Abstract: The present invention relates to a multiple-input driving device, which receives at least one electrical power that shows a voltage. The multiple-input driving device uses interaction among a voltage regulation module, a control module, and a conversion module to simultaneously the functions of voltage regulation, input through pushbutton switch, driving a light-emitting diode with regulated power or driving the light-emitting diode with input of pulse width modulated power.

Abstract: According to the method, a trench structure is formed in a substrate. LED arrays and driver ICs are located in the corresponding trenches. An insulating layer is formed over the substrate, the LED arrays and the driver ICs. A photolithography process forms an electrical connection structure between the LED arrays and the driver ICs. Then, a die-cutting process cuts out individual units. These units are fixed in a PCB and an electrical connection structure is formed between these units and input/output pins on the PCB.

Abstract: The present invention provides an LED light source module design featured with efficient heat dissipation. This invention comprises a printed circuit board of thickness less than 400 ?m, installed with an LED array which is composed of multiple high powers, super bright emitter LEDs. The thinner version of the printed circuit provides shorter route for faster thermal conductivity; and thus promotes the efficiency for heat dissipation. With its bendable flexibility, the thinner version of the printed circuit board can accommodate and well affix to the inner side of any shape of lighting fixture rack. This further enhances the heat dissipation for varieties of lighting fixture rack design.

Abstract: The present invention provides a light source module with high efficiency, super bright LEDs featured with efficient heat dissipation. This invention comprises a printed circuit board installed with an LED array which is composed of multiple emitter LEDs. To achieve efficient effect for heat dissipation, there is more than one hole punctured on the printed circuit board right underneath each emitter LED. The surface of each punctured hole is coated with thermal conductive layer such that the accumulative heat generated by the high power LEDs can be effectively dissipated through the conductive layer.

Abstract: According to the method, a trench structure is formed in a substrate. LED arrays and driver ICs are located in the corresponding trenches. An insulating layer is formed over the substrate, the LED arrays and the driver ICs. A photolithography process forms an electrical connection structure between the LED arrays and the driver ICs. Then, a die-cutting process cuts out individual units. These units are fixed in a PCB and an electrical connection structure is formed between these units and input/output pins on the PCB.

Abstract: The present invention relates to a high-power LED array. The high-power LED array has a printed circuit board (PCB), anodes, cathodes, high-power LED dies, packing materials, and lenses. The PCB has cavities arranged in an array. One anode and one cathode are located in each cavity. The anode and the cathode are correspondingly connected to the anode and cathode in the neighboring cavities. At least one high-power LED die is placed in the cavity and connected to the anode and the cathode in series or in parallel. The cavity is filled with packing material to secure the high-power LED die. Lenses are placed on the cavities to focus light emitted by the high-power LED die.

Abstract: The present invention discloses a structure of light-emitting diode (LED) array module, comprising a substrate, a carrier substrate, a chip, a driving circuit chip, and a plurality of metal lines. The carrier substrate is on top of the substrate, and the top surface of the carrier substrate is divided into a first area and a second area. The chip is attached to the first area of the carrier substrate, and further comprising a light-emitting component array and a pad array. The driving circuit chip is attached to the second area of the carrier substrate, and further comprising a pad array and a pad. The metal lines are for electrically connecting the substrate to the driving circuit chip, and the chip to the driving circuit chip, respectively. The present invention can reduce the manufacturing cost, and improve the yield rate.

Abstract: A light emitting element array module includes a board; a silicon base having a first side, a second side opposite to the first side and adhered to the board, a third side having a first angle with the second side, a fourth side substantially in parallel with the first side and having a second angle with the third side, and a fifth side having a third angle with the fourth side; a chip having a first main surface formed with at least one light emitting element array and at least one pad array, and a second main surface adhered to the board; a driving device adhered to the first side of the silicon base; and a plurality of metal wires for connecting the pad array to the driving device.