Abstract: An electrical card connector for insertion of a first card and a second card which is wider than the first card, includes an insulative housing defining a front mating port, a card receiving space extending backwardly from the mating port for receiving the first and the second cards, and a plurality of terminals for mating with a first card and a second card wider than the first card. A card restriction mechanism is fixed to the insulative housing and includes a guiding body and an elastic spring located on the guiding body. The guiding body restricts and guides the first card and second cards to be inserted into the receiving space while the cards moving through the mating port.

Abstract: A USB card connector includes an insulative housing and a plurality of contacts retained in the insulative housing. The insulative housing includes a rear wall and a card receiving cavity located forward the rear wall. Each contact includes a contact portion protruding to the card receiving cavity. The contacts are divided into first and second contact groups with same contact arrangement in condition that each the first or the second contact group comprises four contacts for transmitting USB or similar-USB signals.

Abstract: An electrical card connector (100) for insertion of an electrical card (200) comprises an insulative housing (1), a plurality of terminals (2) coupled to the insulative housing and a first shell (4). The insulaitve housing comprises a base portion (11), an arm portion (12) extending from a lateral side of the base portion, and a receiving space (13) formed between the base portion and the arm portion to receive the electrical card. The terminals are coupled to the base portion and extend into the receiving space for electrical connection to the electrical card. The first shell (4) is integrally molded with the insulative housing (1) and covers the insulative housing.

Abstract: An electrical card connector (100) to be mounted on a printed circuit board and includes: an insulative housing (1) having a first receiving cavity (14) for receiving a first card (300) and a second receiving cavity (13) for receiving a second card (200), and a number of passageways (132), and a number of contacts retained in the passageways respectively. The contacts include a number of first contacts (3) each having a first contacting portion (32) for contacting with the first card, a first soldering portion (35) to be soldered onto the printed circuit board and a first base portion (30) connecting with the first contacting portion and the first soldering portion; a plurality of second contacts (2) spaced from the first contacts, and defining a second base portion (21) and a second contacting portion (22) extending forwardly from the second base portion to contact with the second card.

Abstract: According to one embodiment of the present invention, a card edge connector (100) includes an elongated insulative housing (1) having a central slot (15) cooperatively enclosed by a bottom wall (150) and a pair of sidewalls thereof (13). A number of conductive terminals (2) are arranged along the central slot for mechanical and electrical engagement with a daughter circuit board (5) coupled thereto. The bottom wall of the housing defines a number of airways (151) in communication with the central slot, so as to dissipate heat generated by the conductive terminals during signal transmission to the outer circumstance timely.

Abstract: According to one embodiment of the present invention, a card edge connector (100) includes an elongated insulative housing (1) having a central slot (15) cooperatively enclosed by a bottom wall (150) and a pair of sidewalls thereof (13). A number of conductive terminals (2) are arranged along the central slot for mechanical and electrical engagement with a daughter circuit board (5) coupled thereto. The bottom wall of the housing defines a number of airways (151) in communication with the central slot, so as to dissipate heat generated by the conductive terminals during signal transmission to the outer circumstance timely.

Abstract: A transcutaneous device dressing and method for its use with a transcutaneous medical device, such as an intravascular catheter, which punctures the skin of a patient and which has a portion of the medical device protruding from the skin which can lead to infection. The dressing includes a top and a bottom dressing, both being formed from a flexible material and having upper and lower surfaces, with the lower surface being the skin facing surface in use. The bottom dressing has a slit formed therein extending from one edge inwardly to a termination point within the confines of the bottom dressing. An anti-microbial material is provided without the use of adhesives at the upper and lower surfaces of the bottom dressing, and at least at the lower surface of the top dressing.

Abstract: The electrical connector (1) includes a base having a number of terminals (12) thereon and a load plate (40) pivotally attached to a side of the base and locked in an opposite side of the base. The load plate (40) is stamped from a sheet of metal to form at least one pressing protrusion (43) to engagingly press an IC (60) in order to hold the IC (60) on the base. At least one pressing protrusion (43) has an outer edge (431) adjacent the IC (60) when the IC (60) is held on the base. The outer edge (431) is coined, thereby weeding out burrs formed on said outer edge (431) after the load plate (40) is stamped. As a result, the shape of the coined outer edge (431) of the pressing protrusion (43) can avoid scraping an IHS conglutinated on the IC (60) when the load plate (40) presses the IC (60), thereby to safely interconnect the IC (60) with the PCB.

Abstract: The present invention provides plastics with high toughness and the preparation thereof. The plastics with high toughness, which have the balance of stiffness and toughness, stable properties and good processability, are obtained by blending the rubber particles having an average particle size of 20 to 200 nm with the pseudoductile plastics, wherein the weight ratio of the rubber particles to the plastics is from 0.5:99.5 to 70:30. The present invention also provides plastics with both high stiffness and high toughness and the preparation thereof. The plastics with both high stiffness and high toughness, which have also an improved heat resistance and good processability, are prepared by blending the rubber particles having an average particle size of 20 to 500 nm and the crystalline plastics, wherein the amount of the rubber particles added in the plastics matrix is from 0.3 to 5 weight parts.

Abstract: The invention relates to the use of one or more antimicrobial metals, most preferably silver, preferably formed with atomic disorder, and preferably in a nanocrystalline form, for the treatment of inflammatory skin conditions. The nanocrystalline antimicrobial metal of choice may be used in the form of a nanocrystalline coating of one or more antimicrobial metals, a nanocrystalline powder of one or more antimicrobial metals, or a solution containing dissolved species from a nanocrystalline powder or coating of one or more antimicrobial metals.

Abstract: The present invention provides a toughened plastic and its preparation method, with said toughened plastic being obtained by rubber-plastic blending of brittle or less brittle plastics and a rubber mixture. Said rubber mixture consists of powdery rubbers having a cross-linked structure and an average particle size of not more than 0.50 &mgr;m, and at least one selected from the group consisting of unvulcanized rubbers and thermoplastic elastomers. The morphology and the particle size distribution of the rubber phase contained in said toughened plastic can be controlled by changing the particle size of the powdery rubbers having a cross-linking structure and choosing proper unvulcanized rubbers or thermoplastic elastomers. The toughened plastic, according to the present invention has good toughness and processability while keeping better strength and stiffness.

Abstract: The present invention provides plastics with high toughness and the preparation thereof. The plastics with high toughness, which have the balance of stiffness and toughness, stable properties and good processability, are obtained by blending the rubber particles having an average particle size of 20 to 200 nm with the pseudoductile plastics, wherein the weight ratio of the rubber particles to the plastics is from 0.5:99.5 to 70:30. The present invention also provides plastics with both high stiffness and high toughness and the preparation thereof. The plastics with both high stiffness and high toughness, which have also an improved heat resistance and good processability, are prepared by blending the rubber particles having an average particle size of 20 to 500 nm and the crystalline plastics, wherein the amount of the rubber particles added in the plastics matrix is from 0.3 to 5 weight parts.

Abstract: The present invention provides a fully vulcanized powdery rubber having a particle size of from 20 to 2000 nm, its preparation and use. The vulcanized powdery rubber is obtained by irradiating a rubber latex having a particle size of from 20 to 2000 nm with a high-energy irradiation. The vulcanized powdery rubber is very easily to be dispersed into various plastics, and thus can be mixed with various plastics to prepare toughened plastics and fully valcanized thermoplastic elastomers.

Abstract: A bracket (10) includes a pair of side stands (12) spaced away from but interconnected with each other by respectively a supporting bar (14) formed on the front upper portions (17) thereof for supportably mounting a connector (22) thereon and/or a spacer bar (16) formed on the rear lower portions (19) thereof for aligning contact tails (30) of the connector (22). Each side stand (12) includes its own boardlock (48) for directly mounting the bracket (10) onto the mother board (100). An L-shaped partition bar (42) is connected between the supporting bar (14) and the spacer bar (16) for separating the space under the supporting bar (14) to smaller ones for accommodating plural less sized connectors (66) or components therein.

Abstract: A bracket (10) includes a pair of side stands (12) spaced away from but interconnected with each other by respectively a supporting bar (14) formed on the front upper portions (17) thereof for supportably mounting a connector (22) thereon and/or a spacer bar (16) formed on the rear lower portions (19) thereof for aligning contact tails (30) of the connector (22). Each side stand (12) includes its own boardlock (48) for directly mounting the bracket (10) onto the mother board (100). An L-shaped partition bar (42) is connected between the supporting bar (14) and the spacer bar (16) for separating the space under the supporting bar (14) to smaller ones for accommodating plural less sized connectors (66) or components therein.