Patents by Inventor Huai-En LAI

Huai-En LAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Refractive index tuning of wafer level package LEDs
    Patent number: 9024341
    Abstract: Two or more molded ellipsoid lenses are formed on a packaged LED die by injecting a glue material into a mold over the LED die and curing the glue material. After curing, the refractive index of the lens in contact with the LED die is greater than the refractive index of the lens not directly contacting the LED die. At least one phosphor material is incorporated into the glue material for at least one of the lenses not directly contacting the LED die. The lens directly contacting the LED die may also include one or more phosphor material. A high refractive index coating may be applied between the LED die and the lens.
    Type: Grant
    Filed: October 27, 2010
    Date of Patent: May 5, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsiao-Wen Lee, Shang-Yu Tsai, Tien-Ming Lin, Chyi Shyuan Chern, Hsin-Hsien Wu, Fu-Wen Liu, Huai-En Lai, Yu-Sheng Tang
  • Light emitting diode optical emitter with transparent electrical connectors
    Patent number: 8889440
    Abstract: An optical emitter includes a Light-Emitting Diode (LED) on a package wafer, transparent insulators, and one or more transparent electrical connectors between the LED die and one or more contact pads on the packaging wafer. The transparent insulators are deposited on the package wafer with LED dies attached using a lithography or a screen printing method. The transparent electrical connectors are deposited using physical vapor deposition, chemical vapor deposition, spin coating, spray coating, or screen printing and may be patterned using a lithography process and etching.
    Type: Grant
    Filed: December 11, 2013
    Date of Patent: November 18, 2014
    Assignee: TSMC Solid State Lighting Ltd.
    Inventors: Yung-Chang Chen, Hsin-Hsien Wu, Ming Shing Lee, Huai-En Lai, Fu-Wen Liu, Andy Wu
  • Light Emitting Diode Optical Emitter with Transparent Electrical Connectors
    Publication number: 20140093990
    Abstract: An optical emitter includes a Light-Emitting Diode (LED) on a package wafer, transparent insulators, and one or more transparent electrical connectors between the LED die and one or more contact pads on the packaging wafer. The transparent insulators are deposited on the package wafer with LED dies attached using a lithography or a screen printing method. The transparent electrical connectors are deposited using physical vapor deposition, chemical vapor deposition, spin coating, spray coating, or screen printing and may be patterned using a lithography process and etching.
    Type: Application
    Filed: December 11, 2013
    Publication date: April 3, 2014
    Applicant: TSMC Solid State Lighting Ltd.
    Inventors: Yung-Chang Chen, Hsin-Hsien Wu, Ming Shing Lee, Huai-En Lai, Fu-Wen Liu, Andy Wu
  • Light emitting diode optical emitter with transparent electrical connectors
    Patent number: 8610161
    Abstract: An optical emitter includes a Light-Emitting Diode (LED) on a package wafer, transparent insulators, and one or more transparent electrical connectors between the LED die and one or more contact pads on the packaging wafer. The transparent insulators are deposited on the package wafer with LED dies attached using a lithography or a screen printing method. The transparent electrical connectors are deposited using physical vapor deposition, chemical vapor deposition, spin coating, spray coating, or screen printing and may be patterned using a lithography process and etching.
    Type: Grant
    Filed: October 5, 2011
    Date of Patent: December 17, 2013
    Assignee: TSMC Solid State Lighting Ltd.
    Inventors: Yung-Chang Chen, Hsin-Hsien Wu, Ming Shing Lee, Huai-En Lai, Fu-Wen Liu, Andy Wu
  • LIGHT EMITTING DIODE OPTICAL EMITTER WITH TRANSPARENT ELECTRICAL CONNECTORS
    Publication number: 20120104450
    Abstract: An optical emitter includes a Light-Emitting Diode (LED) on a package wafer, transparent insulators, and one or more transparent electrical connectors between the LED die and one or more contact pads on the packaging wafer. The transparent insulators are deposited on the package wafer with LED dies attached using a lithography or a screen printing method. The transparent electrical connectors are deposited using physical vapor deposition, chemical vapor deposition, spin coating, spray coating, or screen printing and may be patterned using a lithography process and etching.
    Type: Application
    Filed: October 5, 2011
    Publication date: May 3, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yung-Chang CHEN, Hsin-Hsien WU, Ming Shing LEE, Huai-En LAI, Fu-Wen LIU, Andy WU
  • REFRACTIVE INDEX TUNING OF WAFER LEVEL PACKAGE LEDS
    Publication number: 20120104435
    Abstract: Two or more molded ellipsoid lenses are formed on a packaged LED die by injecting a glue material into a mold over the LED die and curing the glue material. After curing, the refractive index of the lens in contact with the LED die is greater than the refractive index of the lens not directly contacting the LED die. At least one phosphor material is incorporated into the glue material for at least one of the lenses not directly contacting the LED die. The lens directly contacting the LED die may also include one or more phosphor material. A high refractive index coating may be applied between the LED die and the lens.
    Type: Application
    Filed: October 27, 2010
    Publication date: May 3, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsiao-Wen LEE, Shang-Yu TSAI, Tien-Ming LIN, Chyi Shyuan CHERN, Hsin-Hsien WU, Fu-Wen LIU, Huai-En LAI, Yu-Sheng TANG