Abstract: An improved structure of light-receiving diode is disclosed. The light-receiving diode generally comprises: a support frame on which a transimpedance amplifier and a light-receiving chip having a built-in capacitor are located; and a plurality of pins. The light-receiving chip is attached to the support frame via a conducting spacer, and connected to other pins via several bonding wires. The aforesaid components and the top of the pins are packaged by a sealing adhesive. Accordingly, the manufacture process can be simplified and the noise can be reduced.

Abstract: A laser diode is disclosed. The laser diode generally has a support frame having a large-area coupling part and at least two pins on both ends, respectively, wherein one pin is integrally formed with the support frame. A laser diode chip and a photo-diode chip are attached to the large-area coupling part individually, and connected to other pins via two bonding wires, respectively. A transparent adhesive is formed on the photo-diode chip. The aforesaid components are integrated into a unity by a cover that has an opening on the top. Accordingly, the photo-diode chip can receive the laser light for utilizing the light feedback by an external circuit. Besides, the photo-diode chip and the laser diode chip are attached to the support frame directly so the laser diode offers good heat dissipation capability, extended lifetime, and increased reliability.