silicon layer, a first dielectric layer under the top silicon layer, and a semiconductor layer under the first dielectric layer. The method further includes forming a second dielectric layer to embed the plurality of photonic devices therein, forming an interconnect structure over and signally coupling to the plurality of photonic devices, bonding an electronic die to the interconnect structure, thinning the semiconductor layer, and patterning the semiconductor layer that has been thinned to form openings. The openings are filled with a dielectric material to form dielectric regions. Through-vias are formed to penetrate through the dielectric regions to electrically couple to the interconnect structure.
    Type: Application
    Filed: January 6, 2023
    Publication date: March 21, 2024
    Inventors: Hsing-Kuo Hsia, Chen-Hua Yu, Jui Lin Chao
  • Publication number: 20240087879
    Abstract: A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.
    Type: Application
    Filed: November 14, 2023
    Publication date: March 14, 2024
    Inventors: Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai, Xiaomeng Chen
  • Publication number: 20240087057
    Abstract: A power consumption monitoring device includes a sensor, a storage, and a processor. The sensor is configured to detect a power-consuming device quantity and a power consumption amount. The storage is configured to store the power-consuming device quantity and the power consumption amount. The processor is communicatively connected to the sensor and the storage. The processor is configured to calculate a power-consuming device idling indicator based on the power-consuming device quantity and the power consumption amount in a monitoring time interval, wherein the power-consuming device idling indicator is used for indicating a deviation status of the power-consuming device quantity and the power consumption amount. The processor is further configured to determine whether the power-consuming device idling indicator exceeds a warning threshold. In response to the power-consuming device idling indicator exceeding the warning threshold, the processor is further configured to generate a warning message.
    Type: Application
    Filed: December 20, 2022
    Publication date: March 14, 2024
    Inventors: Wei-Chao CHEN, Ming-Chi CHANG, Chih-Pin WEI, Ke-Li WU, Hua-Hsiu CHIANG, Yu-Lun CHANG
  • Publication number: 20240085621
    Abstract: A method includes encapsulating a first device die and a second device die in an encapsulant, and forming an interconnect structure over and electrically connecting to the first device die and the second device die. A waveguide is formed in the interconnect structure. An optical-engine based interconnect component is bonded to the interconnect structure. The optical-engine based interconnect component forms a part of a signal path that connects the first device die to the second device die.
    Type: Application
    Filed: January 6, 2023
    Publication date: March 14, 2024
    Inventors: Hsing-Kuo Hsia, Chen-Hua Yu, Chih-Wei Tseng, Jui Lin Chao
  • Patent number: 11924886
    Abstract: Embodiments of the present disclosure relate to methods, devices and computer readable storage medium for transport block size (TBS) configuration. In example embodiments, a terminal device transmits a random access preamble to a network device. The terminal device receives a random access response from the network device. The random access response includes a resource allocated for a reference TBS. Based on the reference TBS, the terminal device determines a TBS for transmitting data to the network device. Then, the terminal device transmits the data to the network device by using the determined TBS and the allocated resource. This TBS configuration is more flexible.
    Type: Grant
    Filed: April 16, 2018
    Date of Patent: March 5, 2024
    Assignee: NOKIA TECHNOLOGIES OY
    Inventors: Rapeepat Ratasuk, Nitin Mangalvedhe, Haitao Li, Hua Chao, David Bhatoolaul
  • Patent number: 11787610
    Abstract: A child-proof container includes a casing, a drawer, a folded stopper, a rear brace, a front brace, and an elastic flap. The rear brace is connected across a bottom panel of the casing and positioned offset from a rear panel of the casing. The front brace is connected across the bottom panel and positioned offset from a front opening of the casing. The folded stopper being elastically integrated into a base plate of the drawer thus allowing a first lateral plate and a second lateral plate of the drawer to be slidably engaged within the casing. The elastic flap is integrated into the bottom panel so that the folded stopper can be operatively positioned in between the rear panel and the front brace through the elongated flap to selectively position the drawer in a close-locked position, a close-unlocked position, and an opened position.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: October 17, 2023
    Assignee: ZENPACK
    Inventors: Tso Hua Chao, Dominic DiCarlo
  • Patent number: 11737145
    Abstract: A method, an apparatus and a computer readable medium ae disclosed for early data transmission determinations using an uplink grant. The method includes obtaining Radio Resource Control (RRC) signaling to be transmitted to a network device and data to be transmitted with the RRC signaling. The method also includes, in response to receiving a Random Access Response with uplink grant from the network device, determining, based on the uplink grant, whether the data is allowed to be transmitted with the RRC signaling. In addition, the method also includes, in response to determining whether the data is allowed to be transmitted with the RRC signaling, generating a media access control (MAC) packet data unit (PDU) and transmitting the MAC PDU the network device.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: August 22, 2023
    Assignee: NOKIA TECHNOLOGIES OY
    Inventors: Jussi-Pekka Koskinen, Samuli Turtinen, Hua Chao
  • Publication number: 20230133527
    Abstract: Embodiments of the present disclosure relate to methods, devices and computer readable storage medium for transport block size (TBS) configuration. In example embodiments, a terminal device transmits a random access preamble to a network device. The terminal device receives a random access response from the network device. The random access response includes a resource allocated for a reference TBS. Based on the reference TBS, the terminal device determines a TBS for transmitting data to the network device. Then, the terminal device transmits the data to the network device by using the determined TBS and the allocated resource. This TBS configuration is more flexible.
    Type: Application
    Filed: April 16, 2018
    Publication date: May 4, 2023
    Applicant: NOKIA TECHNOLOGIES OY
    Inventors: Rapeepat RATASUK, Nitin MANGALVEDHE, Haitao LI, Hua CHAO, David BHATOOLAUL
  • Publication number: 20220368641
    Abstract: Embodiments of the present disclosure relate to devices, methods, apparatuses and computer readable storage media of the mitigation of inter-stream delay jitter. The method comprises in accordance with a determination that a plurality of data flows are to be transmitted from a second device to a third device, determining, at a first device, an egress port of the third device for the plurality of data flows to pass through based on a traffic class of the plurality of data flows; determining a processing pattern of the plurality of data flows for the egress port, the processing pattern indicating an association between the plurality of data flows; and providing the processing pattern to a second device. In this way, a correct transmission order for packets associated with different QoS flows through a same egress port may be guaranteed, so the inter-stream delay jitter may be mitigated.
    Type: Application
    Filed: October 17, 2019
    Publication date: November 17, 2022
    Inventors: Hua CHAO, He WANG
  • Patent number: 11471457
    Abstract: The present invention relates to a combination of anti-human VEGFR-2 antibodies and human EGFR tyrosine kinase inhibitors for the treatment of T790M-positive EGFR-mutant non-small cell lung cancer.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: October 18, 2022
    Assignees: Eli Lilly and Company, Medimmune Limited
    Inventors: Bo Hua Chao, Sang Min Lee
  • Patent number: 11456811
    Abstract: A wireless communication method of a wireless device is provided, wherein the wireless communication method comprises the steps of: building links with a plurality of electronic devices, respectively; and simultaneously using a time division multiplex mode and a frequency division multiplex mode to communicate with the plurality of electronic devices.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: September 27, 2022
    Assignee: MEDIATEK INC.
    Inventors: Po-Hsun Huang, Juei-Ting Sun, Yu-Ming Wen, Chang-Yi Hsu, Kuan-Hua Chao
  • Publication number: 20220150925
    Abstract: Embodiments of the present disclosure relate to the resource configuration for Narrow Band Internet of Thing (NB-IoT). A method of resource configuration for NB-IoT includes determining, at a network device, whether a configured Uplink Resource (PUR) for transmission from a terminal device to the network device is to be adjusted; in response to determining that the PUR is to be adjusted, determining a set of resources to be allocated for further transmission from the terminal device to the network device based on a Transport Block Size (TBS) associated with the further transmission; generating reconfiguration information of the PUR based on the set of the resources; and transmitting the reconfiguration information to the terminal device. In this way, the resource configuration may be determined and adjusted more efficiently and flexibility compared to the conventional way.
    Type: Application
    Filed: February 22, 2019
    Publication date: May 12, 2022
    Inventors: Hua CHAO, Srinivasan SELVAGANAPATHY
  • Publication number: 20220135291
    Abstract: A child-proof container includes a casing, a drawer, a folded stopper, a rear brace, a front brace, and an elastic flap. The rear brace is connected across a bottom panel of the casing and positioned offset from a rear panel of the casing. The front brace is connected across the bottom panel and positioned offset from a front opening of the casing. The folded stopper being elastically integrated into a base plate of the drawer thus allowing a first lateral plate and a second lateral plate of the drawer to be slidably engaged within the casing. The elastic flap is integrated into the bottom panel so that the folded stopper can be operatively positioned in between the rear panel and the front brace through the elongated flap to selectively position the drawer in a close-locked position, a close-unlocked position, and an opened position.
    Type: Application
    Filed: October 29, 2021
    Publication date: May 5, 2022
    Inventors: Tso Hua Chao, Dominic DiCarlo
  • Publication number: 20220087060
    Abstract: A fan management system includes a fan and a server. The fan includes a driving circuit, and the driving circuit is configured for driving the fan. The fan operates in an operation mode. The server is connected to the fan and is configured for controlling the operation of the fan. The driving circuit outputs a digital label signal when the fan operates abnormally, and the server obtains a production history, an operation information and a warning message of the fan through the digital label signal. The server adjusts the operation mode of the fan according to the warning message simultaneously.
    Type: Application
    Filed: September 14, 2021
    Publication date: March 17, 2022
    Inventors: Chia-Feng Wu, Chien-Sheng Lin, Ming-Lung Liu, Hsin-Ming Hsu, Yun-Hua Chao, Po-Tsun Chen, Yueh-Lung Huang, Jung-Yuan Chen, Yu-Cheng Lin