Abstract: A device for measuring volume of spherical tanks, includes a base, four supporting rods, a driving mechanism, a rotating disc and a counterweight mechanism. The base is provided with a first through hole and a circular fixing base with a second through hole. The supporting rods are circumferentially provided on the fixing base, with a sliding rod slidably provided at the lower side. An outer end of the sliding rod is provided with a limiting plate. The driving mechanism can drive the sliding rods to move simultaneously in radial directions. The rotating disc with a third through hole is arranged on the fixing base, and is rotatably provided with a reel around which a steel tape is wound. A free end of the steel tape is provided with a balancing disc whose opposite sides are provided with laser rangefinders. The counterweight mechanism can keep the balancing disc stable.

Abstract: A gripper sensor device for aligning fine wires. The robotic gripper sensor device including a housing having a probe receiving cavity. A sensor probe is positioned in the probe receiving cavity. An arm of a positioning member includes a wire engagement section for engaging respective fine wires and a probe engagement section for engaging a portion of the sensor probe. As the wire engagement section is moved into cooperation with the wire, force is applied to the arm of the positioning member causing the probe engagement section to move relative to the portion of the probe, causing the probe to convert a stress change of the portion of the probe into a force reading.

Abstract: A fixture assembly for use with fine wire laser soldering. The fixture includes a holding and support fixture and a wire securing and tensioning fixture. The holding and support fixture has a wire holding member and a retention member. The wire holding member and the retention member cooperate with wires prior to the wires being soldered. The wire securing fixture has wire tensioning projections and wire retention members. The wire tensioning projections and wire retention members cooperate with the wires to provide tension to the wire prior to the wires being soldered.

Abstract: Wire-alignment processes and devices are disclosed. A wire-alignment process includes manual loading of a wire-alignment device by positioning and temporary-securing of loading regions of a plurality of wires within an arrangement of grooves of the wire-alignment device. The manual loading of the loading regions produces diverging regions of the plurality of the wires leading to the loading regions and soldering regions oppositely extending from the loading regions. An alignment device includes an arrangement of grooves configured for manual loading of loading regions of wires to produce diverging regions of the wires leading to the loading regions and soldering regions oppositely extending from the loading regions.

Abstract: Laser soldering processes are disclosed. The laser soldering process includes beaming a lower-intensity laser beam from a laser soldering system at a first position, analyzing infrared feedback of the lower-intensity laser beam at the first position, and beaming a higher-intensity laser beam at a second position, the second position corresponding with the infrared feedback of the lower-intensity laser beam. The lower-intensity laser beam generates a lower temperature below a soldering temperature of a solder material and the higher-intensity laser beam generates a higher temperature above the soldering temperature.

Abstract: A fixture assembly for use with fine wire laser soldering. The fixture includes a holding and support fixture and a wire securing and tensioning fixture. The holding and support fixture has a wire holding member and a retention member. The wire holding member and the retention member cooperate with wires prior to the wires being soldered. The wire securing fixture has wire tensioning projections and wire retention members. The wire tensioning projections and wire retention members cooperate with the wires to provide tension to the wire prior to the wires being soldered.

Abstract: A gripper sensor device for aligning fine wires. The robotic gripper sensor device including a housing having a probe receiving cavity. A sensor probe is positioned in the probe receiving cavity. An arm of a positioning member includes a wire engagement section for engaging respective fine wires and a probe engagement section for engaging a portion of the sensor probe. As the wire engagement section is moved into cooperation with the wire, force is applied to the arm of the positioning member causing the probe engagement section to move relative to the portion of the probe, causing the probe to convert a stress change of the portion of the probe into a force reading.