Patents by Inventor Huai-Tze YANG

Huai-Tze YANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10025155
    Abstract: The present disclosure provides a bottom electrode substrate for a segment-type electrophoretic display. The bottom electrode substrate includes a flexible substrate, a first conductive layer, an insulating layer, a second conductive layer and a segment-type electrode. The first conductive layer is disposed on the flexible substrate. The insulating layer covers the first conductive layer and the flexible substrate, wherein the insulating layer has at least one opening exposing a part of the first conductive layer. The second conductive layer is filled in the opening and in contact with the exposed first conductive layer. The segment-type electrode covers the second conductive layer and the insulating layer, and is in contact with the second conductive layer. A method for manufacturing the bottom electrode substrate is also provided herein.
    Type: Grant
    Filed: May 26, 2015
    Date of Patent: July 17, 2018
    Assignee: E Ink Holdings Inc.
    Inventors: Huai-Tze Yang, Wei-Juin Chen, Chien-Chung Huang
  • Publication number: 20160054635
    Abstract: The present disclosure provides a bottom electrode substrate for a segment-type electrophoretic display. The bottom electrode substrate includes a flexible substrate, a first conductive layer, an insulating layer, a second conductive layer and a segment-type electrode. The first conductive layer is disposed on the flexible substrate. The insulating layer covers the first conductive layer and the flexible substrate, wherein the insulating layer has at least one opening exposing a part of the first conductive layer. The second conductive layer is filled in the opening and in contact with the exposed first conductive layer. The segment-type electrode covers the second conductive layer and the insulating layer, and is in contact with the second conductive layer. A method for manufacturing the bottom electrode substrate is also provided herein.
    Type: Application
    Filed: May 26, 2015
    Publication date: February 25, 2016
    Inventors: Huai-Tze YANG, Wei-Juin CHEN, Chien-Chung HUANG