Patents by Inventor Hua-Hsuan Kuo

Hua-Hsuan Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive channel of photovoltaic panel and method for manufacturing the same
    Patent number: 8685784
    Abstract: An electrically conductive ribbon, which is soldered on an electrically conductive busbar of a photovoltaic panel, includes a cooper core and a tin based solder. The tin based solder fully wraps an outer surface of the cooper core, and has a convex solder surface, which has a first curvature to be fitted with a second curvature of a concave solder surface of the electrically conductive busbar.
    Type: Grant
    Filed: July 16, 2012
    Date of Patent: April 1, 2014
    Assignee: Gintech Energy Corporation
    Inventors: Chen-Chan Wang, Kuei-Wu Huang, Nai-Tien Ou, Tien-Szu Chen, Ching-Tang Tsai, Kai-Sheng Chang, Hua-Hsuan Kuo, Chi-Cheng Lee, Yu-Chih Chan
  • Conductive channel of photovoltaic panel and method for manufacturing the same
    Patent number: 8420941
    Abstract: An electrically conductive ribbon, which is soldered on an electrically conductive busbar of a photovoltaic panel, includes a cooper core and a tin based solder. The tin based solder fully wraps an outer surface of the cooper core, and has a convex solder surface, which has a first curvature to be fitted with a second curvature of a concave solder surface of the electrically conductive busbar.
    Type: Grant
    Filed: May 19, 2010
    Date of Patent: April 16, 2013
    Assignee: Gintech Energy Corporation
    Inventors: Chen-Chan Wang, Kuei-Wu Huang, Nai-Tien O, Tien-Szu Chen, Ching-Tang Tsai, Kai-Sheng Chang, Hua-Hsuan Kuo, Chi-Cheng Lee, Yu-Chih Chan
  • CONDUCTIVE CHANNEL OF PHOTOVOLTAIC PANEL AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20120276686
    Abstract: An electrically conductive ribbon, which is soldered on an electrically conductive busbar of a photovoltaic panel, includes a cooper core and a tin based solder. The tin based solder fully wraps an outer surface of the cooper core, and has a convex solder surface, which has a first curvature to be fitted with a second curvature of a concave solder surface of the electrically conductive busbar.
    Type: Application
    Filed: July 16, 2012
    Publication date: November 1, 2012
    Inventors: Chen-Chan WANG, Kuei-Wu HUANG, Nai-Tien O, Tien-Szu CHEN, Ching-Tang TSAI, Kai-Sheng CHANG, Hua-Hsuan KUO, Chi-Cheng LEE, Yu-Chih CHAN
  • CONDUCTIVE CHANNEL OF PHOTOVOLTAIC PANEL AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20110240339
    Abstract: An electrically conductive ribbon, which is soldered on an electrically conductive busbar of a photovoltaic panel, includes a cooper core and a tin based solder. The tin based solder fully wraps an outer surface of the cooper core, and has a convex solder surface, which has a first curvature to be fitted with a second curvature of a concave solder surface of the electrically conductive busbar.
    Type: Application
    Filed: May 19, 2010
    Publication date: October 6, 2011
    Inventors: Chen-Chan Wang, Kuei-Wu Huang, Nai-Tien O., Tien-Szu Chen, Ching-Tang Tsai, Kai-Sheng Chang, Hua-Hsuan Kuo, Chi-Cheng Lee, Yu-Chih Chan
  • Method for preparing a carbon/carbon composite
    Patent number: 7871592
    Abstract: A method for preparing a carbon/carbon (C/C) composite comprising carbonizing a carbon fiber-reinforced polymer matrix composite precursor by heating the precursor in an inert atmosphere with a heating rate greater than 20° C./min up to 1500° C./min.
    Type: Grant
    Filed: December 27, 2005
    Date of Patent: January 18, 2011
    Inventors: Jiin-Huey Chern Lin, Chien-Ping Ju, Hua-Hsuan Kuo, Shu-Ching Ho, Seng-Meng Chen
  • Method for Preparing a Carbon/Carbon Composite
    Publication number: 20080025906
    Abstract: A method for preparing a carbon/carbon (C/C) composite comprising carbonizing a carbon fiber-reinforced polymer matrix composite precursor by heating the precursor in an inert atmosphere with a heating rate greater than 20° C./min up to 1500° C./min.
    Type: Application
    Filed: December 27, 2005
    Publication date: January 31, 2008
    Applicants: Jiin-Huey Chern LIN, Chien-Ping JU
    Inventors: Jiin-Huey Chern Lin, Chien-Ping Ju, Hua-Hsuan Kuo, Shu-Ching Ho, Seng-Meng Chen