Patents by Inventor Huaiyu Dong

Huaiyu Dong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11940512
    Abstract: Methods and systems are provided for cooling hot spots on a body coil assembly of an MRI system. In one embodiment, an airflow guide of a body coil assembly of an MRI system comprises a first surface that forms an air passage when the airflow guide is positioned on the body coil assembly, the air passage enclosed by the first surface and a second, outer surface of an RF coil of the body coil assembly, the airflow guide configured to channel cool air generated by a fan to the second, outer surface of the RF coil. The airflow guide may be arranged circumferentially around a portion of the RF coil at one or more ends of the RF coil. The airflow guide may be manufactured as a plurality of airflow guide segments that are glued together.
    Type: Grant
    Filed: August 18, 2022
    Date of Patent: March 26, 2024
    Assignee: GE PRECISION HEALTHCARE LLC
    Inventors: Yanchun Zheng, Hong Jiang, Kun Wang, Huaiyu Dong, Hailiang Liu, Saban Kurucay, Jian Cao
  • Publication number: 20240061058
    Abstract: Methods and systems are provided for cooling hot spots on a body coil assembly of an MRI system. In one embodiment, an airflow guide of a body coil assembly of an MRI system comprises a first surface that forms an air passage when the airflow guide is positioned on the body coil assembly, the air passage enclosed by the first surface and a second, outer surface of an RF coil of the body coil assembly, the airflow guide configured to channel cool air generated by a fan to the second, outer surface of the RF coil. The airflow guide may be arranged circumferentially around a portion of the RF coil at one or more ends of the RF coil. The airflow guide may be manufactured as a plurality of airflow guide segments that are glued together.
    Type: Application
    Filed: August 18, 2022
    Publication date: February 22, 2024
    Inventors: Yanchun Zheng, Hong Jiang, Kun Wang, Huaiyu Dong, Hailiang Liu, Saban Kurucay, Jian Cao