Patents by Inventor Hua Zhao

Hua Zhao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250163686
    Abstract: A faucet connection structure comprising a faucet, a protective sleeve, an inlet diverting base, and a connecting water pipe. The connecting water pipe plays the role of connecting and securing and passes through the protective sleeve. The connecting water pipe has an upper end that connects to a faucet inlet pipe of the faucet, and a lower end that connects and locks with the inlet diverting base. The protective sleeve is coupled between the faucet inlet pipe and the inlet diverting base, eliminating the need to fix ends of the protective sleeve. This configuration simplifies the mounting steps and increases the mounting efficiency. The configuration allows for no collision to occur during the process of cleaning the protective sleeve. The cleaning process is convenient for users. The protective sleeve can be selected from a wide range of shapes, enriching the appearances of the products.
    Type: Application
    Filed: November 19, 2024
    Publication date: May 22, 2025
    Applicant: Beijing Kohler Ltd.
    Inventors: Liguo YAN, Hua ZHAO, Zhiqiang ZHANG
  • Publication number: 20250158619
    Abstract: Multi-chip systems and structures for modular scaling are described. In some embodiments an interfacing bar is utilized to couple adjacent chips. For example, a communication bar may utilized to coupled logic chips, and memory bar may be utilized to couple multiple memory chips to a logic chip.
    Type: Application
    Filed: January 15, 2025
    Publication date: May 15, 2025
    Inventors: Sanjay Dabral, Bahattin Kilic, Jie-Hua Zhao, Kunzhong Hu, Suk-Kyu Ryu
  • Patent number: 12249599
    Abstract: Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.
    Type: Grant
    Filed: March 31, 2023
    Date of Patent: March 11, 2025
    Assignee: Apple Inc.
    Inventors: Wei Chen, Jie-Hua Zhao, Jun Zhai, Po-Hao Chang, Hsien-Che Lin, Ying-Chieh Ke, Kunzhong Hu
  • Patent number: 12225677
    Abstract: A server includes a casing, a first disk drive assembly, a fan assembly, a host assembly, a first expansion card assembly, a second expansion card assembly, a power supply assembly, and a second disk drive assembly. The casing has a first to third space. The second space is located between the first and third space. The first disk drive assembly, the fan assembly, and the host assembly are respectively located in the first to third space. The first and second expansion card assembly are located in the third space and above the host assembly. The power supply assembly is located in the third space. The second expansion card assembly is located between the first expansion card assembly and the power supply assembly. The second disk drive assembly is located in the third space and located between the power supply assembly and the second expansion card assembly.
    Type: Grant
    Filed: June 14, 2022
    Date of Patent: February 11, 2025
    Assignees: SQ TECHNOLOGY (SHANGHAI) CORPORATION, INVENTEC CORPORATION
    Inventors: Fanpu He, JiaQi Yuan, Xiu-Hua Zhao
  • Publication number: 20250046674
    Abstract: A module comprising: a module substrate; a system-on-chip die coupled to the module substrate; a thermal interface material layer coupled to the system-on-chip die; a stiffener structure positioned around the system-on-chip die and coupled to the module substrate; and a lid having a first portion coupled to the thermal interface material layer, a second portion coupled to the stiffener structure and a recessed region formed around the first portion and having a reduced thickness relative to the first portion and the second portion.
    Type: Application
    Filed: August 3, 2023
    Publication date: February 6, 2025
    Inventors: Suk-Kyu Ryu, Wei Hu, Jie-Hua Zhao, Myung Jin Yim
  • Patent number: 12217319
    Abstract: A method of interfacing a discrete digital workshop information system is provided, where the information system includes mutual integration among product lifecycle management (PLM), enterprise resource planning (ERP), a manufacturing execution system (MES), an energy management system (EMS), and a warehouse management system (WMS) of a finished product. A method of interfacing based on a data dictionary fusing different function datasets is proposed to solve the problems of a current discrete industry information system, such as single in function, a small amount of integrated information, a large number of “information islands” existing, incapable of achieving full-process informatization management and control, difficulty in product quality tracing and the like. By the method, it is possible to realize flexible production in a discrete manufacturing industry, precise management and control of a production process, significant improvement in product quality and significant reduction in operating costs.
    Type: Grant
    Filed: February 7, 2024
    Date of Patent: February 4, 2025
    Assignees: Machinery Technology Development Co., Ltd, Instrumentation Technology And Economy Institute
    Inventors: Sheng Zhang, Bin Xu, Hua Zhao, Dan Liu, Junguang Tan, Jian Jiao, Yedan Na, Pengfei Niu
  • Publication number: 20240421126
    Abstract: Integrated circuit (IC) structures, electronic modules, and methods of fabrication are described in which direct bonded interfaces are removed at corners or edges to counteract the potential for non-bonding or delamination. This can be accomplished during singulation, in which a side recess is formed through an entire thickness of an electronic component and into a direct bonded die, followed by final singulation of the IC structure.
    Type: Application
    Filed: March 7, 2024
    Publication date: December 19, 2024
    Inventors: Chi Nung Ni, Wei Chen, Weiming Chris Chen, Vidhya Ramachandran, Jie-Hua Zhao, Suk-Kyu Ryu, Myung Jin Yim, Chih-Ming Chung, Jun Zhai, Young Doo Jeon, Seungjae Lee
  • Publication number: 20240421013
    Abstract: Integrated circuit (IC) structure, IC die structures and methods of fabrication are described in which one or more edge recesses are formed in an IC die. Upon direct bonding to an electronic component, a molding compound can be applied to the bonded structure where the molding compound fills the one or more edge recesses and encroached underneath the IC die and between the IC die and the electronic component.
    Type: Application
    Filed: February 23, 2024
    Publication date: December 19, 2024
    Inventors: Jixuan Gong, Vidhya Ramachandran, Jie-Hua Zhao, Young Doo Jeon, Wei Chen, Jun Zhai
  • Publication number: 20240395686
    Abstract: Electronic packages and electronic systems are described in which a package redistribution layer of the electronic package includes structural features such a via line connections to reduce stress concentration, particularly when the package redistribution layer is formed of organic dielectric materials.
    Type: Application
    Filed: May 26, 2023
    Publication date: November 28, 2024
    Inventors: Wei Chen, Jie-Hua Zhao, Jun Zhai, Kunzhong Hu, Arun Sasi, Balaji Nandhivaram Muthuraman, Zezhou Liu
  • Patent number: 12134672
    Abstract: Provided herein is a masterbatch including a grafted silicone polyether and a porous inorganic nanoparticle, bacteria repellant polymer composites including the same, and methods of preparation thereof.
    Type: Grant
    Filed: February 3, 2021
    Date of Patent: November 5, 2024
    Assignee: Ka Shui Plastic Technology Co. Ltd.
    Inventors: You Wu, Ho-Man Au, Yan-Hua Zhao, Hoi-Kuan Kong, Xi-Zi Song, Wai-Chung Peter Wong, Cheuk Nang Daniel Sung, Yuen-Fat Lee
  • Patent number: 12119275
    Abstract: Modules and methods of assembly are described. A module includes a lid mounted on a module substrate and covering a component. A stiffener structure may optionally be mounted between the lid and module substrate. A recess can be formed in any of an outer wall bottom surface of the lid, and top or bottom surface of the stiffener structure such that an adhesive layer at least partially fills the recess.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: October 15, 2024
    Assignee: Apple Inc.
    Inventors: Wei Chen, Jie-Hua Zhao, Jun Zhai
  • Patent number: 12105619
    Abstract: Training a predict model with network traffic and data change messages generated by an existing web application running in a production environment. The predict model being is trained to predict data changes resulted from API calls embodied in network traffic. A stream of network traffic of the existing web application is replayed with an upgraded version of the existing web application to generate real data changes. The stream of network traffic is applied to the predict model to generate predicted data change messages. The predicted data change messages are comparing with real data change messages representing the real data changes. One or more existing APIs is identified as being possibly functionally degraded based on any inconsistency of the predicted data change messages with the real data change messages.
    Type: Grant
    Filed: July 17, 2023
    Date of Patent: October 1, 2024
    Assignee: International Business Machines Corporation
    Inventors: Pei Jian Liu, Bing Hua Zhao, Na Liu, Yan Liu, Mei Rui Su
  • Publication number: 20240289702
    Abstract: A method of interfacing a discrete digital workshop information system is provided, where the information system includes mutual integration among product lifecycle management (PLM), enterprise resource planning (ERP), a manufacturing execution system (MES), an energy management system (EMS), and a warehouse management system (WMS) of a finished product. A method of interfacing based on a data dictionary fusing different function datasets is proposed to solve the problems of a current discrete industry information system, such as single in function, a small amount of integrated information, a large number of “information islands” existing, incapable of achieving full-process informatization management and control, difficulty in product quality tracing and the like. By the method, it is possible to realize flexible production in a discrete manufacturing industry, precise management and control of a production process, significant improvement in product quality and significant reduction in operating costs.
    Type: Application
    Filed: February 7, 2024
    Publication date: August 29, 2024
    Applicants: Machinery Technology Development Co., Ltd, Instrumentation Technology And Economy Institute
    Inventors: Sheng ZHANG, Bin XU, Hua ZHAO, Dan LIU, Junguang TAN, Jian JIAO, Yedan NA, Pengfei NIU
  • Patent number: 12054594
    Abstract: A method for preparing a bacteria repellant masterbatch, bacteria repellant polymer composites comprising the same, and compositions and articles prepared therefrom.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: August 6, 2024
    Assignee: Ka Shui Plastic Technology Co. Ltd.
    Inventors: You Wu, Yan-Hua Zhao, Hoi-Kuan Kong, Ho-Man Au, Wai-Chung Peter Wong, Cheuk-Nang Daniel Sung, Yuen-Fat Lee
  • Publication number: 20240249989
    Abstract: Microelectronic structures with selectively applied underfill material and/or edge bond material are described. In an embodiment, isolated underfill regions and/or edge bond regions are applied to adjacent to one or more edges of an electronic device and form a plurality of vent openings along the one or more edges.
    Type: Application
    Filed: January 23, 2023
    Publication date: July 25, 2024
    Inventors: Wei Chen, Balaji Nandhivaram Muthuraman, Arun Sasi, Jie-Hua Zhao, Suk-Kyu Ryu, Jun Zhai, Dominic Morache, Young Doo Jeon
  • Patent number: 12045260
    Abstract: A method, system, and computer program product for data reorganization and logs reorganization. The method includes receiving, by one or more processing units, original data. The method also includes classifying, by the one or more processing units, the original data into different types based on a trained type classification model. The method also includes generating, by the one or more processing units, at least one severity for at least part of the original data based on a trained severity classification model, the at least part of the original data corresponding to at least one type. The method also includes outputting, by the one or more processing units, at least one message, the at least one message indicating the severity of the at least part of the original data.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: July 23, 2024
    Assignee: International Business Machines Corporation
    Inventors: Qing Li, Shan Gu, Shuang Men, Cheng Fang Wang, Li Hua Zhao, Qian Xia Song, Zhan Wei Wang
  • Publication number: 20240181462
    Abstract: The present disclosure provides a PCR plate sealing film with good sealing effect, and relates to the technical field of experimental supplies, wherein the PCR plate sealing film comprises a supporting main plate and soft sealing films; L-shaped expansion rods are fixedly mounted on one end surface of the supporting main plate respectively; lateral-position limiting bars are fixedly mounted at lower ends of the two L-shaped expansion rods; a plurality of sealing bulges are integrally arranged on lower surfaces of the soft sealing films respectively; and the soft sealing films are located below the supporting main plate. The PCR plate sealing film provided by the present disclosure is fixed by a fixing component, to prevent the soft sealing films from moving up and down after being mounted.
    Type: Application
    Filed: November 9, 2021
    Publication date: June 6, 2024
    Inventors: BO TANG, ZIXIAN LIU, GANG LIU, ZIDE LIU, YIYONG YUAN, HUA ZHAO
  • Publication number: 20240182841
    Abstract: The present disclosure provides a highly practical cryovial, which relates to the technical field of the cryovial. The cryovial comprises an inner tube, a transparent outer tube, a limit snap ring, a liquid control mechanism arranged inside the inner tube, a protection mechanism arranged on the transparent outer tube, and a sealed liquid taking mechanism arranged on the inner tube, wherein the liquid control mechanism comprises a push rod and a piston block which is movably connected with the inner tube, first spiral holes of the same size are formed at the corresponding positions of the bottom ends of the inner tube and the transparent outer tube, and the push rod is movably connected with the two first spiral holes respectively.
    Type: Application
    Filed: November 9, 2021
    Publication date: June 6, 2024
    Inventors: ZIXIAN LIU, YIYONG YUAN, SHU YANG, GANG LIU, HUA ZHAO, AIZE SUN
  • Publication number: 20240181460
    Abstract: The present disclosure provides a highly sealed PCR single tube, which relates to the technical field of the PCR single tube. The PCR single tube comprises a sealing tube, wherein the sealing tube is movably placed inside a storage box, four limited posts are fixedly connected on an upper surface of the storage box, a box cover is movably connected at upper ends of the limited posts, and an auxiliary component is fixedly installed inside the box cover. The sealing tube comprises a stud that is movably connected with a screw tube, four movable blocks are movably installed inside a lower side of the screw tube, and a second hose is fixedly connected outside the screw tube. The sealing tube comprises the stud that is movably connected with the screw tube, so that the stud could move up and down through rotation.
    Type: Application
    Filed: November 9, 2021
    Publication date: June 6, 2024
    Inventors: GANG LIU, ZIXIAN LIU, ZIDE LIU, YIYONG YUAN, HUA ZHAO, BO TANG
  • Patent number: D1063295
    Type: Grant
    Filed: September 19, 2024
    Date of Patent: February 25, 2025
    Assignee: SHENZHEN ZHUOCHUANGYU TECHNOLOGY CO., LTD.
    Inventor: Hua Zhao