Abstract: A method of manufacturing common mode filter having heterogeneous laminates, the method includes steps of providing a nonmagnetic insulating substrate; forming a magnetic layer; forming a first lead; forming a first insulating layer; forming a first through hole; forming a first coil; forming a second insulating layer; forming a second coil; forming a third insulating layer; forming a second through hole; forming a second lead; forming a fourth insulating layer; and depositing a first magnetic material.

Abstract: A multifunction semiconductor package structure includes a substrate unit, a circuit unit, a support unit, a semiconductor unit, a package unit and an electrode unit. The substrate unit includes a substrate body and a first electronic element having a plurality of conductive contact portions. The circuit unit includes a plurality of first conductive layers disposed on the substrate body. The semiconductor unit includes a plurality of second electronic elements. Each second electronic element is electrically connected between two corresponding first conductive layers. The package unit includes a package body disposed on the substrate body to enclose the second electronic elements. The electrode unit includes a plurality of top electrodes, a plurality of bottom electrodes, and a plurality of lateral electrodes electrically connected between the top electrodes and the bottom electrodes.

Abstract: A multifunction semiconductor package structure includes a substrate unit, a circuit unit, a support unit, a semiconductor unit, a package unit and an electrode unit. The substrate unit includes a substrate body and a first electronic element having a plurality of conductive contact portions. The circuit unit includes a plurality of first conductive layers disposed on the substrate body. The semiconductor unit includes a plurality of second electronic elements. Each second electronic element is electrically connected between two corresponding first conductive layers. The package unit includes a package body disposed on the substrate body to enclose the second electronic elements. The electrode unit includes a plurality of top electrodes, a plurality of bottom electrodes, and a plurality of lateral electrodes electrically connected between the top electrodes and the bottom electrodes.

Abstract: A common mode filter having heterogeneous laminates includes a first magnetic layer, a nonmagnetic insulating substrate, a second magnetic layer, a first coil layer, and a second coil layer. The second magnetic layer is formed on the nonmagnetic insulating substrate, between the nonmagnetic insulating substrate and the first magnetic layer. The first coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a first coil. The second coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a second coil. The first and second coil layers are separated from each other, and the first and second coils are magnetically coupled to each other.

Abstract: One aspect of the present invention provides a method for preparing a thin film device with an insulation layer from a dry polyimide film and a method for preparing a common mode filter using the same. A method for preparing a thin film device according to this aspect of the present invention includes the steps of forming at least one first conductive pattern on a substrate; placing a dry polyimide film on the first conductive pattern; applying a force to the dry polyimide film such that the dry polyimide film fills spaces in the first conductive pattern; and forming at least one second conductive pattern on the dry polyimide film.

Abstract: A thermally enhanced optical package includes a heat conducting module configured to dissipate the heat generated from an optical device, a plurality of insulating pads disposed on a heat conducting substrate, and at least one electrical conducting pad disposed on the insulating pads. The heat conducting module includes a heat conducting substrate and a plurality of heat conducting pillars, and the optical device is a light emitting diode chip or a light emitting diode die in the present embodiments. The thermally enhanced optical package is further characterized in a simple manufacturing procedure, including substantially an electrical or electroless plating process, a metal foil laminating process, a thick film printing process, and a patterning and etching process.

Abstract: A common mode filter having heterogeneous laminates includes a first magnetic layer, a nonmagnetic insulating substrate, a second magnetic layer, a first coil layer, and a second coil layer. The second magnetic layer is formed on the nonmagnetic insulating substrate, between the nonmagnetic insulating substrate and the first magnetic layer. The first coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a first coil. The second coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a second coil. The first and second coil layers are separated from each other, and the first and second coils are magnetically coupled to each other.

Abstract: A self-organized nanometer interface structure is disclosed. During the reactive sputtering process, the chemical dynamics difference among reactants induces self-organization to form a special nanometer interface structure. The nanometer interface structure naturally form an interface potential difference so that it has a rectifying effect in a particular range of potential variation range. Therefore, it functions like a diode. Such a self-organized nanometer interface structure can be used in the manufacturing of diodes, transistors, light-emitting devices, and sonic devices. The invention has the advantages of a wide variety of material selections, highly compatible processes, easy operations, and low-cost fabrications.

Abstract: A self-organized nanometer interface structure is disclosed. During the reactive sputtering process, the chemical dynamics difference among reactants induces self-organization to form a special nanometer interface structure. The nanometer interface structure naturally form an interface potential difference so that it has a rectifying effect in a particular range of potential variation range. Therefore, it functions like a diode. Such a self-organized nanometer interface structure can be used in the manufacturing of diodes, transistors, light-emitting devices, and sonic devices. The invention has the advantages of a wide variety of material selections, highly compatible processes, easy operations, and low-cost fabrications.

Abstract: This invention provides a concept of using porous materials on ceramic substrate planarization. This planarized substrate consists of a ceramic substrate, a buffer layer, and a nanostructure layer. The ceramic substrate provides structural strength and surface-mount capability. The buffer layer provides the adhesion between the substrate and the nanostructure layer. The nanostructure layer provides the required surface smoothness of the ceramic substrates for performing thin-film processing techniques and enhances adhesion for metallization and electronic materials.

Abstract: This invention provides a concept of using porous materials on ceramic substrate planarization. This planarized substrate comprises a ceramic substrate, a buffer layer, and a nanostructure layer. The ceramic substrate can enhance the structural strength and surface-mount capability. The buffer layer provides the adhesion between a substrate and a nanostructure layer. Nanostructure layer provides the required surface smoothness of the ceramic substrates for performing thin-film processing techniques and enhancing adhesion for metallization and electronic materials. This layer also provides required properties for integrating electronic such as thermal conductivity, electrical insulation, dielectric, etc.