Patents by Inventor Hua-Yuan LIN

Hua-Yuan LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240310126
    Abstract: A vapor chamber includes a first cover, a second cover and a partition. The second cover and the first cover are bonded together to form a heat dissipation space. The second cover has at least two through holes. The at least two through holes correspond to the heat dissipation space. The at least two through holes are configured for at least two pipes to be inserted therein. The partition is located in the heat dissipation space, and protrudes from the first cover. The partition divides the heat dissipation space into an air tight subspace and an open subspace which are not in fluid communication with each other. The partition surrounds the open subspace. The open subspace is in fluid communication with the at least two through holes.
    Type: Application
    Filed: September 27, 2023
    Publication date: September 19, 2024
    Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    Inventors: Lei Lei LIU, Hua-Yuan LIN, Yao-Chun WANG, Zhijie YANG
  • Publication number: 20240206119
    Abstract: A vapor chamber including a first plate, second plate, plurality of first support structures, plurality of second support structures, and at least one tubular heat transfer structure is provided. The first plate and the second plate define an interior cavity having a first, second, and third portion, the first, second, and third portion each have a first, second, and third depth, respectively, the plurality of first support structures is disposed in the first portion, the plurality of support structures is disposed in the second portion and the third portion, respectively, the at least one tubular heat transfer structure is disposed in the first portion and includes a first working fluid having a first working fluid circulation path, the first portion, the second portion, and the third portion include a second working fluid having a second working fluid circulation path different from the first working fluid circulation path.
    Type: Application
    Filed: December 18, 2023
    Publication date: June 20, 2024
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Hua-Yuan LIN, Lei Lei LIU, Yao-Chun WANG
  • Publication number: 20240179871
    Abstract: A vapor chamber including a first plate, second plate, plurality of support structures, and plurality of heat transfer structures is provided. The first plate and the second plate define an interior cavity having a first portion, a pair of second portions, and a pair of third portions. The pair of second portions and pair of third portions surround the first portion. A length of the pair of third portions defines a longitudinal direction and is greater than a width of the pair of second portions. The plurality of heat transfer structures is disposed in the first portion and the plurality of support structures is disposed throughout the interior cavity. A position of the structure length of each of the plurality of heat transfer structures is in line with the longitudinal direction so that working fluid flows from the pair of third portions to and through the first portion unhindered.
    Type: Application
    Filed: November 30, 2023
    Publication date: May 30, 2024
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Hua-Yuan LIN, Yao-Chun WANG
  • Publication number: 20240110751
    Abstract: A thin heat pipe including a thin heat pipe container, wick structure, working fluid, and vapor flow passage section is provided. The thin heat pipe container includes a lower inner wall and upper inner wall. The wick structure is disposed on the lower inner wall and includes a first wick structure portion connected to a second wick structure portion. The vapor flow passage section is configured for vapor to flow therethrough. A thickness of the second wick structure portion is lesser than a thickness of the first wick structure portion and the second wick structure portion does not contact, contact points between the upper inner wall and lower inner wall. The wick structure defines the vapor flow passage section. The first wick structure contacts the upper inner wall and second wick structure. Working fluid is pulled from vapor condenser sections to high temperature sections via the wick structure.
    Type: Application
    Filed: September 26, 2023
    Publication date: April 4, 2024
    Inventors: Xue Mei WANG, Xiao Min ZHANG, HUA-YUAN LIN
  • Publication number: 20230175788
    Abstract: A vapor chamber includes a first cover, a second cover, a sealing ring and a sealing plug. The first cover has a thermal contact surface. The second cover is coupled with the first cover so as to form an interior space together, and the second cover has a vent hole. The sealing ring has a channel and at least one opening. The opening is in fluid communication with the channel, the sealing ring is clamped between the first cover and the second cover, and the vent hole is in fluid communication with the interior space via the channel and the opening. The vent hole and the channel are plugged with the sealing plug so as to seal the interior space.
    Type: Application
    Filed: August 11, 2022
    Publication date: June 8, 2023
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Lei-Lei LIU, Xuemei WANG, Xiao-Min ZHANG, Hua-Yuan LIN