Abstract: This application provides a communication apparatus. The communication apparatus includes at least one transmit antenna unit, at least one receive antenna unit, and a signal processing unit. The signal processing unit is configured to: control the at least one transmit antenna unit and the at least one receive antenna unit to communicate with at least one first terminal on a first frequency band; control at least one target transmit antenna unit to send a radar signal on a second frequency band; and control at least one target receive antenna unit to receive a first echo signal on the second frequency band. The at least one transmit antenna unit includes the at least one target transmit antenna unit. The at least one receive antenna unit includes the at least one target receive antenna unit. The first frequency band and the second frequency band do not overlap.

Abstract: Provided is a consumable package assembly including a consumable container and an outer packaging portion. The consumable container includes a chip, and the outer packaging portion includes an accommodating portion for accommodating the consumable container. The outer packaging portion includes a first through hole configured to expose at least a part of the chip, and a second through hole configured to expose at least a part of the accommodating portion so as to position the consumable container. Operation to the chip on the consumable container can be performed without removing the outer packaging portion so as to avoid scrapping of the outer packaging portion, thereby reducing the procedures of the production or the reprocessing and resulting in lower cost and higher efficiency. The second through hole is configured to prevent the unfixed position of the consumable container in the outer packaging portion from resulting inaccurate operation to the chip.

Abstract: A packaging assembly includes an outer packaging unit, at least one to-be-packaged unit, and a loading unit configured to accommodate the at least one to-be-packaged unit to limit movement of the at least one to-be-packaged unit with respect to the loading unit. The outer packaging unit includes a receiving unit capable of receiving at least a part of the loading unit and the at least one to-be-packaged unit which are fit to each other.

Abstract: A chip package device includes a chip, and a first substrate and a second substrate that are disposed opposite to each other, where the chip is disposed on a surface that is of the first substrate and that faces the second substrate. The chip is electrically connected to the first substrate through a first conductive part, the first substrate is electrically connected to the second substrate through a second conductive part, and a heat dissipation passage is formed between the chip and the second substrate through a thermally conductive layer. The chip package device may further include a molding compound that is configured to wrap the chip. The thermally conductive layer disposed between the chip and the second substrate can quickly dissipate a large amount of heat generated by the chip to the second substrate so that the chip maintains a normal temperature.

Abstract: A chip package device includes a chip, and a first substrate and a second substrate that are disposed opposite to each other, where the chip is disposed on a surface that is of the first substrate and that faces the second substrate. The chip is electrically connected to the first substrate through a first conductive part, the first substrate is electrically connected to the second substrate through a second conductive part, and a heat dissipation passage is formed between the chip and the second substrate through a thermally conductive layer. The chip package device may further include a molding compound that is configured to wrap the chip. The thermally conductive layer disposed between the chip and the second substrate can quickly dissipate a large amount of heat generated by the chip to the second substrate so that the chip maintains a normal temperature.

Abstract: Embodiments of the present disclosure relate to a communications apparatus and a wireless communications device. The communications apparatus includes M communications sublinks including M sub antenna arrays divided into at least two rows. Two adjacent sub antenna arrays are arranged in an interleaved manner, or the M sub antenna arrays are arranged on a straight line, and the two adjacent sub antenna arrays share n elements.

Abstract: Embodiments of the present disclosure relate to a communications apparatus and a wireless communications device. The communications apparatus includes M communications sublinks including M sub antenna arrays divided into at least two rows. Two adjacent sub antenna arrays are arranged in an interleaved manner, or the M sub antenna arrays are arranged on a straight line, and the two adjacent sub antenna arrays share n elements.