Abstract: An electrical connection structure is provided. The electrical connection structure includes a through hole, a first pad, a second pad and a conductive bridge. The through hole has a first end and a second end. The first pad at least partially surrounds the first end of the through hole and is electrically connected to a first circuit. The second pad is located at the second end of the through hole and is electrically connected to a second circuit. The conductive bridge is connected to the first pad and second pad through the through hole, thereby making the first and second circuits electrically connected to each other.

Abstract: A package comprises at least one first device die, and a redistribution line (RDL) structure having the at least one first device die bonded thereto. The RDL structure comprises a plurality of dielectric layers, and a plurality of RDLs formed through the plurality of dielectric layers. A trench is defined proximate to axial edges of the RDL structure through each of the plurality of dielectric layers. The trench prevents damage to portions of the RDL structure located axially inwards of the trench.

Abstract: A method includes forming a dummy gate over a semiconductor fin; forming a source/drain epitaxial structure over the semiconductor fin and adjacent to the dummy gate; depositing an interlayer dielectric (ILD) layer to cover the source/drain epitaxial structure; replacing the dummy gate with a gate structure; forming a dielectric structure to cut the gate structure, wherein a portion of the dielectric structure is embedded in the ILD layer; recessing the portion of the dielectric structure embedded in the ILD layer; after recessing the portion of the dielectric structure, removing a portion of the ILD layer over the source/drain epitaxial structure; and forming a source/drain contact in the ILD layer and in contact with the portion of the dielectric structure.

Abstract: A device includes a first package connected to an interconnect substrate, wherein the interconnect substrate includes conductive routing; and a second package connected to the interconnect substrate, wherein the second package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler and to a photodetector; a via extending through the substrate; an interconnect structure over the photonic layer, wherein the interconnect structure is connected to the photodetector and to the via; and an electronic die bonded to the interconnect structure, wherein the electronic die is connected to the interconnect structure.

Abstract: A data processing method and apparatus, and a readable medium and an electronic device are provided. The method includes: collecting a facial image of a user by means of a terminal, and taking the collected facial image as a first facial image, displaying the first facial image in a user display area of a terminal screen; where the terminal screen displays a target object, collecting a sound signal of the user, and taking the collected sound signal as a target sound signal; and if the sound intensity of the target sound signal is within a first intensity range, switching a display state of the target object, and switching the first facial image in the user display area to a second facial image, wherein the second facial image is obtained on the basis of the first facial image.

Abstract: An encoding method is provided. The encoding method comprises: encoding a first portion of target data to generate a first two dimensional code; encoding a second portion of the target data by the encoding unit generate a second two dimensional code; generating a three dimensional model according to the first two dimensional code, wherein the three dimensional model includes a plurality of three dimensional modules, the three dimensional modules are arranged along a first direction and a second direction, and a height in a third direction of the three dimensional modules is determined according to the first codes; coloring the three dimensional modules according to the second two dimensional code, respectively, to generate a colored three dimensional model, wherein a color of the three dimensional modules of the colored three dimensional model is determined according to the second codes.

Abstract: An integrated circuit (IC) film for a smart card is provided. The IC film includes a flexible printed circuit (FPC) board, first electrical contacts, second electrical contacts, and an IC chip. The first electrical contacts are disposed on a first side of the FPC board, and the second electrical contacts are disposed on a second side of the FPC board. The IC chip is disposed on the FPC board and bonded to the leads of the FPC board to thereby form electrical connection. The total thickness of the FPC board and the chip is not larger than 0.5 mm.

Abstract: The invention provides an optical disk drive. The optical disk drive comprises a pickup head, a seek control device, a lens vision characteristic decoder, and an anti lens shift device. The pickup head comprises a sled and a lens for projecting a beam on a disk. The seek control device moves the sled, and shifts the lens with a shift distance relative to an origin at a center of the sled. The equalizer derives a servo signal from a reflection of the beam. The lens vision characteristic decoder obtains a vision characteristic of the lens according to the servo signal and determines a track-on direction according to the vision characteristic. The anti lens shift device triggers the seek control device to perform a track-on process according to the track-on direction.

Abstract: A temperature conditioning system for outdoor digital signage and method thereof comprises a central control module, a system temperature sensor, a fan temperature sensor, a digital signage control module, an internal power supply module, a display module, a heating module and an external fan, wherein the central control module is responsible for receiving temperature signals detected by the system temperature sensor and the fan temperature sensor; in case the detected temperature is lower than a certain range, the central control module activates the heating module, the external fan and the display module in order to start and display the warm-up process of the outdoor digital signage.

Abstract: An integrated circuit (IC) film for a smart card is provided. The IC film includes a flexible printed circuit (FPC) board, first electrical contacts, second electrical contacts, and an IC chip. The first electrical contacts are disposed on a first side of the FPC board, and the second electrical contacts are disposed on a second side of the FPC board. The IC chip is disposed on the FPC board and bonded to the leads of the FPC board to thereby form electrical connection. The total thickness of the FPC board and the chip is not larger than 0.5 mm.

Abstract: A method for adjusting the working frequency of a chip is provided. The method detects a frequency adjustment range of a graphic chip when a system is booted. Then, an application program in full screen mode is executed, and a control hot key is enabled. Afterwards, an input of the control hot key is received to display a user interface. Finally, an input frequency inputted from the user interface is received, and the working frequency of the graphic chip is adjusted according to the input frequency in the frequency adjustment range. Therefore, even though the application program is executed in full screen mode, the working frequency of the graphic chip can still be adjusted according to requirements in any time, which is convenient for the user.

Abstract: The invention provides a digital signage replacement module. The digital signage has a main circuit board and a plug-board disposed therein and connected to each other. The plug-board has a plug-card with a plug-slot, and a track disposed on each side thereof. The digital signage is covered up by a back cover so that an opening can be formed at one side edge of the digital signage. The computer module has a frame and a motherboard. The frame has a rail disposed on each side thereof and the motherboard has a slot and a connecting terminal disposed thereon. The slot has an interface socket card. The computer module can be placed into the digital signage through the opening with the rail placed into the track. Therefore, the connecting terminal is connected to the plug-slot and the computer module can be drawn out for maintenance.

Abstract: A brightness enhancement film of a backlight module includes a substrate and a plurality of microstructure units. The substrate has an edge having an extension direction. The microstructure units are jointed on a surface of the substrate with the junction areas. The junction areas have different extension directions and different extension lengths. The extension directions and extension lengths of the junction areas are combined to form a resultant vector. An included angle is formed between a direction of the resultant vector and the extension direction of the edge of the substrate, and a range of the included angle is from negative 45 degree to positive 45 degree.

Abstract: A management method of shader clock includes providing a management interface under an operation system environment for receiving an input of a user. When a frequency value to be set of a shader clock input by the user is received, the management method of the present invention can obtain a plurality of parameter values according to the input of the user and respectively write the parameter values into corresponding shader clock registers so as to dynamically set the frequency of the shader clock.

Abstract: The invention provides an optical disk drive. The optical disk drive comprises a pickup head, a seek control device, a lens vision characteristic decoder, and an anti lens shift device. The pickup head comprises a sled and a lens for projecting a beam on a disk. The seek control device moves the sled, and shifts the lens with a shift distance relative to an origin at a center of the sled. The equalizer derives a servo signal from a reflection of the beam. The lens vision characteristic decoder obtains a vision characteristic of the lens according to the servo signal and determines a track-on direction according to the vision characteristic. The anti lens shift device triggers the seek control device to perform a track-on process according to the track-on direction.

Abstract: A backlight module includes a light source and an integrated optical film. The integrated optical film includes a base, a brightness enhancement layer and a diffusion layer. The base has a first surface and a second surface opposite to each other. The brightness enhancement layer has a plurality of brightness enhancement columns and a plurality of diffusion particles. The brightness enhancement columns are disposed on the first surface. The diffusion particles are dispersed in the brightness enhancement columns. The diffusion layer has a plurality of granular patterns disposed on the second surface in an irregular arrangement. Light beams emitted from the light source pass through the diffusion layer, the base and the brightness enhancement layer in proper order.

Abstract: A system design for a digital electronic sign board comprises a main circuit module, an adapter module and a computer module; wherein the adapter module is fixed between the main circuit module and the computer module. The main circuit module and the adapter module are fixed in the digital electronic sign board. The computer module is externally inserted into the digital electronic sign board. Therefore the computer module and the main circuit module are electrically connected through the adapter module. The system design of the present invention removable and attached the computer module with the main circuit module. As a result, when a maintenance worker needs to perform maintenance on the computer module, he or she can conveniently pull out the computer module from the digital electronic sign board and insert the computer module back to the digital electronic sign board after maintenance is done so as to improve the efficiency and quality of maintenance.

Abstract: A heat dissipation system for digital electronic signboard includes a first heat dissipation subsystem disposed in a main circuit board area of a digital electronic signboard, and a second heat dissipation subsystem disposed in a computer mainboard area of the digital electronic signboard. The main circuit board area has a plurality of heat dissipation fans disposed therein, wherein one heat dissipation fan is disposed at a side of the main circuit board area, while another heat dissipation fan is disposed at a side of a power supply and can be externally connected to an air guide pipe. The computer mainboard area can also have a plurality of heat dissipation fans disposed therein, wherein one heat dissipation fan is disposed at a side of the computer mainboard, while another heat dissipation fan is disposed on the top of a microprocessor of the computer mainboard.

Abstract: The invention provides a computer module replacement design of a digital signage. The digital signage has a main circuit board and a plug-board disposed therein and connected to each other. The plug-board has a plug-card with a plug-slot, and a track disposed on each side thereof. The digital signage is covered up by a back cover so that an opening can be formed at one side edge of the digital signage. The computer module has a frame and a motherboard. The frame has a rail disposed on each side thereof and the motherboard has a slot and a connecting terminal disposed thereon. The slot has an interface socket card. The computer module can be placed into the digital signage through the opening with the rail placed into the track. Therefore, the connecting terminal is connected to the plug-slot and the computer module can be drawn out for maintenance.

Abstract: A heat dissipation system for digital electronic signboard includes a first heat dissipation subsystem disposed in a main circuit board area of a digital electronic signboard, and a second heat dissipation subsystem disposed in a computer mainboard area of the digital electronic signboard. The main circuit board area has a plurality of heat dissipation fans disposed therein, wherein one heat dissipation fan is disposed at a side of the main circuit board area, while another heat dissipation fan is disposed at a side of a power supply and can be externally connected to an air guide pipe. The computer mainboard area can also have a plurality of heat dissipation fans disposed therein, wherein one heat dissipation fan is disposed at a side of the computer mainboard, while another heat dissipation fan is disposed on the top of a microprocessor of the computer mainboard.