Abstract: An electronic device is provided, including a substrate, and a plurality of first bonding pads. The substrate includes a bonding area. The plurality of first bonding pads are disposed on the substrate and disposed in the bonding area. A part of the plurality of first bonding pads are arranged along a first direction, and another part of the plurality of first bonding pads are arranged along a second direction. There is an included angle between the first direction and the second direction, and the included angle is greater than 0 degrees and less than 90 degrees.

Abstract: An electronic device includes: a substrate; a plurality of electronic components disposed on the substrate, wherein there is a first pitch between two adjacent electronic components in a first direction; and a protective glue disposed on the substrate and the electronic components, and provided with at least one groove disposed between the two adjacent electronic components, wherein a distance between an edge of one of the two adjacent electronic components and the at least one groove satisfies an equation: 0.3 mm ? D ? 1 < ( P / 2 ) , where D1 is the distance between the edge of the one of the two adjacent electronic components and the at least one groove, and P is the first pitch.

Abstract: An electronic device is provided. The electronic device includes: a first substrate, a first light-emitting unit, a wall structure, and a first optical film. The first light-emitting unit is disposed on the first substrate. The wall structure is disposed on the first substrate, and includes a first opening corresponding to the first light-emitting unit. At least a portion of the first optical film is disposed on the first light-emitting unit, and the at least a portion of the first optical film is disposed in the first opening.

Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes: a substrate; an electronic component disposed on the substrate; a first optical component disposed on the substrate and the electronic component; and a first optical adhesive disposed between the substrate and the first optical component to bond the substrate and the first optical component, wherein a Young's modulus of the first optical adhesive ranges between 10 kPa and 150 kPa.

Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes a substrate, a plurality of light-emitting elements, and a reflective structure. A plurality of light-emitting elements is disposed on the substrate. The reflective structure is disposed on the substrate and located between adjacent two of the plurality of light-emitting elements. The thickness of the reflective structure is designated as Y1, half of a pitch between the adjacent two of the plurality of light-emitting elements is designated as X1, and the light that is emitted by one of the adjacent two of the plurality of light-emitting elements has an emitting angle, and half of the emitting angle is designated as ?. X1, ?, and Y1 conform to the following relationship: X1×0.5×tan(90??)?Y1?X1×1.8×tan(90??).

Abstract: A light emitting device, including a substrate, a light guiding element, multiple light sources, and multiple reflecting films. The light guiding element is disposed on the substrate and has multiple through holes. The light sources are disposed on the substrate and are respectively disposed in the through holes. The reflecting films respectively overlap with the light sources.

Abstract: An electronic device is provided, including a working area and a peripheral area. The peripheral area is adjacent to the working area. The peripheral area includes a bonding area. The bonding area includes a first bonding pad area. The first bonding pad area includes a plurality of first bonding pads. A part of the first bonding pads are arranged along a first direction, and another part of the first bonding pads are arranged along a second direction. There is an included angle between the first direction and the second direction, and the included angle is greater than 0 degrees and less than 90 degrees.

Abstract: A display panel includes a first substrate, a second substrate, a liquid crystal layer and a light shielding layer. The display panel has a display area and a non-display area surrounding the display area. The first substrate has a first lower surface. The second substrate has a second upper surface and a second lower surface opposite to the second upper surface. The liquid crystal layer is disposed between the first lower surface and the second upper surface. The light shielding layer is disposed on the second lower surface of the second substrate.