Abstract: A manufacturing process for a thermally enhanced package is disclosed. First, a substrate strip including at least a substrate is provided. Next, at least a chip is disposed on an upper surface of the substrate, and the chip is electrically connected to the substrate. Then, a prepreg and a heat dissipating metal layer are provided, and the heat dissipating metal layer is disposed on a first surface of the prepreg and a second surface of the prepreg faces toward the chip. Finally, the prepreg covers the chip by laminating the prepreg and the substrate.

Abstract: The invention relates to a sulfur-containing compound and the preparation thereof. The invention also relates to the uses of the sulfur-containing compound in inhibiting inducible nitric oxide synthase and/or cyclooxygenase-2 and in treating the diseases associated with inducible nitric oxide synthase and/or cyclooxygenase-2. This invention also describes a series of chemical analogues of the said sulfur-containing compound and the preparation of these compounds.

Abstract: A packaging substrate and a manufacturing method thereof are provided. The manufacturing method includes following steps. First, a first packaging substrate including several first substrate units and at least one defected substrate unit is provided. Next, the defected substrate unit is separated from the packaging substrate, and at least one opening is formed in a frame of the first packaging substrate correspondingly. Then, a second substrate unit is provided. The shape of the second substrate unit is different from the shape of the opening. Afterwards, the second substrate unit is disposed in the opening.

Abstract: A circuit for controlling a mixed mode controlled oscillator. The circuit comprises a charge pump, and a digital loop filter. The charge pump is coupled to the mixed mode controlled oscillator. The charge pump receives an up/down signal and sends a current signal to the mixed mode controlled oscillator. The digital loop filter receives the up/down signal and generates a digital code signal to the mixed mode controlled oscillator. An output frequency of the mixed mode controlled oscillator is controlled by the current signal and the digital code signal.

Abstract: A packaging substrate and a manufacturing method thereof are provided. The manufacturing method includes following steps. First, a first packaging substrate including several first substrate units and at least one defected substrate unit is provided. Next, the defected substrate unit is separated from the packaging substrate, and at least one opening is formed in a frame of the first packaging substrate correspondingly. Then, a second substrate unit is provided. The shape of the second substrate unit is different from the shape of the opening. Afterwards, the second substrate unit is disposed in the opening.

Abstract: A packaging substrate and a method of manufacturing the same are provided. The method includes following steps. First, a first substrate including at least one defected packaging unit and several first packaging units is provided. The defected packaging unit and the first packaging units are arranged in an array on the first substrate. Next, the defected packaging unit is removed from the first substrate to correspondingly form at least one opening in the first substrate. Then, a second substrate including at least one second packaging unit is provided. Later, the second packaging unit is separated from the second substrate. The area of the second packaging unit is less than that of the opening. Subsequently, the second packaging unit is disposed in the opening. The edge of the second packaging unit is placed partially against an inner wall of the opening.

Abstract: A laser power control system and related method for reducing a settling time in a target laser power transition are disclosed. The laser power control system includes a state decision circuit, for generating a state decision signal according to a selected operational state of a target circuit; a plurality of buffers, for storing a plurality of control data corresponding to a plurality of candidate operational states of the target circuit respectively; and a multiplexer, coupled between the state decision circuit and the buffers, for coupling a selected buffer of the buffers and the target circuit according to the state decision signal for outputting a control datum stored in the selected buffer to the target circuit.

Abstract: A theft protection chair structure for motor vehicles for minimizing the driving space for the driver, includes: a chair having a chair seat and a chair back connected to the chair seat by a pin-jointed structure; a chair driving structure for driving the chair to go forward or backwards toward the driving space, to form a theft protection or a sitting state; and an angular adjustment device for adjusting the slant angle between the chair back and chair seat. When the chair driving structure is in a theft protection state, the angular adjustment device enables the angle between the chair back and chair seat to be an acute angle, then be locked and fixed. Thus, the theft protection effect is provided via the angular adjustment device and chair driving structure to reduce the driving space.

Abstract: The conventional I/O devices of a storage element, such as memory card, have a built-in microprocessor control unit (MCU) for executing the I/O commands. The demand of MCU increases the cost. Besides, the capacity of the storage element supported by the device is depend on the firmware inside the MCU. Since the updating of firmware is a tough job, the supportability is lack of elasticity. This invention discloses a method for driving the I/O device of storage element that strengthens the device driver to get rid of the MCU. The capacity supported hence can be raised by merely updating the device driver.

Abstract: The present invention discloses a graphic user interface (GUI) of a computer software. When users perform the actions of copying, pasting and cutting, the users need to open several windows to perform these actions. The results in that users are persecuted by too many windows. Accordingly, the present invention provides a graphic user interface. The graphic user interface provides two or more divisional windows. The divisional windows are comfortable for user to perform file copying, cutting and pasting.

Abstract: The conventional apparatus for reading/writing storage devices need a built-in microprocessor control unit (MCU) to process commands. Thus, the flexiability (e.g.: supporting capacity of storage device) and the cost of the apparatus are not satisfied. The present invention employs a driver and a hardwire circuit to replace the MCU for money saving without changing other units in the apparatus. Moreover, the apparatus of the present invention can raise the supporting capacity of storage device and compatibility by just updating the driver.

Abstract: A process for testing IC wafer is disclosed. Prior to electrically testing chips on a wafer, the wafer is pre-cut to form a plurality of grooves aligned with the scribe lines on the active surface of the wafer. A step of singulating the wafer is performed to form a plurality of individual chips after completing electrical or reliability test of the chips. Due to the pre-cutting step the chips are still integrated on the wafer for accurately probing and testing. And the testing step can obtain the influence of defects between the test terminals and a UBM layer on the function of the chips.

Abstract: A multi-chip package structure comprising a first chip, a patterned lamination layer, a plurality of first bumps, a second chip and second bumps is provided. The first chip has a first active surface. The patterned lamination layer is disposed on a portion area of the first active surface. The first chip has a plurality of first bonding pads disposed on the first active surface exposed by the patterned lamination layer and the patterned lamination layer has a plurality of second bonding pads disposed thereon. The second chip has a second active surface and the first bumps are disposed on the second active surface. The second chip is electrically connected to the first bonding pads through the first bumps. The second bumps are disposed on the second bonding pads. Moreover, the multi-chip package structure further comprises a component disposed on the first chip and electrically connects to the first bonding pads.

Abstract: The present invention discloses a method of transmitting a first signal and a second signal in a wideband code-division multiple access network, wherein a probability of the appearance of signal bit “1” or “0” in each signal of the first signal and the second signal is remarkably higher than a probability of the appearance of “0” or “1”, the method including: a step of determining constellation points, for determining combinations of different states of the first signal and the second signal and for determining each combination as a constellation point; a step of determining locations of constellation points, for determining a location of each constellation point on I-Q plane based on a priori knowledge of said combination; and a step of transmission, for, after modulating said different combinations in different ways according to the location of each constellation point, transporting them to a user equipment via a physical channel.

Abstract: The present invention discloses a method of transmitting a notification indicator of multimedia broadcast/multicast services in wideband code-division multiple access, the method including: a step of extracting notification indicator information by a radio network controller from a notification message of the multimedia broadcast/multicast services; a step of transmitting the notification indicator information to physical layer and building a notification indicator channel frame via a frame protocol layer; and a step of transmitting the notification indicator channel frame to user terminals via a physical channel. According to the method of transmitting a notification indicator of the present invention, user terminals can accurately read the notification indicator within the time length of one frame, so that the false alarm ratio and transmission power of the notification indicator are reduced.

Abstract: A circuit substrate includes a board, a plurality of metal layers and an insulator. The board has a plurality of conductive traces layers and a via formed therein. The metal layers are formed on the inner wall of the via and each of the metal layers is electrically connected to its corresponding conductive traces layer. The via is filled with the insulator so that each of the metal layers is electrically isolated from each other. In addition, this invention also provides a fabrication method of the circuit substrate.

Abstract: A circuit structure of a redistribution layer (RDL) is suitable for a chip to define the circuits and the contact window required by the following bump process. The RDL is disposed on the active surface of the chip. The circuit structure of the RDL mainly includes a first titanium layer, a second titanium layer and a conductive layer. Wherein, the conductive layer is made of aluminum; the first titanium layer and the second titanium layer cover the two surfaces of the conductive layer, respectively. The connectivity between the first titanium layer or the second titanium layer and a macromolecule polymer is stronger than the connectivity between the conductive layer and the macromolecule polymer, so that the peeling or crack caused by poor connectivity between the conductive layer and the adjacent dielectric layers are significantly improved thereby.

Abstract: A semiconductor chip package mainly includes a semiconductor chip, a first dielectric layer disposed on the semiconductor chip, a plurality of conductive traces electrically connected to the semiconductor chip, a second dielectric layer disposed on the conductive traces and the first dielectric layer wherein a portion of the conductive traces are exposed from the second dielectric layer, and a plurality of contacts for external connection formed on the exposed portion of the conductive traces. The semiconductor chip has a surface including an active area, a dummy area surrounding the active area, and a plurality of bonding pads disposed on the active area. The bonding pads are electrically connected to the contacts by the conductive traces. The present invention further provides methods for manufacturing the semiconductor chip package.

Abstract: The present invention provides a deactivation method of multimedia broadcast multicast service for wireless communication system, comprising steps of: in SGSN, completing the context deactivation of user equipment of broadcast multicast service; in the user equipment, completing the context deactivation of user equipment of multimedia broadcast multicast service; in GGSN, completing the context deactivation of user equipment of multimedia broadcast multicast service; characterized by further comprising steps of: in SGSN, after completing the context deactivation of user equipment of multimedia broadcast multicast service, completing the context deactivation of user equipment of multimedia broadcast multicast service in a radio network controller of a radio access network.

Abstract: A multi-chip package structure comprising a first chip, a patterned lamination layer, a plurality of first bumps, a second chip and second bumps is provided. The first chip has a first active surface. The patterned lamination layer is disposed on a portion area of the first active surface. The first chip has a plurality of first bonding pads disposed on the first active surface exposed by the patterned lamination layer and the patterned lamination layer has a plurality of second bonding pads disposed thereon. The second chip has a second active surface and the first bumps are disposed on the second active surface. The second chip is electrically connected to the first bonding pads through the first bumps. The second bumps are disposed on the second bonding pads. Moreover, the multi-chip package structure further comprises a component disposed on the first chip and electrically connects to the first bonding pads.