Abstract: Provided is a consumable package assembly including a consumable container and an outer packaging portion. The consumable container includes a chip, and the outer packaging portion includes an accommodating portion for accommodating the consumable container. The outer packaging portion includes a first through hole configured to expose at least a part of the chip, and a second through hole configured to expose at least apart of the accommodating portion so as to position the consumable container. Operation to the chip on the consumable container can be performed without removing the outer packaging portion so as to avoid scrapping of the outer packaging portion, thereby reducing the procedures of the production or the reprocessing and resulting in lower cost and higher efficiency. The second through hole is configured to prevent the unfixed position of the consumable container in the outer packaging portion from resulting inaccurate operation to the chip.

Abstract: The present invention discloses a decentralized open-source software protocol for open-source software and developers globally. The protocol is based on a non-fungible token (NFT) associated with a commit of a source code developed in collaboration, such as an open-source software code. With this protocol, contributors of an open-source software code are incentivized to take on well-specified tasks and then claim their contributions to development in the form of the NFT. A trusted transparency centre (TC) is proposed in the present invention as a core technology to enable trusted software analysis so as to yield the fundamental information and value of a given commit in a repository.

Abstract: Provided is the use of OXCT1 protein as succinyltransferase. It has been found that the OXCT1 protein serving as succinyltransferase can promote the growth of cancer cells by modulating succinylation modification of protein. Therefore, the design of related enzyme inhibitors can inhibit the activity of succinyltransferase, thereby inhibiting the occurrence and progression of cancer, thereby providing a new concept for targeted therapy.

Abstract: A packaging assembly includes an outer packaging unit, at least one to-be-packaged unit, and a loading unit configured to accommodate the at least one to-be-packaged unit to limit movement of the at least one to-be-packaged unit with respect to the loading unit. The outer packaging unit includes a receiving unit capable of receiving at least a part of the loading unit and the at least one to-be-packaged unit which are fit to each other.

Abstract: The present disclosure relates to the technical field of medicines, and particularly relates to an immune preparation, a composition comprising the immune preparation and a use thereof, and a preparation method. an immune adjuvant provided by the present disclosure is an erythrocyte-derived vesicle, and the erythrocyte-derived vesicle has an erythrocyte content and a biofilm structured wrapped outside the erythrocyte content as a whole, and the two are matched with each other, so that the erythrocyte-derived vesicle serves as an endogenous substance of the body to activate an immune system of the body and effectively enhance a cellular immune response. Moreover, in this process, no toxic or side effect is caused to the body, and the method has the advantages of high biocompatibility, safe raw material source and simple preparation process.

Abstract: This application provides a communication apparatus. The communication apparatus includes at least one transmit antenna unit, at least one receive antenna unit, and a signal processing unit. The signal processing unit is configured to: control the at least one transmit antenna unit and the at least one receive antenna unit to communicate with at least one first terminal on a first frequency band; control at least one target transmit antenna unit to send a radar signal on a second frequency band; and control at least one target receive antenna unit to receive a first echo signal on the second frequency band. The at least one transmit antenna unit includes the at least one target transmit antenna unit. The at least one receive antenna unit includes the at least one target receive antenna unit. The first frequency band and the second frequency band do not overlap.

Abstract: Provided is a consumable package assembly including a consumable container and an outer packaging portion. The consumable container includes a chip, and the outer packaging portion includes an accommodating portion for accommodating the consumable container. The outer packaging portion includes a first through hole configured to expose at least a part of the chip, and a second through hole configured to expose at least a part of the accommodating portion so as to position the consumable container. Operation to the chip on the consumable container can be performed without removing the outer packaging portion so as to avoid scrapping of the outer packaging portion, thereby reducing the procedures of the production or the reprocessing and resulting in lower cost and higher efficiency. The second through hole is configured to prevent the unfixed position of the consumable container in the outer packaging portion from resulting inaccurate operation to the chip.

Abstract: A packaging assembly includes an outer packaging unit, at least one to-be-packaged unit, and a loading unit configured to accommodate the at least one to-be-packaged unit to limit movement of the at least one to-be-packaged unit with respect to the loading unit. The outer packaging unit includes a receiving unit capable of receiving at least a part of the loading unit and the at least one to-be-packaged unit which are fit to each other.

Abstract: A chip package device includes a chip, and a first substrate and a second substrate that are disposed opposite to each other, where the chip is disposed on a surface that is of the first substrate and that faces the second substrate. The chip is electrically connected to the first substrate through a first conductive part, the first substrate is electrically connected to the second substrate through a second conductive part, and a heat dissipation passage is formed between the chip and the second substrate through a thermally conductive layer. The chip package device may further include a molding compound that is configured to wrap the chip. The thermally conductive layer disposed between the chip and the second substrate can quickly dissipate a large amount of heat generated by the chip to the second substrate so that the chip maintains a normal temperature.

Abstract: A chip package device includes a chip, and a first substrate and a second substrate that are disposed opposite to each other, where the chip is disposed on a surface that is of the first substrate and that faces the second substrate. The chip is electrically connected to the first substrate through a first conductive part, the first substrate is electrically connected to the second substrate through a second conductive part, and a heat dissipation passage is formed between the chip and the second substrate through a thermally conductive layer. The chip package device may further include a molding compound that is configured to wrap the chip. The thermally conductive layer disposed between the chip and the second substrate can quickly dissipate a large amount of heat generated by the chip to the second substrate so that the chip maintains a normal temperature.

Abstract: Embodiments of the present disclosure relate to a communications apparatus and a wireless communications device. The communications apparatus includes M communications sublinks including M sub antenna arrays divided into at least two rows. Two adjacent sub antenna arrays are arranged in an interleaved manner, or the M sub antenna arrays are arranged on a straight line, and the two adjacent sub antenna arrays share n elements.

Abstract: Embodiments of the present disclosure relate to a communications apparatus and a wireless communications device. The communications apparatus includes M communications sublinks including M sub antenna arrays divided into at least two rows. Two adjacent sub antenna arrays are arranged in an interleaved manner, or the M sub antenna arrays are arranged on a straight line, and the two adjacent sub antenna arrays share n elements.