Patents by Inventor Huai-Yuan Chu

Huai-Yuan Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240077716
    Abstract: A micromirror assembly comprises a first position-limiting part, a micromirror chip, and a second position-limiting part that are stacked. The micromirror chip includes a fastening frame, a movable part, and a first cantilever, where the movable part is connected to the fastening frame by the first cantilever. The first position-limiting part and the second position-limiting part are separately connected to the fastening frame, the first position-limiting part and the second position-limiting part have a hollow area, and the hollow areas are opposite to the movable part. The first position-limiting part and the second position-limiting part are configured to absorb shock from a collision with the micromirror chip, and a projection of a collision part of the first position-limiting part on the micromirror chip intersects with a central axis of the first cantilever.
    Type: Application
    Filed: November 13, 2023
    Publication date: March 7, 2024
    Inventors: Fei Zhao, Huai Yuan Chu, Jinghui Xu, Jiahao Wu
  • Patent number: 7247247
    Abstract: A selective etching method with lateral protection function is provided. The steps includes: (a) providing a substrate; (b) forming a plurality of tunnels; (c) forming a lateral strengthening structure at a peripheral wall of the tunnels; (d) removing a bottom portion of the lateral strengthening structure, and a part of the substrate by an etching process so as to form a lower structure and expose an unstrengthened structure; and (f) etching the unstrengthened structure laterally so as to form an upper structure.
    Type: Grant
    Filed: May 6, 2004
    Date of Patent: July 24, 2007
    Assignee: Walsin Lihwa Corporation
    Inventors: Jerwei Hsieh, Huai-Yuan Chu, Julius Ming-Lin Tsai, Weileun Fang
  • Patent number: 7088030
    Abstract: A high-aspect-ratio-microstructure (HARM) is provided. The structure includes: a substrate; a lower structure with a comb shape fixedly mounted on said substrate and having first plural comb fingers, wherein each of the first plural comb fingers has a thin slot thereon; an upper structure with a comb shape having second plural comb fingers, wherein the lower structure and the upper structure have a height difference therebetween so as to form an uneven surface; and a lateral strengthening structure formed at vertically peripheral walls of the first plural comb fingers and the second plural comb fingers for protecting the plural first and second comb fingers.
    Type: Grant
    Filed: May 6, 2004
    Date of Patent: August 8, 2006
    Assignee: Walsin Lihwa Corporation
    Inventors: Jerwei Hsieh, Huai-Yuan Chu, Julius Ming-Lin Tsai, Weileun Fang
  • Publication number: 20040232502
    Abstract: A high-aspect-ratio-microstructure (HARM) is provided. The structure includes: a substrate; a lower structure with a comb shape fixedly mounted on said substrate and having first plural comb fingers, wherein each of the first plural comb fingers has a thin slot thereon; an upper structure with a comb shape having second plural comb fingers, wherein the lower structure and the upper structure have a height difference therebetween so as to form an uneven surface; and a lateral strengthening structure formed at vertically peripheral walls of the first plural comb fingers and the second plural comb fingers for protecting the plural first and second comb fingers.
    Type: Application
    Filed: May 6, 2004
    Publication date: November 25, 2004
    Applicant: Walsin Lihwa Corporation
    Inventors: Jerwei Hsieh, Huai-Yuan Chu, Julius Ming-Lin Tsai, Weileun Fang
  • Publication number: 20040232110
    Abstract: A selective etching method with lateral protection function is provided. The steps includes: (a) providing a substrate; (b) forming a plurality of tunnels; (c) forming a lateral strengthening structure at a peripheral wall of the tunnels; (d) removing a bottom portion of the lateral strengthening structure, and a part of the substrate by an etching process so as to form a lower structure and expose an unstrengthened structure; and (f) etching the unstrengthened structure laterally so as to form an upper structure.
    Type: Application
    Filed: May 6, 2004
    Publication date: November 25, 2004
    Applicant: Walsin Lihwa Corporation
    Inventors: Jerwei Hsieh, Huai-Yuan Chu, Julius Ming-Lin Tsai, Weileun Fang