Patents by Inventor Huai-Chih Cheng

Huai-Chih Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Photomask and manufacturing method thereof
    Patent number: 10908494
    Abstract: A method of manufacturing a photomask includes at least the following steps. First, a phase shift layer and a hard mask layer are formed on a light transmitting substrate. A predetermined mask pattern is split into a first pattern and a second pattern. A series of processes is performed so that the hard mask layer and the phase shift layer have the first pattern and the second pattern. The series of processes includes at least the following steps. First, a first exposure process for transferring the first pattern is performed. Thereafter, a second exposure process for transferring the second pattern is performed. The first exposure process and the second exposure process are executed by different machines.
    Type: Grant
    Filed: August 27, 2017
    Date of Patent: February 2, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Ming Lin, Cheng-Hsuen Chiang, Chih-Ming Chen, Huai-Chih Cheng, Hao-Ming Chang, Hsao Shih, Hsin-Yi Yin
  • PHOTOMASK AND MANUFACTURING METHOD THEREOF
    Publication number: 20180348625
    Abstract: A method of manufacturing a photomask includes at least the following steps. First, a phase shift layer and a hard mask layer are formed on a light transmitting substrate. A predetermined mask pattern is split into a first pattern and a second pattern. A series of processes is performed so that the hard mask layer and the phase shift layer have the first pattern and the second pattern. The series of processes includes at least the following steps. First, a first exposure process for transferring the first pattern is performed. Thereafter, a second exposure process for transferring the second pattern is performed. The first exposure process and the second exposure process are executed by different machines.
    Type: Application
    Filed: August 27, 2017
    Publication date: December 6, 2018
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Cheng-Ming Lin, Cheng-Hsuen Chiang, Chih-Ming Chen, Huai-Chih Cheng, Hao-Ming Chang, Hsao Shih, Hsin-Yi Yin