Patents by Inventor Hua-Wei Peng

Hua-Wei Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11551955
    Abstract: A substrate processing apparatus includes a process station for processing a substrate; a cassette station integrated with the process station; a substrate carriage equipped for transferring the substrate between said process station and the cassette station through a passage located at an interface between the process station and said cassette station; and a substrate scanner equipped at said interface between the process station and the cassette station for capturing surface image data during transportation of the substrate that passes through the passage.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: January 10, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Ming-Che Lai, Hua-Wei Peng, Chia-He Cheng, Ming-Tso Chen, Chao-Chi Lu, Hsin-Hsu Lin, Kuo-Tsai Lo, Kao-Hua Wu, Huan-Hsin Yeh
  • Publication number: 20210280444
    Abstract: A substrate processing apparatus includes a process station for processing a substrate; a cassette station integrated with the process station; a substrate carriage equipped for transferring the substrate between said process station and the cassette station through a passage located at an interface between the process station and said cassette station; and a substrate scanner equipped at said interface between the process station and the cassette station for capturing surface image data during transportation of the substrate that passes through the passage.
    Type: Application
    Filed: March 26, 2020
    Publication date: September 9, 2021
    Inventors: Ming-Che Lai, Hua-Wei Peng, Chia-He Cheng, Ming-Tso Chen, Chao-Chi Lu, Hsin-Hsu Lin, Kuo-Tsai Lo, Kao-Hua Wu, Huan-Hsin Yeh
  • Patent number: 9978795
    Abstract: A semiconductor structure includes a substrate, a plurality of image sensing devices formed in the substrate, at least a passivation layer formed on the substrate, a plurality of first metal patterns formed on the passivation layer, a plurality of gaps formed between the first metal patterns, an insulating layer lining the gaps, and a plurality of light-guiding structures respectively formed in the gaps. The light-guiding structures respectively include an anchor portion and a body portion, and bottom surfaces of the anchor portions being lower than top surfaces of the first metal patterns.
    Type: Grant
    Filed: January 8, 2017
    Date of Patent: May 22, 2018
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Jy-Hwang Lin, Wen-Chieh Wang, Tien-Shang Kuo, Fu-Hsuan Chu, Hua-Wei Peng