Patents by Inventor Hua-Wei Peng

Hua-Wei Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12259657
    Abstract: A lithography system includes an immersion lithographic apparatus, a fluid supply device, and a sensor. The fluid supply is configured to supply fluid to the immersion lithographic apparatus. The fluid supply device includes at least one liquid storage tank, an upper liquid pipe and a lower liquid pipe connected to the liquid storage tank. The sensor includes at least one hydraulic pressure gauge. The at least one hydraulic pressure gauge is arranged near a lower part of the liquid storage tank and connected to the lower liquid pipe and the upper liquid pipe so as to measure the hydraulic pressure at a bottom of the liquid storage tank. The height of the liquid level in the liquid storage tank is calculated from the hydraulic pressure.
    Type: Grant
    Filed: April 25, 2023
    Date of Patent: March 25, 2025
    Assignee: United Microelectronics Corp.
    Inventors: Zhi Fan Sun, Kuo Feng Huang, Ming Hsien Chung, Hua-Wei Peng, Chih Chung Kuo
  • Publication number: 20240319611
    Abstract: A lithography system includes an immersion lithographic apparatus, a fluid supply device, and a sensor. The fluid supply is configured to supply fluid to the immersion lithographic apparatus. The fluid supply device includes at least one liquid storage tank, an upper liquid pipe and a lower liquid pipe connected to the liquid storage tank. The sensor includes at least one hydraulic pressure gauge. The at least one hydraulic pressure gauge is arranged near a lower part of the liquid storage tank and connected to the lower liquid pipe and the upper liquid pipe so as to measure the hydraulic pressure at a bottom of the liquid storage tank. The height of the liquid level in the liquid storage tank is calculated from the hydraulic pressure.
    Type: Application
    Filed: April 25, 2023
    Publication date: September 26, 2024
    Applicant: United Microelectronics Corp.
    Inventors: Zhi Fan Sun, Kuo Feng Huang, Ming Hsien Chung, Hua-Wei Peng, Chih Chung Kuo
  • Patent number: 11551955
    Abstract: A substrate processing apparatus includes a process station for processing a substrate; a cassette station integrated with the process station; a substrate carriage equipped for transferring the substrate between said process station and the cassette station through a passage located at an interface between the process station and said cassette station; and a substrate scanner equipped at said interface between the process station and the cassette station for capturing surface image data during transportation of the substrate that passes through the passage.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: January 10, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Ming-Che Lai, Hua-Wei Peng, Chia-He Cheng, Ming-Tso Chen, Chao-Chi Lu, Hsin-Hsu Lin, Kuo-Tsai Lo, Kao-Hua Wu, Huan-Hsin Yeh
  • Publication number: 20210280444
    Abstract: A substrate processing apparatus includes a process station for processing a substrate; a cassette station integrated with the process station; a substrate carriage equipped for transferring the substrate between said process station and the cassette station through a passage located at an interface between the process station and said cassette station; and a substrate scanner equipped at said interface between the process station and the cassette station for capturing surface image data during transportation of the substrate that passes through the passage.
    Type: Application
    Filed: March 26, 2020
    Publication date: September 9, 2021
    Inventors: Ming-Che Lai, Hua-Wei Peng, Chia-He Cheng, Ming-Tso Chen, Chao-Chi Lu, Hsin-Hsu Lin, Kuo-Tsai Lo, Kao-Hua Wu, Huan-Hsin Yeh
  • Patent number: 9978795
    Abstract: A semiconductor structure includes a substrate, a plurality of image sensing devices formed in the substrate, at least a passivation layer formed on the substrate, a plurality of first metal patterns formed on the passivation layer, a plurality of gaps formed between the first metal patterns, an insulating layer lining the gaps, and a plurality of light-guiding structures respectively formed in the gaps. The light-guiding structures respectively include an anchor portion and a body portion, and bottom surfaces of the anchor portions being lower than top surfaces of the first metal patterns.
    Type: Grant
    Filed: January 8, 2017
    Date of Patent: May 22, 2018
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Jy-Hwang Lin, Wen-Chieh Wang, Tien-Shang Kuo, Fu-Hsuan Chu, Hua-Wei Peng