Abstract: The invention provides a heater for flip chip bonding. The heater transfers more heat to the periphery of a die than to the center. This results in a more even temperature profile along the die and helps prevent epoxy voiding problems.

Abstract: Microelectronic and optoelectronic packaging embodiments are described with underfill materials including polybenzoxazine, having the general formula:

Abstract: A system may include a first integrated circuit die, no-flow underfill material, and a second integrated circuit die. A first side of the first integrated circuit die may include a first plurality of electrical contacts, and the underfill material may contact the first side of the first integrated circuit die. A first side of the second integrated circuit die may include a second plurality of electrical contacts, and the first side of the second integrated circuit die may also contact the no-flow underfill material.

Abstract: The invention provides a heater for flip chip bonding. The heater transfers more heat to the periphery of a die than to the center. This results in a more even temperature profile along the die and helps prevent epoxy voiding problems.

Abstract: A temperature sustaining flip chip process in which ILD cracking and delamination are lessened. A sequence of substrate prebake, underfill dispense, chip placement, solder reflow and underfill cure operative stages introduces lower thermal-mechanical stress during flip chip packaging.

Abstract: A temperature sustaining flip chip process in which ILD cracking and delamination are lessened. A sequence of substrate prebake, underfill dispense, chip placement, solder reflow and underfill cure operative stages introduces lower thermal-mechanical stress during flip chip packaging.

Abstract: Microelectronic and optoelectronic packaging embodiments are described with underfill materials including polybenzoxazine, having the general formula:

Abstract: The invention provides a heater for flip chip bonding. The heater transfers more heat to the periphery of a die than to the center. This results in a more even temperature profile along the die and helps prevent epoxy voiding problems.

Abstract: A system may include placement of an integrated circuit die on a substrate using a first head, the integrated circuit die including a first plurality of electrical contacts and the substrate including a second plurality of electrical contacts, and application of energy to the integrated circuit die using a second head to form an integral electrical connection between one of first plurality of electrical contacts and one of the second plurality of electrical contacts.

Abstract: A guided heating apparatus and a method for using the same is provided. The apparatus includes a guiding enclosure, a supporting piece, and an absorbing piece. The guiding enclosure guides and keeps energy from an energy source within the guiding enclosure. The guiding enclosure is made of a material reflective of the energy. The energy source is either one of a microwave source and an infrared source. The supporting piece is detachably coupled with the guiding enclosure and is made of a material transparent to the energy. The absorbing piece is coupled to and supported by the supporting piece within the guiding enclosure. The absorbing piece is made of at least one material that absorbs the energy and transfers the energy to an object to be heated. The absorbing piece has a predetermined composition that controls an energy absorption rate of the absorbing piece.

Abstract: The invention provides an electronic assembly comprising a carrier substrate, a die, and a solidified underfill material. The carrier substrate has an upper plane. The die has a die substrate and an integrated circuit formed on one side of the die substrate. The die has a lower major surface over the upper plane, an upper major surface, and a plurality of side edge surfaces from the upper major surface to the lower major surface. A corner edge portion where extensions of two of the side edge surfaces meet has been removed. The solidified underfill material is located between and contacts both the upper plane of the carrier substrate and the lower surface of the die.

Abstract: A temperature sustaining flip chip process in which ILD cracking and delamination are lessened. A sequence of substrate prebake, underfill dispense, chip placement, solder reflow and underfill cure operative stages introduces lower thermal-mechanical stress during flip chip packaging.

Abstract: A guided heating apparatus and a method for using the same is provided. The apparatus includes a guiding enclosure, a supporting piece, and an absorbing piece. The guiding enclosure guides and keeps energy from an energy source within the guiding enclosure. The guiding enclosure is made of a material reflective of the energy. The energy source is either one of a microwave source and an infrared source. The supporting piece is detachably coupled with the guiding enclosure and is made of a material transparent to the energy. The absorbing piece is coupled to and supported by the supporting piece within the guiding enclosure. The absorbing piece is made of at least one material that absorbs the energy and transfers the energy to an object to be heated. The absorbing piece has a predetermined composition that controls an energy absorption rate of the absorbing piece.

Abstract: A siloxirane based no-flow underfill material is provided. The material has a low coefficient of thermal expansion, low moisture uptake and a high distortion temperature. The material typically includes at least an epoxy siloxiane resin, a cross-linking hardener, a catalyst, and a fluxing agent.

Abstract: The present invention relates to a method of packaging a microelectronic device that, in one embodiment, uses a vacuum-assisted underfill process. One embodiment of the method uses a curing process with a tacky film disposed over the device to prevent wicking of the underfill material after the underfill material is in place. One embodiment of the method uses a curing process that utilizes a non-tacky tacky film with a curing process to prevent wicking of the underfill material after the underfill material is in place.

Abstract: The present invention provides a novel process and its required fluxable materials for building low-cost flip-chip interconnect structures. The novel process involves two fluxable materials, fluxable wafer-level compressive-flow underfill material (WLCFU) and fluxable tacky film, and applies these two materials on a wafer level. The two materials can provide sufficient fluxing capability during solder reflow and significant improvement of the fatigue life of the formed solder interconnects after fully cured.

Abstract: A polybenzoxazine based wafer-level underfill material. The material may be provided to a surface of a semiconductor wafer. The semiconductor wafer may then be sawed into individual chips. The polybenzoxazine based underfill material may be for use between a chip and a package substrate.

Abstract: A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixture that alone exhibits a CTE that is characteristic of an inorganic-filled underfill composite previously known. An embodiment is also directed to the assembly of a flip-chip package that uses an underfill mixture.

Abstract: A polybenzoxazine based wafer-level underfill material. The material may be provided to a surface of a semiconductor wafer. The semiconductor wafer may then be sawed into individual chips. The polybenzoxazine based underfill material may be for use between a chip and a package substrate.

Abstract: A method of identifying RNA ligands which bind to a target molecule by treating a first pool of RNA ligands that collectively bind more than one target under conditions effective to reduce the concentration or eliminate the presence of one or more predominate target-binding RNA ligands from the first pool of RNA ligands; amplifying the RNA ligands in the treated first pool, thereby forming a second pool of RNA ligands that is enriched in one or more non-predominate target-binding RNA ligands of the first pool but not the one or more predominate target-binding RNA ligands thereof; and identifying one or more predominate target-binding RNA ligands that are present in the second pool at a higher concentration than other target-binding RNA ligands. Oligonucleotides and kits which can be used in practicing the present invention are also disclosed, as are aptamers that bind to a heat shock factor protein and their use.