Patents by Inventor Hua-Wei Chen

Hua-Wei Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240134180
    Abstract: An optical device and the prism module thereof are provided. The prism module includes a first prism, a second prism, and a third prism. The second prism is disposed beside the first prism. The third prism is adhered to the second prism. First light enters the first prism, is reflected plural times in the first prism, enters the second prism, and is emitted from the second prism. Second light enters the second prism, is reflected plural times in the second prism, and is emitted from the second prism. Third light sequentially passes through the third prism and the second prism, enters the first prism, is reflected plural times in the first prism, and is emitted from the first prism.
    Type: Application
    Filed: October 19, 2023
    Publication date: April 25, 2024
    Inventors: Fei Han, Xiao-Yao Zhang, Yue-Ye Chen, Ling-Wei Zhao, Jun-Wei Che, Hua-Tang Liu
  • Publication number: 20240128211
    Abstract: Some implementations described herein provide techniques and apparatuses for a stacked semiconductor die package. The stacked semiconductor die package may include an upper semiconductor die package above a lower semiconductor die package. The stacked semiconductor die package includes one or more rows of pad structures located within a footprint of a semiconductor die of the lower semiconductor die package. The one or more rows of pad structures may be used to mount the upper semiconductor die package above the lower semiconductor die package. Relative to another stacked semiconductor die package including a row of dummy connection structures adjacent to the semiconductor die that may be used to mount the upper semiconductor die package, a size of the stacked semiconductor die package may be reduced.
    Type: Application
    Filed: April 27, 2023
    Publication date: April 18, 2024
    Inventors: Chih-Wei WU, An-Jhih SU, Hua-Wei TSENG, Ying-Ching SHIH, Wen-Chih CHIOU, Chun-Wei CHEN, Ming Shih YEH, Wei-Cheng WU, Der-Chyang YEH
  • Patent number: 11961738
    Abstract: In a method of forming a pattern, a first pattern is formed over an underlying layer, the first pattern including main patterns and a lateral protrusion having a thickness of less than 25% of a thickness of the main patterns, a hard mask layer is formed over the first pattern, a planarization operation is performed to expose the first pattern without exposing the lateral protrusion, a hard mask pattern is formed by removing the first pattern while the lateral protrusion being covered by the hard mask layer, and the underlying layer is patterned using the hard mask pattern as an etching mask.
    Type: Grant
    Filed: February 12, 2021
    Date of Patent: April 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chin-Ta Chen, Hua-Tai Lin, Han-Wei Wu, Jiann-Yuan Huang
  • Publication number: 20240105518
    Abstract: A first group of semiconductor fins are over a first region of a substrate, the substrate includes a first stepped profile between two of the first group of semiconductor fins, and the first stepped profile comprises a first lower step, two first upper steps, and two first step rises extending from opposite sides of the first lower step to the first upper steps. A second group of semiconductor fins are over a second region of the substrate, the substrate includes a second stepped profile between two of the second group of semiconductor fins, and the second stepped profile comprises a second lower step, two second upper steps, and two second step rises extending from opposite sides of the second lower step to the second upper steps, in which the second upper steps are wider than the first upper steps in the cross-sectional view.
    Type: Application
    Filed: January 11, 2023
    Publication date: March 28, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chin-Ta CHEN, Han-Wei WU, Yuan-Hsiang LUNG, Hua-Tai LIN
  • Patent number: 8900818
    Abstract: The invention relates to a recombinant immunogenic composition from Rickettsia typhi. The invention also relates to a method for the use of the recombinant proteins in detection and diagnostic assays and as a component in formulations for the induction of an anti-R. typhi immune response.
    Type: Grant
    Filed: March 15, 2011
    Date of Patent: December 2, 2014
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Wei-Mei Ching, Hua-Wei Chen
  • Publication number: 20140134930
    Abstract: A deburring device, for removing burrs off an inner sidewall of a hole of a workpiece, includes a mounting seat, a first driving member, an elastic coupler, a cutter, a polisher assembly, an elastic coupler, and a controller. The first driving member is mounted on the mounting seat. The cutter is connected to the first driving member by the elastic coupler. The polishing assembly is assembled to the mounting seat and arranged opposite to the cutter, in which the controller is electrically connected to the first driving member and the polisher assembly. The controller controls the cutter to enter the hole of the workpiece and mill the inner sidewall of the hole of the workpiece to remove burrs off the workpiece, the polishing pad moves to remove burrs generated by the cutter.
    Type: Application
    Filed: November 1, 2013
    Publication date: May 15, 2014
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., FU DING ELECTRONICAL TECHNOLOGY (JIASHAN) CO.,LTD.
    Inventors: HUA-WEI CHEN, YONG-HUA ZHANG
  • Publication number: 20130000138
    Abstract: A drying system positioned after a foregoing workstation or system for drying workpieces, includes a transport belt for the workpieces to be positioned on; and at least one oven including a main body and a drying member positioned on top of the main body for heating the air in the oven. The main body of the oven includes a base and an air guiding member positioned on the base, and the base and the air guiding member cooperatively define a chamber running through the at least one oven. The transport belt passes through the foregoing workstation and through the chamber. The integration of the drying system with other manufacturing workstations or systems may save time and labor used for transporting workpieces in between drying and other manufacturing steps. The disclosure also provides an oven utilized in the drying system.
    Type: Application
    Filed: February 16, 2012
    Publication date: January 3, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: SHENG-FA LIN, FENG YAO, YONG-HUA ZHANG, WEI SHEN, JIN-LONG YU, HUA-WEI CHEN
  • Publication number: 20120273249
    Abstract: The present invention relates to a cable having weldable shield and includes an insulating plastic jacket being a hollow tube made of an insulation material, such as PVC, PE, XLPE or PU; at least one core wire being correspondingly located in the insulating plastic jacket to axially extend therethrough for power or signal transmission; and a shield being correspondingly provided inside the insulating plastic jacket to axially extend therethrough and being located outside the core wire for shielding electromagnetic wave. The shield can be a braided shield formed by braiding strands of wires on a multi-carrier wire-braiding machine, of which the number of carriers can be determined according to actual need. And the wires on at least one of the carriers are weldable wires.
    Type: Application
    Filed: April 28, 2011
    Publication date: November 1, 2012
    Inventor: HUA-WEI CHEN
  • Publication number: 20120202190
    Abstract: A method for detection blood borne pathogen in whole blood, comprising collecting a blood sample from a subject, heating said sample for a period of time, adding said heated sample to a pre-mixed LAMP solution comprising one or more LAMP primer set, and Bst DNA polymerase to create a reaction mixture, incubating said reaction mixture for a period of time and determining the presence of blood born pathogen.
    Type: Application
    Filed: February 9, 2012
    Publication date: August 9, 2012
    Inventors: Wei-Mei Ching, Chien-Chung Chao, Hua-Wei Chen
  • Publication number: 20110171245
    Abstract: The invention relates to a recombinant immunogenic composition from Rickettsia typhi. The invention also relates to a method for the use of the recombinant proteins in detection and diagnostic assays and as a component in formulations for the induction of an anti-R. typhi immune response.
    Type: Application
    Filed: March 15, 2011
    Publication date: July 14, 2011
    Inventors: Wei-Mei Ching, Hua-Wei Chen
  • Patent number: 7928194
    Abstract: The invention relates to a recombinant immunogenic composition from Rickettsia typhi. The invention also relates to a method for the use of the recombinant proteins in detection and diagnostic assays and as a component in formulations for the induction of an anti-R. typhi immune response.
    Type: Grant
    Filed: July 27, 2007
    Date of Patent: April 19, 2011
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Wei-Mei Ching, Hua-Wei Chen
  • Patent number: 7824875
    Abstract: The invention relates to a method for the detection of prior exposure to Coxiella burnetii infection by antibody-based assays using recombinant, immunodominant C. burnetii polypeptides. The invention also relates to the design of biotin or His-tagged C. burnetii proteins useful in the antibody-based assays as standardized antigen reagents.
    Type: Grant
    Filed: December 11, 2007
    Date of Patent: November 2, 2010
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Wei-Mei Ching, Chien-Chung Chao, Xuan Li, Hua-Wei Chen
  • Patent number: 7824909
    Abstract: The invention relates to a method for the detection of prior exposure to Coxiella. burnetii infection by antibody-based assays using recombinant, immunodominant C. burnetii polypeptides. The invention also relates to the design of biotin or His-tagged C. burnetii proteins useful in the antibody-based assays as standardized antigen reagents.
    Type: Grant
    Filed: December 11, 2007
    Date of Patent: November 2, 2010
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Wei-Mei Ching, Chien-Chung Chao, Xuan Li, Hua-Wei Chen
  • Publication number: 20090176214
    Abstract: The invention relates to a method for the detection of prior exposure to Coxiella. burnetii infection by antibody-based assays using recombinant, immunodominant C. burnetii polypeptides. The invention also relates to the design of biotin or His-tagged C. burnetii proteins useful in the antibody-based assays as standardized antigen reagents.
    Type: Application
    Filed: December 11, 2007
    Publication date: July 9, 2009
    Inventors: Wei-Mei Ching, Chien-Chung Chao, Xuan Li, Hua-Wei Chen
  • Publication number: 20090098647
    Abstract: The invention relates to a method for the detection of prior exposure to Coxiella burnetii infection by antibody-based assays using recombinant, immunodominant C. burnetii polypeptides. The invention also relates to the design of biotin or His-tagged C. burnetii proteins useful in the antibody-based assays as standardized antigen reagents.
    Type: Application
    Filed: December 11, 2007
    Publication date: April 16, 2009
    Inventors: Wei-Mei Ching, Chien-Chung Chao, Xuan Li, Hua-Wei Chen
  • Publication number: 20090022754
    Abstract: The invention relates to a recombinant immunogenic composition from Rickettsia typhi. The invention also relates to a method for the use of the recombinant proteins in detection and diagnostic assays and as a component in formulations for the induction of an anti-R. typhi immune response.
    Type: Application
    Filed: July 27, 2007
    Publication date: January 22, 2009
    Inventors: Wei-Mei Ching, Hua-Wei Chen
  • Patent number: 7329503
    Abstract: The invention relates to a method for the detection of prior exposure to Coxiella. burnetii infection by antibody-based assays using recombinant, immunodominant C. burnetii polypeptides. The invention also relates to the design of biotin or His-tagged C. burnetii proteins useful in the antibody-based assays as standardized antigen reagents.
    Type: Grant
    Filed: April 4, 2006
    Date of Patent: February 12, 2008
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Wei-Mei Ching, Chien-Chung Chao, Xuan Li, Hua-Wei Chen
  • Publication number: 20070009929
    Abstract: The invention relates to a method for the detection of prior exposure to Coxiella. burnetii infection by antibody-based assays using recombinant, immunodominant C. burnetii polypeptides. The invention also relates to the design of biotin or His-tagged C. burnetii proteins useful in the antibody-based assays as standardized antigen reagents.
    Type: Application
    Filed: April 4, 2006
    Publication date: January 11, 2007
    Inventors: Wei-Mei Ching, Chien-Chung Chao, Xuan Li, Hua-Wei Chen