Patents by Inventor Hua-Ping Chen

Hua-Ping Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7953257
    Abstract: A sliding type thin fingerprint sensor package defined as a sliding region and a conductive portion comprises a substrate, a fingerprint sensor chip and a metal plate. The fingerprint sensor chip is electrically connected with the substrate and a sensing region of the fingerprint sensor chip is exposed by a window of the dielectric layer. The metal plate is electrically connected with the substrate and a sliding surface of the metal plate is close to the sensing region of the fingerprint sensor chip. The sensing region and the sliding surface are exposed by the window of the dielectric layer. The sensing region of the fingerprint sensor chip and the sliding surface of the metal plate are located at the sliding region, and a plurality of external contact pads on a circuit layer of the substrate are located at the conductive portion.
    Type: Grant
    Filed: October 23, 2007
    Date of Patent: May 31, 2011
    Assignee: Chipbond Technology Corporation
    Inventors: Yeh-Shun Chen, Yung-Jen Chen, Lin-Hsin Chen, Hua-Ping Chen, Heng-Ting Liu
  • Publication number: 20090103787
    Abstract: A sliding type thin fingerprint sensor package defined as a sliding region and a conductive portion comprises a substrate, a fingerprint sensor chip and a metal plate. The fingerprint sensor chip is electrically connected with the substrate and a sensing region of the fingerprint sensor chip is exposed by a window of the dielectric layer. The metal plate is electrically connected with the substrate and a sliding surface of the metal plate is close to the sensing region of the fingerprint sensor chip. The sensing region and the sliding surface are exposed by the window of the dielectric layer. The sensing region of the fingerprint sensor chip and the sliding surface of the metal plate are located at the sliding region, and a plurality of external contact pads on a circuit layer of the substrate are located at the conductive portion.
    Type: Application
    Filed: October 23, 2007
    Publication date: April 23, 2009
    Inventors: Yeh-Shun Chen, Yung-Jen Chen, Lin-Hsin Chen, Hua-Ping Chen, Heng-Ting Liu
  • Patent number: 7121026
    Abstract: The advertisement billboard includes at least one rotatable polyhedral column and a driving mechanism provided on a frame. The polyhedral column is consisted of a plurality of rotatable exhibiting boards having an obverse side and a reverse side. Each obverse side of the exhibiting boards outwardly displays an advertisement in sequence when the polyhedral column rotates for the first revolution, and each reverse side of the exhibiting boards outwardly displays an advertisement when the polyhedral column rotates for the second revolution, thereby enabling the advertisement billboard to display a multiple of planar advertisements.
    Type: Grant
    Filed: February 14, 2003
    Date of Patent: October 17, 2006
    Inventor: Hua-Ping Chen
  • Publication number: 20040159025
    Abstract: The advertisement billboard includes at least one rotatable polyhedral column and a driving mechanism provided on a frame. The polyhedral column is consisted of a plurality of rotatable exhibiting boards having an obverse side and a reverse side. Each obverse side of the exhibiting boards outwardly displays an advertisement in sequence when the polyhedral column rotates for the first revolution, and each reverse side of the exhibiting boards outwardly displays an advertisement when the polyhedral column rotates for the second revolution, thereby enabling the advertisement billboard to display a multiple of planar advertisements.
    Type: Application
    Filed: February 14, 2003
    Publication date: August 19, 2004
    Inventor: Hua-Ping Chen