Abstract: A method of manufacturing a semiconductor device includes applying a polymer mixture over a substrate, exposing and developing at least a portion of the polymer mixture to form a developed dielectric, and curing the developed dielectric to form a dielectric layer. The polymer mixture includes a polymer precursor, a photosensitizer, and a solvent. The polymer precursor may be a polyamic acid ester.

Abstract: Present invention teaches the method of using a keratin hydrolysis peptide (“KHP”) solution to enhance sweetness and flavors of tea leaves. By selectively choosing specific weights of feathers and water, and treating the mixture to a high-temperature high-pressure hydrolysis process, the resulting solution is confirmed to contain at least 253 peptides and then applied to the surface of tea leaves during sprouting stage and infused to the soil around the tea trees/plants; the increased content of L-theanine and polyphenol is separately tested and confirmed. Optionally, the KHP solution can be diluted by water, as taught in the specification, before applying to the tea leaves and the soil as taught herein.

Abstract: A modified polyethylene terephthalate copolyester, including three fragments shown as [Fragment 1], [Fragment 2], and [Fragment 3] in the specification, is provided.

Abstract: A control method for stabilizing excimer laser pulse energy includes: obtaining a measured energy value of the n-th pulse in a pulse sequence; calculating the difference between the measured energy value and the preset energy value; taking the z-th pulse of the sequence as a demarcation point, when n is a positive integer less than z, the discharge voltage value of the next pulse is calculated according to a first mathematical model, and when n is an integer greater than z?1, the discharge voltage value of the next pulse is calculated according to a second mathematical model; and the next pulse is generated according to the discharge voltage value. A control system based on the control method includes: a high-voltage discharge module, a laser cavity, a laser parameter measurement module, and an energy stability controller.

Abstract: A fabricating method of a high electron mobility transistor includes providing a substrate. Then, a channel layer, an active layer, a P-type group III-V compound material layer, a metal compound material layer, a hard mask material layer and a patterned photoresist are formed to cover the substrate. Later, a dry etching process is performed to etch the hard mask material layer and the metal compound material layer to form a hard mask and a metal compound layer by taking the patterned photoresist as a mask. During the dry etching process, a spacer generated by by-products is formed to surround the patterned photoresist, the hard mask and the metal compound layer. After the dry etching process, the P-type group III-V compound material layer is etched by taking the spacer and the patterned photoresist as a mask.

Abstract: A preparation method of a modified bismaleimide resin includes the following steps. Maleic anhydride is mixed with a bisamine compound to obtain a corresponding mixture. The mixture is heated. The bisamine compound has a main chain structure or fragment represented by Formula A, Formula B, or Formula C as described in the description.

Abstract: A display apparatus and a control device and a control method thereof are provided. A controller of the control device controls a gate driver of a display panel. The controller selects a first selected frame and a second selected frame in each frame group, wherein an adjacent position between a first partition and a second partition of the display panel corresponds to a corresponding time point in each frame of the first selected frame and the second selected frame. The controller transmits a reset pulse to the first gate driver at the corresponding time point in the second selected frame to clear a scanning pulse in the gate driver, and cancels the reset pulse at the corresponding time point in the first selected frame. Thus, the control device enables different display partitions of the display panel to have different frame rates or refresh rates.

Abstract: The present disclosure provides a correction system and method for correcting a semiconductor circuit. The correction system includes a plurality of redundant circuit units, a plurality of switching circuit units and a control circuit. The redundant circuit units are coupled to the semiconductor circuit. The switching circuit units are coupled to the redundant circuit units and a plurality of basic circuit units of the semiconductor circuit. The control circuit is coupled to the semiconductor circuit and the switching circuit units, is configured to obtain a noise signal of the semiconductor circuit, is configured to determine whether the semiconductor circuit passes a noise test by recognizing a characteristic of the noise signal, and is configured to replace one of the basic circuit units with one of the redundant circuit units by controlling the switching circuit units when the semiconductor circuit does not pass the noise test.

Abstract: An axial-flow heat-dissipation fan including a frame and a blade wheel is provided. The frame has an inlet, an outlet, and an inner wall connected between the inlet and the outlet. The inner wall surrounding the blade wheel has at least one rough region. The blade wheel is rotatably disposed in the frame and located between the inlet and the outlet, and an air flows into the frame via the inlet and flows out of the frame via the outlet by rotation of the blade wheel. A gap exists between a blade end of the blade wheel and the inner wall. A laminar flow is generated at the gap when the blade wheel is rotating and the blade end passes through the rough region so as to prevent a backflow generated at the gap, wherein a flowing direction of the backflow is opposite to a flowing direction of the air flow.

Abstract: A package structure includes a carrier substrate and a die. The carrier substrate includes through carrier vias (TCV). The die is disposed over the carrier substrate. The die includes a semiconductor substrate and conductive posts disposed over the semiconductor substrate. The semiconductor substrate is located between the conductive posts and the carrier substrate.

Abstract: A photoelectric conversion module includes an electro-optical conversion unit. The electro-optical conversion unit includes a transmitting terminal, a laser, and a bias constant current source providing a constant current to the laser. The laser is configured to convert a voltage signal to be transmitted of the transmitting terminal into an optical signal synchronized with the voltage signal. A photoelectric conversion device and a photoelectric conversion method are further provided.

Abstract: An antenna assembly includes a patch antenna, a metal layer, and a feed-in signal layer. The metal layer is disposed on a side of the patch antenna and includes a first slot and a second slot. The feed-in signal layer is disposed on a side of the metal layer opposite the second antenna and includes a transmitting port, a receiving port, a hybrid coupler, and two microstrips. The transmitting port and the receiving port are connected to the hybrid coupler, and the two microstrips are extended in the direction away from the hybrid coupler. Projections of two ends of the two microstrips onto the metal layer are overlapped with the first slot and the second slot. An antenna array is also mentioned.

Abstract: A package structure is provided. The package structure includes a redistribution structure on a substrate, a semiconductor die on the redistribution structure and electrically connected to the substrate, a wall structure on the redistribution structure and electrically isolated from the substrate. The semiconductor die includes a first sidewall, a second sidewall connected to the first sidewall, and a third sidewall connected to the second sidewall. The wall structure includes a first partition, a second partition and a third partition respectively immediately adjacent to the first sidewall, the second sidewall, and the third sidewall of the semiconductor die. The first partition is located immediately adjacent to and spaced apart from the second partition by a first distance, the second partition is located immediately adjacent to and spaced apart from the third partition by a second distance, and the first distance is substantially equal to the second distance.

Abstract: A real-time ground fusion system is based on binocular stereo vision and an intelligent terminal. The method for accomplish real-time ground fusion includes: S1 of obtaining a disparity map about a same road scenario, and converting a disparity map in a target region into a 3D point cloud; S2 of performing pose conversion on a current frame and a next frame adjacent to the current frame, and performing inverse conversion on a 3D point cloud of the current frame; and S3 of repeating S2 with each frame in the target region as the current frame, so as to achieve ground fusion. Through the conversion and fusion of adjacent frames, holes caused by the projection of the disparity map can be filled to assist driving and output accurate height data, thereby improving comfortableness.

Abstract: A metal heating film includes: a nickel-chromium-alloy-based metal heating film or a nickel-based metal heating film; and at least one of metal elements Ru, Pt, and Pd. In an embodiment.

Abstract: A water filter includes a filtering head, a filter bottle assembly, a switch member, and a quick release device. The filtering head includes a flow channel module. The filter bottle assembly includes a filter bottle. The quick release device includes a press lever, two links, and two push members. When the press lever is pivoted, the two links and the two push members are driven by the press lever to move the filter bottle simultaneously so that the filter bottle is mounted on or detached from the filtering head quickly. A switch member functions as a waterway switch to control a water supply of the filtering head and functions as a locking mechanism for locking or unlocking the quick release device.

Abstract: A method of forming a semiconductor device includes forming a first dielectric layer over a front side of a wafer, the wafer having a plurality of dies at the front side of the wafer, the first dielectric layer having a first shrinkage ratio smaller than a first pre-determined threshold; curing the first dielectric layer at a first temperature, where after curing the first dielectric layer, a first distance between a highest point of an upper surface of the first dielectric layer and a lowest point of the upper surface of the first dielectric layer is smaller than a second pre-determined threshold; thinning the wafer from a backside of the wafer; and performing a dicing process to separate the plurality of dies into individual dies.

Abstract: A food container includes a box, a cover and a pair of locking wings. The box includes a main body and elastic engaging plates. The main body has a receiving space. The elastic engaging plates are arranged on opposite sides of the receiving space. Each elastic engaging plate includes an elastic arm and a clip. The cover includes a cover plate and engaging slots. The cover is positioned on the main body through the clip inserted in the engaging slot. The locking wings are pivotally coupled to the cover. Each locking wing rotates toward the box to press elastic arms. The elastic arms drive the clips to be disengaged from the engaging slots. Thus, the cover is separated from the box.

Abstract: A centrifugal heat dissipation fan of a portable electronic device. The centrifugal heat dissipation fan includes a hub, multiple metal blades, and at least one ring. The metal blades are disposed surrounding the hub. The metal blades include multiple radial dimensions, and the structure of the metal blade with a shorter radial dimension is a part of the structure of the metal blade with a longer radial dimension. The metal blades having different radial dimensions form at least two ring areas, and the distribution numbers of the metal blades in the at least two ring areas are different from each other. The ring surrounds the hub and connects the metal blades.

Abstract: An axial-flow heat dissipation fan including a frame, a hub, and a plurality of blades is provided. The frame has an air inlet and an air outlet. The hub is rotatably arranged in the frame. The blades disposed at side of the hub respectively and rotate along with the hub. Each of the blades has a front surface facing toward the air inlet and a rear surface facing toward the air outlet. A surface roughness of the front surface is different from a surface roughness of the rear surface.