Patents by Inventor Huan CHE

Huan CHE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220246992
    Abstract: An embodiment of the present application provide an electrode assembly, a battery cell, a battery, and an electrode assembly manufacturing equipment and method. Among that, the electrode assembly includes a negative electrode plate and a positive electrode plate which form a bending region. The positive electrode plate includes bending portions located in the bending region, the bending portion includes a positive electrode current collecting layer and a positive active substance layer, and at least one side surface of the positive electrode current collecting layer is provided with the positive active substance layer in a thickness direction of the positive electrode plate. At least one positive active substance layer is provided with the barrier layer, at least a part of the barrier layer is intercalated in the positive active substance layer provided with the barrier layer, and coats at least a part of particles in the positive active substance layer.
    Type: Application
    Filed: December 29, 2021
    Publication date: August 4, 2022
    Applicant: CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED
    Inventors: Kai WU, Huihui LIU, Zhonghong LI, Long WANG, Tuo ZHENG, Huan CHE
  • Publication number: 20120211096
    Abstract: A check valve includes a case body, a piston device, and a blocking plate. The case body includes a first case part and a second case part. The first case part has a first opening. The second case part has a second opening and a third opening. The second opening faces the first opening, and the third opening is located at one side of the second opening. The first case part and the second case part are combined to form the case body, and the case body has a fluid passage therein. The piston device is aligned to the second opening and mounted on the second case part. The blocking plate is disposed on the piston device. When the piston device operates, the piston device pushes the blocking plate to seal the first opening.
    Type: Application
    Filed: May 23, 2011
    Publication date: August 23, 2012
    Applicant: MAXCHIP ELECTRONICS CORP.
    Inventors: Huan-Che Huang, Kuan-Ting Chen, Chih-Chang Chen
  • Patent number: 7632693
    Abstract: A multidirectional light scattering LED and a manufacturing method thereof are disclosed. A metal oxide is irregular disposed over a second semiconductor layer and then is removed by etching. Part of the second semiconductor layer, part of a light-emitting layer or part of the first semiconductor layer is also removed so as to form a scattering layer. A transparent conductive layer is arranged over the second semiconductor layer while further a second electrode is disposed over the transparent conductive layer. A first electrode is installed on the scattering layer. Thus light output from the LED is scattered in multi-directions.
    Type: Grant
    Filed: April 30, 2008
    Date of Patent: December 15, 2009
    Assignee: Formosa Epitaxy Incorporation
    Inventors: Cheng-Kuo Huang, Shyi-Ming Pan, Yun-Li Li, Huan-Che Tseng, Fen-Ren Chien
  • Patent number: 7476912
    Abstract: A multidirectional light scattering LED and a manufacturing method thereof are disclosed. A metal oxide is irregular disposed over a second semiconductor layer and then is removed by etching. Part of the second semiconductor layer, part of a light-emitting layer or part of the first semiconductor layer is also removed so as to form a scattering layer. A transparent conductive layer is arranged over the second semiconductor layer while further a second electrode is disposed over the transparent conductive layer. A first electrode is installed on the scattering layer. Thus light output from the LED is scattered in multi-directions.
    Type: Grant
    Filed: April 24, 2006
    Date of Patent: January 13, 2009
    Assignee: Formosa Epitaxy Incorporation
    Inventors: Cheng-Kuo Huang, Shyi-Ming Pan, Yun-Li Li, Huan-Che Tseng, Fen-Ren Chien
  • Publication number: 20080241979
    Abstract: A multidirectional light scattering LED and a manufacturing method thereof are disclosed. A metal oxide is irregular disposed over a second semiconductor layer and then is removed by etching. Part of the second semiconductor layer, part of a light-emitting layer or part of the first semiconductor layer is also removed so as to form a scattering layer. A transparent conductive layer is arranged over the second semiconductor layer while further a second electrode is disposed over the transparent conductive layer. A first electrode is installed on the scattering layer. Thus light output from the LED is scattered in multi-directions.
    Type: Application
    Filed: April 30, 2008
    Publication date: October 2, 2008
    Inventors: Cheng-Kuo Huang, Shyi-Ming Pan, Yun-Li Li, Huan-Che Tseng, Fen-Ren Chien
  • Publication number: 20080121907
    Abstract: An LED includes a substrate, a first type doping semiconductor layer, a first electrode, a light emitting layer, a second type doping semiconductor layer, a second electrode, a first dielectric layer and a first conductive plug. The first type doping semiconductor layer is formed on the substrate, and the light emitting layer, the second type doping semiconductor layer and the second electrode are formed on a portion of the first type doping semiconductor layer in sequence. The first dielectric layer is formed on another portion of the first type doping semiconductor layer where is not covered by the light emitting layer. The first electrode formed on the first dielectric layer is electrically connected with the first type doping semiconductor layer through the first conductive plug formed in the first dielectric layer. Furthermore, the second electrode is electrically connected with the second type doping semiconductor layer.
    Type: Application
    Filed: August 8, 2006
    Publication date: May 29, 2008
    Inventors: Way-Jze Wen, Yi-Fong Lin, Huan-Che Tseng, Shyi-Ming Pan, Fen-Ren Chien, Kuo-Ruei Huang, Wen-Joe Song
  • Publication number: 20070272930
    Abstract: A light-emitting diode package (LED package) includes a LED and a carrier. The LED includes a substrate, a semiconductor layer, a first electrode and a second electrode. The semiconductor layer is located on a surface of the substrate and has a rough surface. The semiconductor layer includes a first-type doped semiconductor layer, a second-type doped semiconductor layer and a light-emitting layer disposed between the two doped semiconductor layers. The first electrode and the second electrode are disposed on and electrically coupled the first-type doped semiconductor layer and the second-type doped semiconductor layer, respectively. The carrier has a rough carrying surface and includes a first contact pad and a second contact pad disposed on the rough carrying surface. The first electrode and the second electrode of the LED face the carrier and are electrically coupled to the first contact pad and a second contact pad, respectively.
    Type: Application
    Filed: May 26, 2006
    Publication date: November 29, 2007
    Inventors: Huan-Che Tseng, Way-Jze Wen, Shyi-Ming Pan
  • Publication number: 20070246711
    Abstract: A multidirectional light scattering LED and a manufacturing method thereof are disclosed. A metal oxide is irregular disposed over a second semiconductor layer and then is removed by etching. Part of the second semiconductor layer, part of a light-emitting layer or part of the first semiconductor layer is also removed so as to form a scattering layer. A transparent conductive layer is arranged over the second semiconductor layer while further a second electrode is disposed over the transparent conductive layer. A first electrode is installed on the scattering layer. Thus light output from the LED is scattered in multi-directions.
    Type: Application
    Filed: April 24, 2006
    Publication date: October 25, 2007
    Inventors: Cheng-Kuo Huang, Shyi-Ming Pan, Yun-Li Li, Huan-Che Tseng, Fen-Ren Chien
  • Publication number: 20070176182
    Abstract: A structure for integrating LED circuit onto a heat-dissipation substrate is disclosed. At least an electronic component and a LED chip are integrated on a heat-dissipation substrate. The electronic component can be a passive component, a drive chip, an electrostatic discharge protection device, or a sensing component. Therefore, both wire-bonding area of the LED chip and the series resistance of wires are reduced while the heat dissipation efficiency is enhanced.
    Type: Application
    Filed: January 27, 2006
    Publication date: August 2, 2007
    Inventors: Way-Jze Wen, Yi-Fong Lin, Shyi-Ming Pan, Chih-Wei Chiang, Yin-Cheng Chu, Huan-Che Tseng, Fen-Ren Chien