Abstract: Disclosed are a vibration sensor and an electronic equipment. The vibration sensor includes a circuit board assembly, a shell, a vibration pick-up assembly, a support shell and a chip assembly. The shell is configured to cover a side of the circuit board assembly to form an installation space. The vibration pick-up assembly is provided in the installation space, and is configured to pick up an external bone vibration and generate a response vibration. The support shell is connected to a side of the vibration pick-up assembly away from the circuit board assembly. The chip assembly is connected to a side of the support shell away from the circuit board assembly, and is electrically connected to the circuit board assembly. The vibration pick-up assembly, the support shell and the chip assembly are enclosed to form a conduction cavity.

Abstract: A vibration sensor module including: a substrate, a first casing, a vibration pickup unit, and a sensor unit. The first casing has an open end on the substrate, the first casing and the substrate are enclosed to form a sealing chamber, and the first casing includes a first top plate opposite to the substrate. The vibration pickup unit is arranged in the sealing chamber, the vibration pickup unit includes a second casing with an open end and an elastic vibration pickup member arranged in the second casing, the open end of the second casing is arranged on the substrate or the first top plate, and the second casing is provided with a vibration transmission through hole. The sensor unit includes a sensor chip arranged on an outer surface of the second casing, and a back cavity of the sensor chip corresponds to the vibration transmission through hole.

Abstract: Embodiments of the present disclosure provides an absolute pressure sensing MEMS microphone, a microphone unit and an electronic device. The absolute pressure sensing MEMS microphone includes: a diaphragm; a back electrode plate; a spacer between the diaphragm and the back electrode plate, wherein the diaphragm, the back electrode plate and the spacer form a vacuum cavity, an air pressure in the vacuum cavity is a first air pressure, wherein a gap separating the diaphragm from the back electrode plate by the spacer is a fabrication gap, wherein in a state where the air pressure inside and outside the diaphragm are both the first air pressure, an effective vacuum gap between the diaphragm and the back electrode plate is the first vacuum gap, and wherein the first vacuum gap is larger than the fabrication gap.

Abstract: An integrated structure of a MEMS microphone and an air pressure sensor, and a fabrication method for the integrated structure, the structure including a base substrate; a vibrating membrane, back electrode, upper electrode, and lower electrode formed on the base substrate, as well as a sacrificial layer formed between the vibrating membrane and the back electrode and between the upper electrode and the lower electrode; a first integrated circuit electrically connected to the vibrating membrane and the back electrode respectively; and a second integrated circuit electrically connected to the lower electrode and the upper electrode respectively, wherein a region of the base substrate corresponding to the vibrating membrane is provided with a back cavity; the sacrificial layer between the vibrating membrane and the back electrode is hollowed out to from a vibrating space that communicates with the exterior of the integrated structure, and the sacrificial layer between the upper electrode and the lower electrode

Abstract: Disclosed are a heart rate module and an electronic device for collecting heart rate, the heart rate module includes a substrate, and a first light wave emitting unit, a second light wave emitting unit, a first optical sensor chip, and a second optical sensor chip provided on the substrate; the substrate is also provided thereon with an isolation grating wall separating the first light wave emitting unit, the second light wave emitting unit, the first optical sensor chip, and the second optical sensor chip from each other; the isolation grating wall together with the substrate enclose respectively a first accommodating cavity for accommodating the first light wave emitting unit, a second accommodating cavity for accommodating the second light wave emitting unit, a third accommodating cavity for accommodating the first optical sensor chip, and a fourth accommodating cavity for accommodating the second optical sensor chip.

Abstract: Disclosed are a heart rate sensor and an electronic device for collecting heart rate. The heart rate sensor includes a substrate provided thereon with modules optically isolated from each other, the modules including: a first light wave emitting module, configured to emit a green light wave for testing heart rate; second light wave emitting modules, configured to emit a red light wave and an infrared light wave for testing blood oxygen and the heart rate; a first light wave receiving module and a second light wave receiving module, configured to receive a reflected green light wave, a reflected red light wave and a reflected infrared light wave; wherein, the first light wave receiving module and the second light wave receiving module are located on two respective sides of the first light wave emitting module, and the second light wave emitting modules are provided in two groups.

Abstract: An integrated structure of a MEMS microphone and an air pressure sensor, and a fabrication method for the integrated structure, the structure including a base substrate; a vibrating membrane, back electrode, upper electrode, and lower electrode formed on the base substrate, as well as a sacrificial layer formed between the vibrating membrane and the back electrode and between the upper electrode and the lower electrode; a first integrated circuit electrically connected to the vibrating membrane and the back electrode respectively; and a second integrated circuit electrically connected to the lower electrode and the upper electrode respectively, wherein a region of the base substrate corresponding to the vibrating membrane is provided with a back cavity; the sacrificial layer between the vibrating membrane and the back electrode is hollowed out to from a vibrating space that communicates with the exterior of the integrated structure, and the sacrificial layer between the upper electrode and the lower electrode

Abstract: A Z-axis structure in an accelerometer comprises a mass block (1) moving relative to a substrate (4) in a Z-axis direction in a reciprocating manner. A first movable electrode plate (10) and a second movable electrode plate (11) are disposed on a sidewall of the mass block (1). A first fixed electrode plate (20) and a second fixed electrode plate (30) extending toward a plane consisting of an X axis and a Y axis are also disposed on the sidewall of the mass block (1).

Abstract: Devices, methods, and systems for sensing current are described herein. One device includes a first electrode, a second electrode, and a tunneling magnetoresistance material between the first and second electrodes.

Abstract: Devices and methods for sensing current are described herein. One device (100) includes a base member (102) having a first leg (104, 106) and a second leg (104, 106), the legs (104, 106) defining an angle (108) therebetween, a first magnetic current sensor (110, 112) coupled to the base member (102) and positioned at a first location in a plane bisecting the angle (108), and a second magnetic current sensor (110, 112) coupled to the base member (102) and positioned at a second location in the plane bisecting the angle (108).

Abstract: Devices and methods for sensing current are described herein. One device (100) includes a base member (102) haying a first leg (104, 106) and a second leg (104, 106), the legs (104, 106) defining an angle (108) therebetween, a first magnetic current sensor (110, 112) coupled to the base member (102) and positioned at a first location in a plane bisecting the angle (108), and a second magnetic current sensor (110, 112) coupled to the base member (102) and positioned at a second location in the plane bisecting the angle (108).

Abstract: Devices, methods, and systems for sensing current are described herein. One device includes a first electrode, a second electrode, and a tunneling magnetoresistance material between the first and second electrodes.

Abstract: An energy harvesting system and method. An array of cantilevers with PZT films is electrically connected to an energy harvesting device that converts vibration energy to electrical energy. An AC output signal provided by the cantilevers can be rectified to a DC output, thereby avoiding impairment in total electrical output. The DC output terminals can be connected in parallel and/or in series in order to achieve a higher voltage and/or a higher current that prevents the output from different cantilevers from counteracting one another. The connection circuitry includes one or more rectifying components integrated with one or more micro-cantilevers into a single integrated circuit chip. An oscillograph can be utilized to monitor the DC output voltage signal from an associated testing circuit.

Abstract: An energy harvesting system and method. An array of cantilevers with PZT films is electrically connected to an energy harvesting device that converts vibration energy to electrical energy. An AC output signal provided by the cantilevers can be rectified to a DC output, thereby avoiding impairment in total electrical output. The DC output terminals can be connected in parallel and/or in series in order to achieve a higher voltage and/or a higher current that prevents the output from different cantilevers from counteracting one another. The connection circuitry includes one or more rectifying components integrated with one or more micro-cantilevers into a single integrated circuit chip. An oscillograph can be utilized to monitor the DC output voltage signal from an associated testing circuit.