Patents by Inventor Hua Chu

Hua Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145132
    Abstract: An over-current protection device includes first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, and a conductive filler. The polymer matrix has a fluoropolymer. The total volume of the PTC material layer is calculated as 100%, and the fluoropolymer accounts for 47-62% by volume of the PTC material layer. The fluoropolymer has a melt viscosity higher than 3000 Pa·s.
    Type: Application
    Filed: March 16, 2023
    Publication date: May 2, 2024
    Inventors: CHENG-YU TUNG, CHEN-NAN LIU, Chia-Yuan Lee, HSIU-CHE YEN, YUNG-HSIEN CHANG, Yao-Te Chang, FU-HUA CHU
  • Publication number: 20240145133
    Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a polymer matrix and a first conductive filler. The polymer matrix includes a polyolefin-based polymer and a fluoropolymer. The fluoropolymer has a melt flow index higher than 1.9 g/10 min, and the polyolefin-based polymer and the fluoropolymer together form an interpenetrating polymer network (IPN). The first conductive filler has a metal-ceramic compound dispersed in the polymer matrix.
    Type: Application
    Filed: April 5, 2023
    Publication date: May 2, 2024
    Inventors: CHEN-NAN LIU, YUNG-HSIEN CHANG, CHENG-YU TUNG, HSIU-CHE YEN, Chia-Yuan LEE, Yao-Te CHANG, FU-HUA CHU
  • Publication number: 20240127988
    Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 48% to 55%. The conductive filler has a metal-ceramic compound.
    Type: Application
    Filed: March 2, 2023
    Publication date: April 18, 2024
    Inventors: HSIU-CHE YEN, YUNG-HSIEN CHANG, CHENG-YU TUNG, Chia-Yuan Lee, CHEN-NAN LIU, Yao-Te Chang, FU-HUA CHU
  • Publication number: 20240128378
    Abstract: A semiconductor device includes a first transistor and a protection structure. The first transistor includes a gate electrode, a gate dielectric disposed on the gate electrode, and a channel layer disposed on the gate dielectric. The protection structure is laterally surrounding the gate electrode, the gate dielectric and the channel layer of the first transistor. The protection structure includes a first capping layer and a dielectric portion. The first capping layer is laterally surrounding and contacting the gate electrode, the gate dielectric and the channel layer of the first transistor. The dielectric portion is disposed on the first capping layer and laterally surrounding the first transistor.
    Type: Application
    Filed: January 30, 2023
    Publication date: April 18, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Cheng Chu, Chien-Hua Huang, Yu-Ming Lin, Chung-Te Lin
  • Publication number: 20240127989
    Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 33% to 42%.
    Type: Application
    Filed: January 25, 2023
    Publication date: April 18, 2024
    Inventors: CHIA-YUAN LEE, CHENG-YU TUNG, HSIU-CHE YEN, CHEN-NAN LIU, YUNG-HSIEN CHANG, YAO-TE CHANG, FU-HUA CHU
  • Patent number: 11956888
    Abstract: An electronic device includes a casing, a circuit board and a grounding assembly. The circuit board has a first surface and a second surface, wherein an input terminal and an output terminal are disposed on the second surface. The grounding assembly comprises a conducting terminal, a first grounding element and a second grounding element. The conducting terminal is disposed on the first surface of the circuit board, and the first grounding element is disposed adjacent to the conducting terminal. The first grounding element penetrates the circuit board and electrically couples with the conducting terminal and the casing, and the second grounding element correspondingly penetrates the circuit board and the conducting element, so that a first portion of the second grounding element electrically couples with the input terminal and the output terminal of the circuit board, and a second portion of the second grounding element electrically couples with the conducting terminal.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: April 9, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Chia-Hsien Chu, Yi-Hua Chang
  • Patent number: 11946135
    Abstract: Processing methods for forming iridium-containing films at low temperatures are described. The methods comprise exposing a substrate to iridium hexafluoride and a reactant to form iridium metal or iridium silicide films. Methods for enhancing selectivity and tuning the silicon content of some films are also described.
    Type: Grant
    Filed: March 27, 2023
    Date of Patent: April 2, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Feng Q. Liu, Hua Chung, Schubert Chu, Mei Chang, Jeffrey W. Anthis, David Thompson
  • Publication number: 20240095141
    Abstract: A method and an apparatus for displaying an information flow on a terminal device, an electronic device, a computer-readable storage medium, and a computer program product are provided. An implementation is: in response to detecting an activation operation on an application for displaying the information flow, reproducing, on the terminal device, a first page displayed on the terminal device when the application is last switched to running in the background or closed; and in response to determining that a time interval between the activation operation and the application being last switched to running in the background or closed does not exceed a first threshold, displaying a second page as a continuation of a content entry displayed in the first page, where the second page includes at least one first content entry cached in the terminal device before the activation operation but not displayed in the first page.
    Type: Application
    Filed: March 21, 2022
    Publication date: March 21, 2024
    Inventors: Yifan ZHANG, Yuqi WANG, Linfei CHU, Jing NING, Kunjie SUN, Yuhang ZHENG, Naifei SONG, Shujuan ZHANG, Lin LIU, Xunzhuo JU, Zhengwei CHEN, Wei ZHANG, Hua ZHANG, Congjun ZHOU, Tingkang WU, Tengfei LV, Hanmeng LIU, Lei WANG
  • Publication number: 20240088103
    Abstract: Various embodiments of the present disclosure are directed towards a three-dimensional (3D) trench capacitor, as well as methods for forming the same. In some embodiments, a first substrate overlies a second substrate so a front side of the first substrate faces a front side of the second substrate. A first trench capacitor and a second trench capacitor extend respectively into the front sides of the first and second substrates. A plurality of wires and a plurality of vias are stacked between and electrically coupled to the first and second trench capacitors. A first through substrate via (TSV) extends through the first substrate from a back side of the first substrate, and the wires and the vias electrically couple the first TSV to the first and second trench capacitors. The first and second trench capacitors and the electrical coupling therebetween collectively define the 3D trench capacitor.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Inventors: Xin-Hua Huang, Chung-Yi Yu, Yeong-Jyh Lin, Rei-Lin Chu
  • Publication number: 20240031529
    Abstract: A system and method for providing video conferencing are described herein. Original video streams from one or more cameras are sampled to form downscaled versions of the video stream. The downscaled version is analyzed to find regions of interest and generate metadata describing aspects of the regions of interest, including a region that includes a preferred speaker and the best view of each participant present together in the video conference. Cropping instructions are generated from the metadata, and portions of the original video stream are removed to form a set of presentation views for each participant, including the preferred speaker. The set of presentation views is stitched together to form a composite display for each participant viewing the stream remotely.
    Type: Application
    Filed: July 21, 2022
    Publication date: January 25, 2024
    Inventors: Joseph Yao-Hua CHU, Kristopher Glenn PERRY, Yu LOH, Fu Han CHAO, Oleg OSTAP, Richard John CAMPBELL, Anurag BANSAL, Miguel Angel MAESTRE TRUEBA
  • Publication number: 20230395287
    Abstract: An over-current protection device comprises first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, a conductive filler and a titanium-containing inner filler. The polymer matrix has a fluorine-free polyolefin-based polymer. The titanium-containing inner filler has a compound represented by a general formula of MTiO3, wherein the M represents transition metal or alkaline earth metal. The total volume of the PTC material layer is calculated as 100%, and the titanium-containing inner filler accounts for 1-9% by volume of the PTC material layer.
    Type: Application
    Filed: January 5, 2023
    Publication date: December 7, 2023
    Inventors: CHEN-NAN LIU, YUNG-HSIEN CHANG, HSIU-CHE YEN, CHENG-YU TUNG, CHIA-YUAN LEE, YU-CHIEH FU, YAO-TE CHANG, FU-HUA CHU
  • Publication number: 20230395288
    Abstract: An over-current protection device includes first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, a conductive filler, and a titanium-containing dielectric filler. The polymer matrix has a fluoropolymer. The titanium-containing dielectric filler has a compound represented by a general formula of MTiO3, wherein the M represents transition metal or alkaline earth metal. The total volume of the PTC material layer is calculated as 100%, and the titanium-containing dielectric filler accounts to for 5-15% by volume of the PTC material layer.
    Type: Application
    Filed: September 28, 2022
    Publication date: December 7, 2023
    Inventors: Hsiu-Che YEN, Yung-Hsien CHANG, Cheng-Yu TUNG, Chen-Nan LIU, Chia-Yuan LEE, Yu-Chieh FU, Yao-Te CHANG, Fu-Hua CHU
  • Publication number: 20230382716
    Abstract: Various embodiments of the present disclosure are directed towards an electronic device that comprises a semiconductor substrate having a first surface opposite a second surface. The semiconductor substrate at least partially defines a cavity. A first microelectromechanical systems (MEMS) device is disposed along the first surface of the semiconductor substrate. The first MEMS device comprises a first backplate and a diaphragm vertically separated from the first backplate. A second MEMS device is disposed along the first surface of the semiconductor substrate. The second MEMS device comprises spring structures and a moveable element. The spring structures are configured to suspend the moveable element in the cavity. A segment of the semiconductor substrate continuously laterally extends from under a sidewall of the first MEMS device to under a sidewall of the second MEMS device.
    Type: Application
    Filed: August 9, 2023
    Publication date: November 30, 2023
    Inventors: Chun-Wen Cheng, Chia-Hua Chu, Chun Yin Tsai, Wen Cheng Kuo
  • Publication number: 20230382400
    Abstract: The disclosure relates to running simulations in order to test software used to control a vehicle in an autonomous driving mode. For instance, logged data may be identified for a simulation. The logged data may have been collected by a first vehicle and may identifying an agent that is a road user. The logged data may be analyzed to identify one or more signals of intent of the agent including a logged path of the agent. One or more characteristics may be identified based on the one or more signals. The simulation may be run using the logged data by replacing the agent with an interactive agent having the one or more characteristics. The interactive agent may be capable of responding to actions performed by a simulated vehicle in the simulation using software for controlling a vehicle in an autonomous driving mode.
    Type: Application
    Filed: August 8, 2023
    Publication date: November 30, 2023
    Inventors: Menghui Wang, Aleksandar Gabrovski, Xiaoyi Liu, Wesley Heung, Yang-Hua Chu
  • Publication number: 20230370783
    Abstract: A MEMS device and a method of manufacturing the same are provided. A semiconductor device includes a substrate; and a membrane over the substrate and configured to generate charges in response to an acoustic wave, the membrane being in a polygonal shape including vertices. The membrane includes a via pattern includes: first lines that partition the membrane into slices and extend to the vertices of the membrane such that the slices are separated from each other near an anchored region of the membrane and connected to each other around a central region; and second lines extending from the anchored region of the membrane toward the central region of the membrane, each of the first lines or each of the second lines including non-straight lines.
    Type: Application
    Filed: July 21, 2023
    Publication date: November 16, 2023
    Inventors: CHUN-WEN CHENG, CHUN YIN TSAI, CHIA-HUA CHU
  • Patent number: 11807521
    Abstract: Various embodiments of the present disclosure are directed towards a method for forming a microelectromechanical systems (MEMS) device. The method includes forming a filter stack over a carrier substrate. The filter stack comprises a particle filter layer having a particle filter. A support structure layer is formed over the filter stack. The support structure layer is patterned to define a support structure in the support structure layer such that the support structure has one or more segments. The support structure is bonded to a MEMS structure.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: November 7, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Wen Cheng, Chia-Hua Chu, Wen Cheng Kuo
  • Publication number: 20230349993
    Abstract: In a method for quantitative detection of parameters in MRI, first and second spoiled gradient echo images and at least one multi-echo steady-state first/second magnetization image are acquired; based on the extended phase graph theory, signal equations are obtained corresponding to the first and second spoiled gradient echo images, the at least one multi-echo steady-state first magnetization image and the at least one multi-echo steady-state second magnetization image; based on the signal equations of the first and second spoiled gradient echo images, the signal equation of the at least one multi-echo steady-state first magnetization image and the signal equation of the at least one multi-echo steady-state second magnetization image, a spoiled gradient echo proton density map, a multi-echo steady-state proton density map, a longitudinal relaxation time map and a transverse relaxation time map of the target tissue are obtained.
    Type: Application
    Filed: March 29, 2023
    Publication date: November 2, 2023
    Applicant: Siemens Healthineers Digital Technology (Shanghai) Co., Ltd.
    Inventors: Yi-Cheng Hsu, Ying Hua Chu, Patrick Liebig
  • Publication number: 20230353066
    Abstract: A microelectromechanical system (MEMS) device includes a substrate and a movable element at least partially suspended above the substrate and having at least one degree of freedom. The MEMS device further includes a protrusion extending from the substrate and configured to contact the movable element when the movable element moves in the at least one degree of freedom, wherein the protrusion comprises a surface having a water contact angle of higher than about 15° measured in air.
    Type: Application
    Filed: July 3, 2023
    Publication date: November 2, 2023
    Inventors: Yi Heng Tsai, Chia-Hua Chu, Kuei-Sung Chang
  • Patent number: 11800048
    Abstract: Embodiments of the disclosure provided herein generally relate to methods and video system components that have integrated background differentiation capabilities that allow for background replacement and/or background modification. In some embodiments, undesired portions of video data generated in a video environment are separated from desired portions of the video data by taking advantage of the illumination and decay of the intensity of electromagnetic radiation, provided from an illuminator, over a distance. Due to the decay of intensity with distance, the electromagnetic radiation reflected from the undesired background has a lower intensity when received by the sensor than the electromagnetic radiation reflected from the desired foreground. The difference in the detected intensity at the one or more wavelengths can then be used to separate and/or modify the undesired background from the desired foreground for use in a video feed.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: October 24, 2023
    Assignee: Logitech Europe S.A.
    Inventors: Joseph Yao-Hua Chu, Jeffrey Phillip Fisher, Ting Chia Hsu
  • Patent number: 11800056
    Abstract: Embodiments of the disclosure generally relate to video-conferencing systems, and more particularly, to advanced camera devices with integrated background differentiation capabilities, such as background removal, background replacement, and/or background blur capabilities, which are suitable for use in a video-conferencing application. Generally, the camera devices described herein use a combination of integrated hardware and software to differentiate between the desired portion of a video stream and the undesired portion of the video stream to-be-replaced. The background differentiation and/or background replacement methods disclosed herein are generally performed, using a camera device, before encoding the video stream for transmission of the video stream therefrom.
    Type: Grant
    Filed: February 11, 2021
    Date of Patent: October 24, 2023
    Assignee: Logitech Europe S.A.
    Inventors: Joseph Yao-Hua Chu, Ting Chia Hsu, Jeffrey Phillip Fisher