Abstract: An over-current protection device includes an electrode layer and a heat-sensitive layer. The heat-sensitive layer includes a polymer matrix and a conductive filler. The polymer matrix includes a polyolefin-based polymer and an olefin-acrylate copolymer. The polyolefin-based polymer is represented by a formula (I): ?wherein R1 and R2 are selected from the group consisting of CH3, C2H5, and C3H7. The olefin-acrylate copolymer is represented by a formula (II): ?wherein R is selected from the group consisting of COOCH3, COOC2H5, and COOC4H9.

Abstract: In some embodiments, the present disclosure relates to an integrated device, including: a substrate; a semiconductor layer on the substrate and including a first structure being one of a sound port, a sealed cavity, or a proof mass, and a second structure being one of the sound port, the sealed cavity, or the proof mass, where the second structure is a different one of the sound port, the sealed cavity, or the proof mass than the first structure; a piezoelectric layer on the semiconductor layer overlying the first structure and the second structure; and an air gap extending into the semiconductor layer from an upper surface of the piezoelectric layer, wherein the first structure and portions of the piezoelectric layer overlying the first structure are spaced from the second structure and portions of the piezoelectric layer overlying the second structure by the air gap.

Abstract: A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a substrate and a membrane adjacent to the substrate and configured to generate charges in response to an acoustic wave. The membrane includes a via pattern including: first lines that partition the membrane into slices and extend to a side of the membrane such that the slices are separated from each other near the side of the membrane and connected to each other around a central region, wherein the first lines are made closer to each other when they are closer to the central region, and second lines alternatingly arranged with the first lines.

Abstract: An over-current protection device includes an electrode layer and a heat-sensitive layer. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic, and is laminated between a top metal layer and a bottom metal layer of the electrode layer. The heat-sensitive layer includes a polymer matrix and a conductive filler. The polymer matrix includes a fluoropolymer. The fluoropolymer has a plurality of spherulites, and the fractal dimension of each spherulite is lower than 12.

Abstract: A three-point locating dental implant locating guide and a three-point locating modeling method are disclosed. The three-point locating dental implant locating guide includes a first plate and a second plate that are pivotally connected. A first locating hole is defined in the first plate. A second locating hole is defined in the second plate. A third locating hole is defined in the junction of the first plate and the second plate. Extending directions of the first locating hole, the second locating hole and the third locating hole are arranged parallel to each other. Through the first locating hole, the second locating hole and the third locating hole, a positioning locating can be guided and implanted respectively, thereby forming a three-point locating as the modeling base for producing a dental mold accurately.

Abstract: A MEMS device and a method of manufacturing the same are provided. A semiconductor device includes a substrate; and a membrane over the substrate and configured to generate charges in response to an acoustic wave, the membrane being in a polygonal shape including vertices. The membrane includes a via pattern includes: first lines that partition the membrane into slices and extend to the vertices of the membrane such that the slices are separated from each other near an anchored region of the membrane and connected to each other around a central region; and second lines extending from the anchored region of the membrane toward the central region of the membrane, each of the first lines or each of the second lines including non-straight lines.

Abstract: An over-current protection device includes an electrode layer and a heat-sensitive layer. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic, and is laminated between a top metal layer and a bottom metal layer of the electrode layer. The heat-sensitive layer includes a polymer matrix and a conductive filler. The polymer matrix includes a first fluoropolymer and a second fluoropolymer. The weight average molecular weight of the second fluoropolymer ranges from 630000 g/mol to 1100000 g/mol. The conductive filler is dispersed in the polymer matrix, thereby forming an electrically conductive path in the heat-sensitive layer.

Abstract: An over-current protection device includes an electrode layer and a heat-sensitive layer. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic, and is laminated between a top metal layer and a bottom metal layer of the electrode layer. The heat-sensitive layer includes a polymer matrix and a conductive filler. The polymer matrix includes a first fluoropolymer and a second fluoropolymer. The first fluoropolymer includes a first melting point, and the second fluoropolymer has a second melting point lower than the first melting point. The difference between the first melting point and the second melting point is smaller than 14° C. The second fluoropolymer has a second melt flow index ranging from 0.4 g/10 min to 0.7 g/10 min.

Abstract: An over-current protection device includes an electrode layer and a heat-sensitive layer. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic, and is laminated between a top metal layer and a bottom metal layer of the electrode layer. The heat-sensitive layer includes a polymer matrix and a conductive filler. The polymer matrix includes a first fluoropolymer and a second fluoropolymer. The first fluoropolymer has a first volume and a first melt flow index, and the second fluoropolymer has a second volume and a second melt flow index. The second melt flow index ranges from 0.4 g/10 min to 0.7 g/10 min and is lower than the first melt flow index, and a volume ratio by dividing the second volume by the first volume ranges from 0.4 to 0.6.

Abstract: A system and method for providing video conferencing are described herein. Original video streams from one or more cameras are sampled to form downscaled versions of the video stream. The downscaled version is analyzed to find regions of interest and generate metadata describing aspects of the regions of interest, including a region that includes a preferred speaker and the best view of each participant present together in the video conference. Cropping instructions are generated from the metadata, and portions of the original video stream are removed to form a set of presentation views for each participant, including the preferred speaker. The set of presentation views is stitched together to form a composite display for each participant viewing the stream remotely.

Abstract: A system and method for providing an integrated system of endpoints are described, even though the endpoints are distributed over several locations. A distributed controller operates to link the endpoints together and provide a unified view of endpoints to a conference provider. In addition, the distributed controller can assign the workload of some endpoints to other endpoints that are better able to handle the workload. The distributed controller is implemented by cooperating processes in the endpoints.

Abstract: Described herein are certain boron-containing compounds, compositions, preparations and their use as modulators of the transpeptidase function of bacterial penicillin-binding proteins and as antibacterial agents. In some embodiments, the compounds described herein inhibit penicillin-binding proteins. In certain embodiments, the compounds described herein are useful in the treatment of bacterial infections.

Abstract: An over-current protection device includes an electrode layer and a heat-sensitive layer. The heat-sensitive layer contacts a top metal layer and a bottom metal layer of the electrode layer, and is laminated therebetween. In addition, the heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a polymer matrix and a conductive filler. The polymer matrix includes a first fluoropolymer, by which the over-current protection device has a starting jump temperature of resistance ranging from 184° C. to 192° C. The conductive filler includes carbon black and a metal compound, thereby forming an electrically conductive path in the heat-sensitive layer.

Abstract: An over-current protection device includes an electrode layer and a heat-sensitive layer. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic, and is laminated between a top metal layer and a bottom metal layer of the electrode layer. The heat-sensitive layer includes a polymer matrix and a conductive filler. The polymer matrix includes a fluorine-containing copolymer, and its melting point ranges from 210° C. to 240° C. The conductive filler consists of carbon black solely, and is used to form an electrically conductive path in the heat-sensitive layer. In addition, the over-current protection device has a resistance-jump ratio ranging from 1.2 to 1.3 between 40° C. and 130° C.

Abstract: Representative methods for sealing MEMS devices include depositing insulating material over a substrate, forming conductive vias in a first set of layers of the insulating material, and forming metal structures in a second set of layers of the insulating material. The first and second sets of layers are interleaved in alternation. A dummy insulating layer is provided as an upper-most layer of the first set of layers. Portions of the first and second set of layers are etched to form void regions in the insulating material. A conductive pad is formed on and in a top surface of the insulating material. The void regions are sealed with an encapsulating structure. At least a portion of the encapsulating structure is laterally adjacent the dummy insulating layer, and above a top surface of the conductive pad. An etch is performed to remove at least a portion of the dummy insulating layer.

Abstract: Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a substrate and a dielectric layer formed over the substrate. The semiconductor device structure further includes a movable membrane formed over the dielectric layer. In addition, the movable membrane includes first recessed portions arranged in a ring shape in a top view and second recessed portions surrounded by the first recessed portions.

Abstract: The disclosure relates to running simulations in order to test software used to control a vehicle in an autonomous driving mode. For instance, logged data may be identified for a simulation. The logged data may have been collected by a first vehicle and may identifying an agent that is a road user. The logged data may be analyzed to identify one or more signals of intent of the agent including a logged path of the agent. One or more characteristics may be identified based on the one or more signals. The simulation may be run using the logged data by replacing the agent with an interactive agent having the one or more characteristics. The interactive agent may be capable of responding to actions performed by a simulated vehicle in the simulation using software for controlling a vehicle in an autonomous driving mode.

Abstract: Described herein are orally-bioavailable nucleoside analogs and pharmaceutical compositions comprising said compounds. The subject compounds and compositions are useful for the treatment of coronavirus infections, including SARS-CoV-2 infection.

Abstract: A system and method for providing an integrated system of endpoints are described, even though the endpoints are distributed over several locations. A distributed controller operates to link the endpoints together and provide a unified view of endpoints to a conference provider. In addition, the distributed controller can assign the workload of some endpoints to other endpoints that are better able to handle the workload. The distributed controller is implemented by cooperating processes in the endpoints.

Abstract: The present disclosure provides broad-spectrum carbapenem derivatives and pharmaceutical compositions useful in the treatment of bacterial infections and methods for treating such infections using such derivatives and/or compositions.