Patents by Inventor Huai-Wen Zhang

Huai-Wen Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die seal ring
    Patent number: 8357988
    Abstract: A die seal ring disposed outside of a die region of a semiconductor substrate is disclosed. The die seal ring includes a first isolation structure, a second isolation structure, and at least one third isolation structure disposed between the first isolation structure and the second isolation structure; a plurality of first regions between the first isolation structure, the second isolation structure and the third isolation structure; a second region under the first region and the third isolation structure; and a third region under the first isolation structure.
    Type: Grant
    Filed: February 6, 2009
    Date of Patent: January 22, 2013
    Assignee: United Microelectronics Corp.
    Inventors: Cheng-Chou Hung, Victor-Chiang Liang, Jui-Meng Jao, Cheng-Hung Li, Sheng-Yi Huang, Tzung-Lin Li, Huai-Wen Zhang, Chih-Yu Tseng
  • DIE SEAL RING
    Publication number: 20100200947
    Abstract: A die seal ring disposed outside of a die region of a semiconductor substrate is disclosed. The die seal ring includes a first isolation structure, a second isolation structure, and at least one third isolation structure disposed between the first isolation structure and the second isolation structure; a plurality of first regions between the first isolation structure, the second isolation structure and the third isolation structure; a second region under the first region and the third isolation structure; and a third region under the first isolation structure.
    Type: Application
    Filed: February 6, 2009
    Publication date: August 12, 2010
    Inventors: Cheng-Chou Hung, Victor-Chiang Liang, Jui-Meng Jao, Cheng-Hung Li, Sheng-Yi Huang, Tzung-Lin Li, Huai-Wen Zhang, Chih-Yu Tseng