Patents by Inventor Hua-Hsiang Liu

Hua-Hsiang Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240131010
    Abstract: In some embodiments of the present disclosure, a sustained release osmotic-controlled pharmaceutical composition is provided, including: a core and a semi-permeable membrane coated on the core. The core includes a drug compartment, in which the drug compartment includes a first active ingredient, a first polymer and a first osmogen, and the first active ingredient includes lurasidone, a pharmaceutical acceptable salt of the lurasidone or a combination thereof. The semi-permeable membrane includes a membrane body and at least one pore distributed in the membrane body.
    Type: Application
    Filed: October 15, 2023
    Publication date: April 25, 2024
    Inventors: Chun-You LIOU, Tzu-Hsien CHAN, Hua-Jing JHAN, I-Hsiang LIU, Tse-Hsien CHEN, Chi-Heng JIAN
  • Patent number: 7253028
    Abstract: A method for packaging an image sensor includes the steps of providing a substrate, forming a first adhesive on one surface of the substrate, attaching a transparent material on the first adhesive, cutting or carving the surface of the transparent material to a depth penetrating the transparent material while not penetrating the first adhesive, cleaning the cut or carved surface of the transparent material, depositing a frame glue on the transparent material, and combining the transparent material with a microchip that includes a plurality of micro-lenses. The micro-lens is packaged within the transparent material. The microchip is then ground to perform a lithography process. Next, the substrate and part of the first adhesive are detached after the lithography process. After performing a cutting or carving procedure, the packaging process of the image sensors is completed.
    Type: Grant
    Filed: September 24, 2004
    Date of Patent: August 7, 2007
    Assignee: Youngtek Electronics Corp.
    Inventor: Hua-Hsiang Liu
  • Publication number: 20060073630
    Abstract: A method for packaging an image sensor includes the steps of providing a substrate, forming a first adhesive on one surface of the substrate, attaching a transparent material on the first adhesive, cutting or carving the surface of the transparent material to a depth penetrating the transparent material while not penetrating the first adhesive, cleaning the cut or carved surface of the transparent material, depositing a frame glue on the transparent material, and combining the transparent material with a microchip that includes a plurality of micro-lenses. The micro-lens is packaged within the transparent material. The microchip is then ground to perform a lithography process. Next, the substrate and part of the first adhesive are detached after the lithography process. After performing a cutting or carving procedure, the packaging process of the image sensors is completed.
    Type: Application
    Filed: September 24, 2004
    Publication date: April 6, 2006
    Inventor: Hua-Hsiang Liu