Abstract: A sealing process of LED modules, comprising: (1) a waterproof wire goes through a wire-through hole of a heat sink to be connected with a positive-negative solder joints on a PCB board, wherein the positive-negative solder joint and the position that the waterproof wire going through are subjected to glue sealing treatment, and a waterproof sealing process is operated between the waterproof wire and the wire-through hole; (2) fix the PCB board on the heat sink; (3) place one sealing ring into one of the grooves; (4) apply evenly a ring of liquid silica gel along the other groove of the lens set and the amount of the liquid silica gel is limited to completely sticking the solid silica gel sealing ring; (5) the heat sink installed with the PCB board and the waterproof wire as processed in step (2) is inversely buckled on the lens set which is set with the solid silica gel ring and the liquid silica gel as processed in step (4), so as to fix the heat sink entirety and the lens set.

Abstract: An LED lighting device is provided, having a lamp housing and at least one LED module. The lamp housing has a lamp cover and a housing-type heat-dissipating lamp bracket that directly radiates the heat generated by the LED module. The housing-type heat-dissipating lamp bracket is entirely made of heat-dissipating material, and several radiating hole devices are set on the housing-type heat-dissipating lamp bracket. The radiating hole devices on the housing-type heat-dissipating lamp bracket and the gaps between the LED modules form a mutually-reinforcing thermal honeycomb effect, providing a heat dissipation channel with unhindered air convection. Radiating holes are set at the head and tail of the housing-type heat-dissipating lamp bracket. The radiating holes and the gaps between the modules enhance the heat-dissipating effect and enhance air convection, to improve heat dissipation from the lamp housing and provide improved heat dissipation effect for the entire lamp.

Abstract: A sealing process of LED modules, comprising: (1) a waterproof wire goes through a wire-through hole of a heat sink to be connected with a positive-negative solder joints on a PCB board, wherein the positive-negative solder joint and the position that the waterproof wire going through are subjected to glue sealing treatment, and a waterproof sealing process is operated between the waterproof wire and the wire-through hole; (2) fix the PCB board on the heat sink; (3) place one sealing ring into one of the grooves; (4) apply evenly a ring of liquid silica gel along the other groove of the lens set and the amount of the liquid silica gel is limited to completely sticking the solid silica gel sealing ring; (5) the heat sink installed with the PCB board and the waterproof wire as processed in step (2) is inversely buckled on the lens set which is set with the solid silica gel ring and the liquid silica gel as processed in step (4), so as to fix the heat sink entirety and the lens set.

Abstract: A lamp-housing-type heat-sink in an LED lighting device is provided, which is a hollow middle part formed monolithically by extending a high purity aluminum plate with a thickness of 0.5 mm to 5 mm and an aluminum content of above 95%. The heat-sink has a heat-sinking surface and housing body. A surface contact structure is formed between the heat-sinking surface and a circuit board, and several radiating holes are set on the housing body to form heat dissipation channels. A method for manufacturing the lamp-housing-type heat-sink in LED lighting device is also provided. The lamp-housing-type heat-sink uses fewer materials and costs less than conventional die-cast aluminum housing, while providing a higher thermal conductivity co-efficient.

Abstract: A sealing process of LED modules includes a waterproof wire put through a wire-through hole of a heat sink to be connected with a positive-negative solder joints on a PCB board, which are subjected to glue sealing treatment. A waterproof sealing process is operated between the waterproof wire and wire-through hole. The PCB board is fixed on the heat sink. One sealing ring is placed into a groove. A ring of liquid silica gel is evenly applied along the other groove. The heat sink installed with the PCB board and the waterproof wire are inversely buckled on the lens set which is fixed with the solid silica gel ring and liquid silica gel. At least two waterproof sealing rings are used to isolate an LED chip from the outside so as to prevent all water vapor or other harmful gases from corroding the chip and the PCB.

Abstract: A sealing process of LED modules includes a waterproof wire put through a wire-through hole of a heat sink to be connected with a positive-negative solder joints on a PCB board, which are subjected to glue sealing treatment. A waterproof sealing process is operated between the waterproof wire and wire-through hole. The PCB board is fixed on the heat sink. One sealing ring is placed into a groove. A ring of liquid silica gel is evenly applied along the other groove. The heat sink installed with the PCB board and the waterproof wire are inversely buckled on the lens set which is fixed with the solid silica gel ring and liquid silica gel.

Abstract: An LED lighting device is provided, having a lamp housing and at least one LED module. The lamp housing has a lamp cover and a housing-type heat-dissipating lamp bracket that directly radiates the heat generated by the LED module. The housing-type heat-dissipating lamp bracket is entirely made of heat-dissipating material, and several radiating hole devices are set on the housing-type heat-dissipating lamp bracket. The radiating hole devices on the housing-type heat-dissipating lamp bracket and the gaps between the LED modules form a mutually-reinforcing thermal honeycomb effect, providing a heat dissipation channel with unhindered air convection. Radiating holes are set at the head and tail of the housing-type heat-dissipating lamp bracket. The radiating holes and the gaps between the modules enhance the heat-dissipating effect and enhance air convection, to improve heat dissipation from the lamp housing and provide improved heat dissipation effect for the entire lamp.

Abstract: A lamp-housing-type heat-sink in an LED lighting device is provided, which is a hollow middle part formed monolithically by extending a high purity aluminum plate with a thickness of 0.5 mm to 5 mm and an aluminum content of above 95%. The heat-sink has a heat-sinking surface and housing body. A surface contact structure is formed between the heat-sinking surface and a circuit board, and several radiating holes are set on the housing body to form heat dissipation channels. A method for manufacturing the lamp-housing-type heat-sink in LED lighting device is also provided. The lamp-housing-type heat-sink uses fewer materials and costs less than conventional die-cast aluminum housing, while providing a higher thermal conductivity co-efficient.